JPS6451640A - Electrode arrangement of chip carrier ic substrate - Google Patents

Electrode arrangement of chip carrier ic substrate

Info

Publication number
JPS6451640A
JPS6451640A JP20952287A JP20952287A JPS6451640A JP S6451640 A JPS6451640 A JP S6451640A JP 20952287 A JP20952287 A JP 20952287A JP 20952287 A JP20952287 A JP 20952287A JP S6451640 A JPS6451640 A JP S6451640A
Authority
JP
Japan
Prior art keywords
substrate
chip carrier
electrodes
electrode arrangement
row
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20952287A
Other languages
Japanese (ja)
Inventor
Makoto Kano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shiojiri Kogyo KK
Original Assignee
Shiojiri Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shiojiri Kogyo KK filed Critical Shiojiri Kogyo KK
Priority to JP20952287A priority Critical patent/JPS6451640A/en
Publication of JPS6451640A publication Critical patent/JPS6451640A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Abstract

PURPOSE:To facilitate mounting to a mounting substrate having a limited area by arranging external leading-out electrodes for a chip carrier IC substrate on one side in a row. CONSTITUTION:The arrangement of electrodes 2 on a chip carrier IC substrate 1 is concentrated to one side, and the electrodes 2 are disposed in a row, and are not arranged on other three sides. The chip carrier IC substrate 1 is disposed in an array in the vertical direction onto a mounting substrate 4, and the electrodes 2 and conductive sections 5 are abutted and mounted.
JP20952287A 1987-08-24 1987-08-24 Electrode arrangement of chip carrier ic substrate Pending JPS6451640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20952287A JPS6451640A (en) 1987-08-24 1987-08-24 Electrode arrangement of chip carrier ic substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20952287A JPS6451640A (en) 1987-08-24 1987-08-24 Electrode arrangement of chip carrier ic substrate

Publications (1)

Publication Number Publication Date
JPS6451640A true JPS6451640A (en) 1989-02-27

Family

ID=16574186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20952287A Pending JPS6451640A (en) 1987-08-24 1987-08-24 Electrode arrangement of chip carrier ic substrate

Country Status (1)

Country Link
JP (1) JPS6451640A (en)

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