JPS644441A - Bonding wire - Google Patents

Bonding wire

Info

Publication number
JPS644441A
JPS644441A JP62157089A JP15708987A JPS644441A JP S644441 A JPS644441 A JP S644441A JP 62157089 A JP62157089 A JP 62157089A JP 15708987 A JP15708987 A JP 15708987A JP S644441 A JPS644441 A JP S644441A
Authority
JP
Japan
Prior art keywords
bonding wire
contg
silver
gold
purity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62157089A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0530891B2 (enrdf_load_stackoverflow
Inventor
Eiichi Asada
Kazuo Yokoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shoei Chemical Inc
Original Assignee
Shoei Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shoei Chemical Inc filed Critical Shoei Chemical Inc
Priority to JP62157089A priority Critical patent/JPS644441A/ja
Publication of JPS644441A publication Critical patent/JPS644441A/ja
Publication of JPH0530891B2 publication Critical patent/JPH0530891B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/012—Semiconductor purity grades
    • H01L2924/01204—4N purity grades, i.e. 99.99%

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP62157089A 1987-06-24 1987-06-24 Bonding wire Granted JPS644441A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157089A JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157089A JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Publications (2)

Publication Number Publication Date
JPS644441A true JPS644441A (en) 1989-01-09
JPH0530891B2 JPH0530891B2 (enrdf_load_stackoverflow) 1993-05-11

Family

ID=15642005

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157089A Granted JPS644441A (en) 1987-06-24 1987-06-24 Bonding wire

Country Status (1)

Country Link
JP (1) JPS644441A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
US5186082A (en) * 1990-08-07 1993-02-16 Honda Giken Kogyo Kabushiki Kaisha Ironing punch for making socket of ball-and-socket joint and method of manufacturing such ironing punch
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4938923A (en) * 1989-04-28 1990-07-03 Takeshi Kujiraoka Gold wire for the bonding of a semiconductor device
US5186082A (en) * 1990-08-07 1993-02-16 Honda Giken Kogyo Kabushiki Kaisha Ironing punch for making socket of ball-and-socket joint and method of manufacturing such ironing punch
JPH05179375A (ja) * 1991-12-26 1993-07-20 Nippon Steel Corp ボンディング用金合金細線

Also Published As

Publication number Publication date
JPH0530891B2 (enrdf_load_stackoverflow) 1993-05-11

Similar Documents

Publication Publication Date Title
EP0354696A3 (en) Semiconductor device assembly comprising a lead frame structure
EP0725437A3 (en) Semiconductor device, method of fabricating the same and copper leads
JPS644441A (en) Bonding wire
TW327697B (en) Gold alloy wire and method for making a bump
MY113663A (en) Gold wire for bonding
MY102548A (en) Semiconductor device
IL84680A0 (en) Wire bonder with open center of motion
IL90674A0 (en) Process for the preparation of 2,6-dichlorodiphenylamino-acetic acid derivatives
GB8613580D0 (en) Gold line
JPS5721830A (en) Bonding wire for semiconductor element
EP1179848A3 (en) Supply pin rearrangement for an I.C.
EP0315977A3 (en) Superconductor material comprising a three-component metallic oxide
JPS5361996A (en) Production of aluminum stabilized compound superconductive wire
JPS56169341A (en) Bonding wire for semiconductor element
GB2229859A (en) Roll surface cutting method
JPS57210654A (en) Semiconductor device and manufacture thereof
JPS5348461A (en) Wire bonder
GB8828875D0 (en) Bonding pb alloy wire for superconductor device & superconductor device
EP0376924A3 (en) Gold compression bonding
JPS55158642A (en) Bonding alloy wire for assembling semiconductor device
JPS55157247A (en) Lead frame for semiconductor element
JPS5696844A (en) Semiconductor element
JPS647630A (en) Bonding structure of semiconductor device
JPS563652A (en) Manufacture of seal bonding material
JPS6160841A (ja) ボンデイングワイヤ−

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees