JPS6449248A - Chip diode - Google Patents

Chip diode

Info

Publication number
JPS6449248A
JPS6449248A JP20687187A JP20687187A JPS6449248A JP S6449248 A JPS6449248 A JP S6449248A JP 20687187 A JP20687187 A JP 20687187A JP 20687187 A JP20687187 A JP 20687187A JP S6449248 A JPS6449248 A JP S6449248A
Authority
JP
Japan
Prior art keywords
jumet
expanded
wire
jumet wire
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20687187A
Other languages
Japanese (ja)
Inventor
Mitsutoshi Hibino
Akihisa Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP20687187A priority Critical patent/JPS6449248A/en
Publication of JPS6449248A publication Critical patent/JPS6449248A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce a thermal resistance and facilitate higher output performance by a method wherein the circumference of one of jumet wires is expanded while one side or a part of an arc of its region soldered to the other jumet wire is kept in the same plane as the other jumet wire. CONSTITUTION:The circumference of a jumet wire 1a is expanded to left, right and upper directions while only one side of its region soldered to the other jumet wire 1 is kept in the same plane as the other jumet wire 1. As the soldered area between the jumet wire 1a and the conductor on a printed board is expanded, the thermal resistance from a semiconductor element 3 to the printed board can be reduced. Moreover, only one (1a) of the jumet wires is expanded, a parallel capacitance which causes a problem in a radio frequency range is not increased. With this constitution, the higher output performance can be realized.
JP20687187A 1987-08-19 1987-08-19 Chip diode Pending JPS6449248A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20687187A JPS6449248A (en) 1987-08-19 1987-08-19 Chip diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20687187A JPS6449248A (en) 1987-08-19 1987-08-19 Chip diode

Publications (1)

Publication Number Publication Date
JPS6449248A true JPS6449248A (en) 1989-02-23

Family

ID=16530419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20687187A Pending JPS6449248A (en) 1987-08-19 1987-08-19 Chip diode

Country Status (1)

Country Link
JP (1) JPS6449248A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600026A (en) * 1992-05-27 1997-02-04 Sumitomo Chemical Company, Limited Process for production of cresols

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600026A (en) * 1992-05-27 1997-02-04 Sumitomo Chemical Company, Limited Process for production of cresols

Similar Documents

Publication Publication Date Title
JPS6410685A (en) Dual-in-line-package-type semiconductor laser module
KR900019207A (en) Resin Sealed Semiconductor Device
ATE65346T1 (en) PLATED CONTACT ELEMENT.
JPS6437032A (en) Bendable lead frame assembly of integrated circuit and integrated circuit package
EP0214307A4 (en) Semiconducteur circuit device.
EP0221496A3 (en) Integrated circuit package
JPS6449248A (en) Chip diode
KR950004512A (en) Semiconductor device and manufacturing method
JPS5789331A (en) Tuner device
JPS6474795A (en) Method of mounting semiconductor device
JPS5623768A (en) Semiconductor device
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS56116646A (en) Semiconductor device
KR880000314Y1 (en) Terminal for high power transistor
JP2819742B2 (en) Hybrid integrated circuit device
JPS5619661A (en) Rectifier with voltage regualtor for use on automobile
JPS6450450A (en) Package for semiconductor integrated circuit
JPS5687350A (en) Semiconductor device
JPS5732660A (en) Semiconductor device
JPS64755A (en) Integrated circuit
JPS6490585A (en) Semiconductor device
JPS6444092A (en) Wiring substrate
JPS5685844A (en) Diode composite circuit device
JPS6412541A (en) Semiconductor element
JPS57121239A (en) Semiconductor device