JPS6446208U - - Google Patents
Info
- Publication number
- JPS6446208U JPS6446208U JP14277087U JP14277087U JPS6446208U JP S6446208 U JPS6446208 U JP S6446208U JP 14277087 U JP14277087 U JP 14277087U JP 14277087 U JP14277087 U JP 14277087U JP S6446208 U JPS6446208 U JP S6446208U
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- resin material
- pot
- reciprocating sliding
- sliding mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987142770U JPH0422975Y2 (fr) | 1987-09-17 | 1987-09-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987142770U JPH0422975Y2 (fr) | 1987-09-17 | 1987-09-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6446208U true JPS6446208U (fr) | 1989-03-22 |
JPH0422975Y2 JPH0422975Y2 (fr) | 1992-05-27 |
Family
ID=31408998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987142770U Expired JPH0422975Y2 (fr) | 1987-09-17 | 1987-09-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0422975Y2 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0384122U (fr) * | 1989-12-15 | 1991-08-27 | ||
EP0778116A1 (fr) | 1995-12-05 | 1997-06-11 | Apic Yamada Corporation | Machine pour le moulage de résine |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57183533U (fr) * | 1981-05-18 | 1982-11-20 | ||
JPS61185943A (ja) * | 1985-02-13 | 1986-08-19 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
JPS61148610U (fr) * | 1985-03-08 | 1986-09-13 | ||
JPS6244417A (ja) * | 1985-08-23 | 1987-02-26 | Toyoda Autom Loom Works Ltd | 射出成形機のスクリュ−推力制御方法 |
JPS6278839A (ja) * | 1985-09-30 | 1987-04-11 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
-
1987
- 1987-09-17 JP JP1987142770U patent/JPH0422975Y2/ja not_active Expired
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57183533U (fr) * | 1981-05-18 | 1982-11-20 | ||
JPS61185943A (ja) * | 1985-02-13 | 1986-08-19 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
JPS61148610U (fr) * | 1985-03-08 | 1986-09-13 | ||
JPS6244417A (ja) * | 1985-08-23 | 1987-02-26 | Toyoda Autom Loom Works Ltd | 射出成形機のスクリュ−推力制御方法 |
JPS6278839A (ja) * | 1985-09-30 | 1987-04-11 | Mitsubishi Electric Corp | 半導体素子用樹脂封止装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0384122U (fr) * | 1989-12-15 | 1991-08-27 | ||
EP0778116A1 (fr) | 1995-12-05 | 1997-06-11 | Apic Yamada Corporation | Machine pour le moulage de résine |
Also Published As
Publication number | Publication date |
---|---|
JPH0422975Y2 (fr) | 1992-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6446208U (fr) | ||
JPS5926244U (ja) | 半導体樹脂封入成形用の成形装置 | |
JP2602049B2 (ja) | 複合樹脂材等のプレス成形装置 | |
JPS6446209U (fr) | ||
JPH039819U (fr) | ||
JPS6397522U (fr) | ||
JP2553373B2 (ja) | 複合樹脂材等のプレス成形装置 | |
JPS618113U (ja) | 成形プレスにおける可動盤制御装置 | |
JPS6219212U (fr) | ||
JPS6440605U (fr) | ||
JPS6416635U (fr) | ||
JPH01174117U (fr) | ||
JPS6275910U (fr) | ||
JPS60164013U (ja) | 成形機 | |
JPS62170212U (fr) | ||
JPS6261321U (fr) | ||
KR970003691B1 (en) | A molding device of semiconductor package | |
JPS61186412U (fr) | ||
JPS636825U (fr) | ||
JPS61177816U (fr) | ||
JPS6440606U (fr) | ||
JPH01171620U (fr) | ||
JPS61107458U (fr) | ||
JPS6052021U (ja) | プレス金型 | |
JPS6341337U (fr) |