JPS645014A - Manufacturing equipment for semiconductor - Google Patents
Manufacturing equipment for semiconductorInfo
- Publication number
- JPS645014A JPS645014A JP16166887A JP16166887A JPS645014A JP S645014 A JPS645014 A JP S645014A JP 16166887 A JP16166887 A JP 16166887A JP 16166887 A JP16166887 A JP 16166887A JP S645014 A JPS645014 A JP S645014A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor substrate
- heat transfer
- tray
- transfer medium
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To make the heat absorption efficiency of a semiconductor substrate uniform, and control precisely the temperature, by providing a heat transfer medium tray to heat a semiconductor substrate being a body to be heated by utilizing thermal conduction, and controlling the temperature of the heat transfer medium tray by a temperature measuring means. CONSTITUTION:On a quartz tray 9, a heat transfer medium tray 10 is mounted, and thereon a semiconductor substrate 8 is mounted. These are inserted into a quartz tube 2 from a substrate inserting port 1a. After the substrate inserting port 1a is closed by a reaction tube door 4, and the inside of the quartz tube 2 is replaced with nitrogen gas, halogen lamps as a heating source are turned on. The upper surface side of the semiconductor substrate 8 and the heat transfer tray 10 are heated by the upper and the lower lamps 3, and the lower surface side of the semiconductor substrate 8 is heated by the effect of thermal conduction of the heat transfer medium tray 10. Thereby, the uniform heat absorption characteristics of the semiconductor substrate 8 can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16166887A JPS645014A (en) | 1987-06-29 | 1987-06-29 | Manufacturing equipment for semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16166887A JPS645014A (en) | 1987-06-29 | 1987-06-29 | Manufacturing equipment for semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS645014A true JPS645014A (en) | 1989-01-10 |
Family
ID=15739567
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16166887A Pending JPS645014A (en) | 1987-06-29 | 1987-06-29 | Manufacturing equipment for semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS645014A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5446824A (en) * | 1991-10-11 | 1995-08-29 | Texas Instruments | Lamp-heated chuck for uniform wafer processing |
-
1987
- 1987-06-29 JP JP16166887A patent/JPS645014A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5446824A (en) * | 1991-10-11 | 1995-08-29 | Texas Instruments | Lamp-heated chuck for uniform wafer processing |
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