JPS6454023A - Epoxy resin composition for molding high-voltage coil - Google Patents

Epoxy resin composition for molding high-voltage coil

Info

Publication number
JPS6454023A
JPS6454023A JP21156187A JP21156187A JPS6454023A JP S6454023 A JPS6454023 A JP S6454023A JP 21156187 A JP21156187 A JP 21156187A JP 21156187 A JP21156187 A JP 21156187A JP S6454023 A JPS6454023 A JP S6454023A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
desirable
acid anhydride
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21156187A
Other languages
Japanese (ja)
Inventor
Emiko Yoshioka
Katsuhiko Yasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP21156187A priority Critical patent/JPS6454023A/en
Publication of JPS6454023A publication Critical patent/JPS6454023A/en
Pending legal-status Critical Current

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  • Epoxy Resins (AREA)

Abstract

PURPOSE:To obtain the title resin composition excellent in cracking resistance and workability and free of loss of heat resistance, by mixing an epoxy resin with a specified polycarboxylic acid anhydride and a filler. CONSTITUTION:A resin composition comprises an epoxy resin, a polycarboxylic acid anhydride of the formula (wherein m and n are each 2-20) and 5-50pts.wt. filler per 100pts.wt. liquid acid anhydride. As the epoxy resin, one which is liquid at room temperature is desirable. As a cure accelerator, benzyldimethylamine, 2-ethyl-4-methylimidazole or the like which can give a mixture of good stability and has good solubility in an epoxy resin is used. It is desirable that part of the filler used is talc mainly comprising hydrated magnesium silicate which is a flaky powder. As the talc, one free of impurities such as Al2O3, Fe2O3 and CaO is desirable.
JP21156187A 1987-08-26 1987-08-26 Epoxy resin composition for molding high-voltage coil Pending JPS6454023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21156187A JPS6454023A (en) 1987-08-26 1987-08-26 Epoxy resin composition for molding high-voltage coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21156187A JPS6454023A (en) 1987-08-26 1987-08-26 Epoxy resin composition for molding high-voltage coil

Publications (1)

Publication Number Publication Date
JPS6454023A true JPS6454023A (en) 1989-03-01

Family

ID=16607834

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21156187A Pending JPS6454023A (en) 1987-08-26 1987-08-26 Epoxy resin composition for molding high-voltage coil

Country Status (1)

Country Link
JP (1) JPS6454023A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556761A (en) * 1991-09-02 1993-03-09 Jiro Ishikawa Production of healthy food

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556761A (en) * 1991-09-02 1993-03-09 Jiro Ishikawa Production of healthy food

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