JPS6446905A - Chip component and manufacture thereof - Google Patents

Chip component and manufacture thereof

Info

Publication number
JPS6446905A
JPS6446905A JP62202755A JP20275587A JPS6446905A JP S6446905 A JPS6446905 A JP S6446905A JP 62202755 A JP62202755 A JP 62202755A JP 20275587 A JP20275587 A JP 20275587A JP S6446905 A JPS6446905 A JP S6446905A
Authority
JP
Japan
Prior art keywords
board material
slits
substrate
board
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62202755A
Other languages
Japanese (ja)
Inventor
Yasunobu Oikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP62202755A priority Critical patent/JPS6446905A/en
Publication of JPS6446905A publication Critical patent/JPS6446905A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

PURPOSE:To divide a board material accurately into each unit substrate by each notching slits, through which the board material is divided into unit substrates, while being parted into each board surface in the surface and the rear in the longitudinal direction and the cross direction. CONSTITUTION:A board material 10 such as a ceramic substrate, a dielectric substrate, a glass substrate, etc., is used, and chip parts are manufactured by employing a substrate aggregate in which slits 11, 12 are formed respectively in the longitudinal direction and the cross direction through grooving at the time of green, laser scribing or the like to the board surface of the board material. The slits 11, 12 are formed respectively on the front and rear surfaces of the board material 10 in the longitudinal direction and the cross direction, and a plurality of the slits are formed at regular intervals in parallel respectively in each direction. When a pushing force is applied when the board material is divided into aggregates in a row at that time, load concentrates only on the slits shaped on one of the front or the rear surface. Accordingly, the board material can be divided precisely at every aggregate in a row while being also parted into separate substrate simply.
JP62202755A 1987-08-14 1987-08-14 Chip component and manufacture thereof Pending JPS6446905A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62202755A JPS6446905A (en) 1987-08-14 1987-08-14 Chip component and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62202755A JPS6446905A (en) 1987-08-14 1987-08-14 Chip component and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6446905A true JPS6446905A (en) 1989-02-21

Family

ID=16462630

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62202755A Pending JPS6446905A (en) 1987-08-14 1987-08-14 Chip component and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6446905A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198460A (en) * 1992-01-21 1993-08-06 Tdk Corp Manufacture of surface mount part
EP2506560A2 (en) 2011-03-31 2012-10-03 Casio Computer Co., Ltd. Image Processing Apparatus, Image Processing Method, and Storage Medium
EP2506552A1 (en) 2011-03-31 2012-10-03 Casio Computer Co., Ltd. Image processing apparatus, image processing method, and storage medium
JP2017112326A (en) * 2015-12-18 2017-06-22 Koa株式会社 Method for manufacturing chip resistor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198460A (en) * 1992-01-21 1993-08-06 Tdk Corp Manufacture of surface mount part
EP2506560A2 (en) 2011-03-31 2012-10-03 Casio Computer Co., Ltd. Image Processing Apparatus, Image Processing Method, and Storage Medium
EP2506552A1 (en) 2011-03-31 2012-10-03 Casio Computer Co., Ltd. Image processing apparatus, image processing method, and storage medium
JP2017112326A (en) * 2015-12-18 2017-06-22 Koa株式会社 Method for manufacturing chip resistor

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