JPS645172A - Image sensor - Google Patents
Image sensorInfo
- Publication number
- JPS645172A JPS645172A JP62160506A JP16050687A JPS645172A JP S645172 A JPS645172 A JP S645172A JP 62160506 A JP62160506 A JP 62160506A JP 16050687 A JP16050687 A JP 16050687A JP S645172 A JPS645172 A JP S645172A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- driving
- lead
- image sensor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 abstract 3
- 230000006378 damage Effects 0.000 abstract 2
- 230000005611 electricity Effects 0.000 abstract 1
- 238000007689 inspection Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62160506A JP2569053B2 (ja) | 1987-06-26 | 1987-06-26 | イメ−ジセンサ |
US08/393,884 US5672902A (en) | 1987-06-26 | 1995-02-22 | Image sensor |
US08/845,401 US5834822A (en) | 1987-06-26 | 1997-04-25 | Image sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62160506A JP2569053B2 (ja) | 1987-06-26 | 1987-06-26 | イメ−ジセンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS645172A true JPS645172A (en) | 1989-01-10 |
JP2569053B2 JP2569053B2 (ja) | 1997-01-08 |
Family
ID=15716419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62160506A Expired - Lifetime JP2569053B2 (ja) | 1987-06-26 | 1987-06-26 | イメ−ジセンサ |
Country Status (2)
Country | Link |
---|---|
US (2) | US5672902A (ja) |
JP (1) | JP2569053B2 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04146719A (ja) * | 1990-10-09 | 1992-05-20 | Toshiba Corp | 電子内視鏡装置 |
JP2009302092A (ja) * | 2008-06-10 | 2009-12-24 | Epson Imaging Devices Corp | 固体撮像装置 |
WO2012026457A1 (ja) * | 2010-08-27 | 2012-03-01 | 株式会社ニコン | 撮像装置 |
JP2012049889A (ja) * | 2010-08-27 | 2012-03-08 | Nikon Corp | 撮像装置 |
JP2012049384A (ja) * | 2010-08-27 | 2012-03-08 | Nikon Corp | 撮像装置 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10248034A (ja) | 1997-03-03 | 1998-09-14 | Nissan Motor Co Ltd | イメージセンサ |
US6215164B1 (en) * | 1999-07-26 | 2001-04-10 | Agilent Technologies, Inc. | Elevated image sensor array which includes isolation between uniquely shaped image sensors |
US6483030B1 (en) * | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Snap lid image sensor package |
US6483101B1 (en) | 1999-12-08 | 2002-11-19 | Amkor Technology, Inc. | Molded image sensor package having lens holder |
US7059040B1 (en) | 2001-01-16 | 2006-06-13 | Amkor Technology, Inc. | Optical module with lens integral holder fabrication method |
KR100401020B1 (ko) | 2001-03-09 | 2003-10-08 | 앰코 테크놀로지 코리아 주식회사 | 반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지 |
US7146106B2 (en) * | 2002-08-23 | 2006-12-05 | Amkor Technology, Inc. | Optic semiconductor module and manufacturing method |
US7122787B2 (en) * | 2003-05-09 | 2006-10-17 | Matsushita Electric Industrial Co., Ltd. | Imaging apparatus with three dimensional circuit board |
JP3888990B2 (ja) * | 2003-10-22 | 2007-03-07 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | コネクタおよび放射線断層撮影装置 |
US20060261458A1 (en) * | 2003-11-12 | 2006-11-23 | Amkor Technology, Inc. | Semiconductor package and manufacturing method thereof |
JP4495512B2 (ja) | 2004-05-11 | 2010-07-07 | パナソニック株式会社 | 固体撮像装置 |
US7359579B1 (en) | 2004-10-08 | 2008-04-15 | Amkor Technology, Inc. | Image sensor package and its manufacturing method |
US20070210246A1 (en) * | 2005-04-14 | 2007-09-13 | Amkor Technology, Inc. | Stacked image sensor optical module and fabrication method |
US7227236B1 (en) | 2005-04-26 | 2007-06-05 | Amkor Technology, Inc. | Image sensor package and its manufacturing method |
