JPS6447056A - Glass terminal package - Google Patents
Glass terminal packageInfo
- Publication number
- JPS6447056A JPS6447056A JP20356987A JP20356987A JPS6447056A JP S6447056 A JPS6447056 A JP S6447056A JP 20356987 A JP20356987 A JP 20356987A JP 20356987 A JP20356987 A JP 20356987A JP S6447056 A JPS6447056 A JP S6447056A
- Authority
- JP
- Japan
- Prior art keywords
- glass terminal
- side plate
- glass
- package
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
PURPOSE:To provide a glass terminal package that glass is hard to be broken for high frequency at a low cost by a method wherein a side plate section, which a glass terminal is incorporated in, is formed of a metal material which has almost the same expansion coefficient as glass and a side wall and a base section other than the side plate section are made of a metal which is excellent in thermal conductivity and capable of being pressed, cut, and worked. CONSTITUTION:A side plate section 13 where a glass terminal 12 is incorporated is formed of a metal 14 small in thermal expansion coefficient almost the same as the glass terminal and a side wall section 15 and a base section 16 other than the side plate section 13 are formed of a metallic material 17 large in thermal expansion coefficient as compared with the material 14. As only the side plate section 13 where the glass terminal is incorporated is formed of the metallic material 14 almost equal to the glass terminal in thermal expasivity, the glass terminal is prevented from stress even if the package increased in temperature, so that the glass terminal package can be made to be that the glass terminal is hard to be broken. And, as the side wall section and the base section other than the side plate section are formed of a metal which is excellent in thermal conductivity and capable of being pressed, cut, and worked, the package can be easily formed at a low cost even if it is complicate in shape, and thus the package can be obtained which is excellent in a heat dissipating property.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20356987A JPS6447056A (en) | 1987-08-18 | 1987-08-18 | Glass terminal package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20356987A JPS6447056A (en) | 1987-08-18 | 1987-08-18 | Glass terminal package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6447056A true JPS6447056A (en) | 1989-02-21 |
Family
ID=16476297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20356987A Pending JPS6447056A (en) | 1987-08-18 | 1987-08-18 | Glass terminal package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6447056A (en) |
-
1987
- 1987-08-18 JP JP20356987A patent/JPS6447056A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0132849A3 (en) | Clad metal lead frame substrates | |
JPS6446583A (en) | Heat exchanger and manufacture thereof | |
CA2264422A1 (en) | Molded part made of an electrically conductive ceramic and process for the production of contact zones on such molded parts | |
WO2003079435A3 (en) | Microwave monolithic integrated circuit assembly with multi-orientation pyrolytic graphite heat-dissipating assembly | |
ATE45241T1 (en) | GLASS DIELECTRIC FOR ELECTRICAL INSULATOR. | |
ATE56468T1 (en) | HEAT SINK. | |
JPS57188680A (en) | Target for sputtering and production thereof | |
JPS6447056A (en) | Glass terminal package | |
JPS5512728A (en) | Regin sealing type power transistor | |
GB1494493A (en) | Lamp-holder with heat-sink | |
JPS57196552A (en) | Radiator | |
AU1487588A (en) | Low expansion copper alloys with high thermal conductivity | |
EP0264121A3 (en) | Aluminum enamel board | |
JPS5614069A (en) | Soldering method and soldering material | |
JPS5621876A (en) | Thermal head and its manufacturing method | |
JPS5626661A (en) | Molten metal cooling mold of less electromagnetic force transmission loss | |
JPS5777045A (en) | Glass containing phosphate | |
FR2382642A1 (en) | Synthetic material thermal insulation cladding - comprises highly reflective sheets assembled alternately with spacing material and filled with gas | |
JPS55140255A (en) | Heat sink structure | |
JPS5288851A (en) | Insulating material for high temperature and its manufacturing method | |
JPS5389661A (en) | Semiconductor devcice | |
ATE24351T1 (en) | HEAT-INSULATING LINING PANEL FOR HIGH TEMPERATURES. | |
SU688453A1 (en) | Glass | |
JPS53138677A (en) | Vapor cooling type semiconductor device | |
JPS5752154A (en) | Cooler for semiconductor |