JPS6446862U - - Google Patents
Info
- Publication number
- JPS6446862U JPS6446862U JP14174687U JP14174687U JPS6446862U JP S6446862 U JPS6446862 U JP S6446862U JP 14174687 U JP14174687 U JP 14174687U JP 14174687 U JP14174687 U JP 14174687U JP S6446862 U JPS6446862 U JP S6446862U
- Authority
- JP
- Japan
- Prior art keywords
- multiplexer
- cpu
- outputs
- input
- address bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 1
Description
第１図は本考案の一実施例に係るインタフエー
ス回路を示す回路図、第２図は従来のインタフエ
ース回路の回路図である。 なお図面に用いた符号において、１０…ＣＰＵ
、１１…周辺インタフエース、１２…マルチプレ
クサ、１３…センサ、である。
ス回路を示す回路図、第２図は従来のインタフエ
ース回路の回路図である。 なお図面に用いた符号において、１０…ＣＰＵ
、１１…周辺インタフエース、１２…マルチプレ
クサ、１３…センサ、である。
Claims (1)
- 複数のセンサの出力をマルチプレクサおよびイ
ンタフエースを通してＣＰＵに取込むようにした
回路において、前記ＣＰＵのアドレスバスと前記
マルチプレクサとを接続し、前記アドレスバスを
通して前記ＣＰＵから送られる信号によつて該マ
ルチプレクサの切換えを行なうようにしたことを
特徴とするインタフエース回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14174687U JPS6446862U (ja) | 1987-09-17 | 1987-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14174687U JPS6446862U (ja) | 1987-09-17 | 1987-09-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6446862U true JPS6446862U (ja) | 1989-03-23 |
Family
ID=31407086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14174687U Pending JPS6446862U (ja) | 1987-09-17 | 1987-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6446862U (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7638259B2 (en) | 2006-08-22 | 2009-12-29 | Shin-Etsu Chemical Co., Ltd. | Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition |
| US7638254B2 (en) | 2004-05-07 | 2009-12-29 | Hitachi Chemical Dupont Microsystems Ltd | Positive photosensitive resin composition, method for forming pattern, and electronic part |
| US8420291B2 (en) | 2007-10-29 | 2013-04-16 | Hitachi Chemical Dupont Microsystems, Ltd. | Positive photosensitive resin composition, method for forming pattern, electronic component |
-
1987
- 1987-09-17 JP JP14174687U patent/JPS6446862U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7638254B2 (en) | 2004-05-07 | 2009-12-29 | Hitachi Chemical Dupont Microsystems Ltd | Positive photosensitive resin composition, method for forming pattern, and electronic part |
| US7638259B2 (en) | 2006-08-22 | 2009-12-29 | Shin-Etsu Chemical Co., Ltd. | Polyimide resin soluble in aqueous alkaline solution, composition comprising the resin and cured coating prepared from the composition |
| US8420291B2 (en) | 2007-10-29 | 2013-04-16 | Hitachi Chemical Dupont Microsystems, Ltd. | Positive photosensitive resin composition, method for forming pattern, electronic component |