US20070272827A1 (en) * | 2005-04-27 | 2007-11-29 | Amkor Technology, Inc. | Image sensor package having mount holder attached to image sensor die |
US7576401B1 (en) | 2005-07-07 | 2009-08-18 | Amkor Technology, Inc. | Direct glass attached on die optical module |
US20080237824A1 (en) * | 2006-02-17 | 2008-10-02 | Amkor Technology, Inc. | Stacked electronic component package having single-sided film spacer |
US7675180B1 (en) | 2006-02-17 | 2010-03-09 | Amkor Technology, Inc. | Stacked electronic component package having film-on-wire spacer |
US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
JP5671890B2 (ja) * | 2010-08-31 | 2015-02-18 | 株式会社ニコン | 撮像装置 |
JP7316034B2 (ja) * | 2018-11-14 | 2023-07-27 | ローム株式会社 | ドライバ回路 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60212075A (ja) * | 1984-04-06 | 1985-10-24 | Canon Inc | 撮像素子構体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1209271A (en) * | 1967-02-27 | 1970-10-21 | Hitachi Ltd | Improvements in semiconductor devices |
US4438449A (en) * | 1967-03-03 | 1984-03-20 | Hitachi, Ltd. | Field effect semiconductor device having a protective diode with reduced internal resistance |
US4393464A (en) * | 1980-12-12 | 1983-07-12 | Ncr Corporation | Chip topography for integrated circuit communication controller |
US4862237A (en) * | 1983-01-10 | 1989-08-29 | Seiko Epson Corporation | Solid state image sensor |
JPS6068721A (ja) * | 1983-09-22 | 1985-04-19 | Fujitsu Ltd | Ecl回路 |
GB2163289B (en) * | 1984-07-19 | 1988-06-22 | Canon Kk | Long size image sensor unit and photosensors for use in this sensor unit and a method of manufacturing the photosensors |
JPS6182466A (ja) * | 1984-09-29 | 1986-04-26 | Toshiba Corp | 光センサ |
US4803536A (en) * | 1986-10-24 | 1989-02-07 | Xerox Corporation | Electrostatic discharge protection network for large area transducer arrays |
JPS63131560A (ja) * | 1986-11-17 | 1988-06-03 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | チップ接続構造体 |
US4819047A (en) * | 1987-05-15 | 1989-04-04 | Advanced Micro Devices, Inc. | Protection system for CMOS integrated circuits |
US4866291A (en) * | 1987-06-30 | 1989-09-12 | Canon Kabushiki Kaisha | Photosensor with charge storage unit and switch unit formed on a single-crystal semiconductor film |
-
1987
- 1987-06-26 JP JP62160506A patent/JP2569053B2/ja not_active Expired - Lifetime
-
1995
- 1995-02-22 US US08/393,884 patent/US5672902A/en not_active Expired - Lifetime
-
1997
- 1997-04-25 US US08/845,401 patent/US5834822A/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60212075A (ja) * | 1984-04-06 | 1985-10-24 | Canon Inc | 撮像素子構体 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04146719A (ja) * | 1990-10-09 | 1992-05-20 | Toshiba Corp | 電子内視鏡装置 |
JP2009302092A (ja) * | 2008-06-10 | 2009-12-24 | Epson Imaging Devices Corp | 固体撮像装置 |
WO2012026457A1 (ja) * | 2010-08-27 | 2012-03-01 | 株式会社ニコン | 撮像装置 |
JP2012049889A (ja) * | 2010-08-27 | 2012-03-08 | Nikon Corp | 撮像装置 |
JP2012049384A (ja) * | 2010-08-27 | 2012-03-08 | Nikon Corp | 撮像装置 |
CN103038884A (zh) * | 2010-08-27 | 2013-04-10 | 株式会社尼康 | 拍摄装置 |
US9224779B2 (en) | 2010-08-27 | 2015-12-29 | Nikon Corporation | Imaging apparatus with sensor chip and separate signal processing chips |
Also Published As
Publication number | Publication date |
---|---|
US5672902A (en) | 1997-09-30 |
JP2569053B2 (ja) | 1997-01-08 |
US5834822A (en) | 1998-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071003 Year of fee payment: 11 |