JPS6441251A - Manufacture of lead frame - Google Patents

Manufacture of lead frame

Info

Publication number
JPS6441251A
JPS6441251A JP19631587A JP19631587A JPS6441251A JP S6441251 A JPS6441251 A JP S6441251A JP 19631587 A JP19631587 A JP 19631587A JP 19631587 A JP19631587 A JP 19631587A JP S6441251 A JPS6441251 A JP S6441251A
Authority
JP
Japan
Prior art keywords
prism
resist layer
lead
mask
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19631587A
Other languages
Japanese (ja)
Other versions
JP2525824B2 (en
Inventor
Kazuhiko Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyushu Hitachi Maxell Ltd
Maxell Holdings Ltd
Original Assignee
Kyushu Hitachi Maxell Ltd
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu Hitachi Maxell Ltd, Hitachi Maxell Ltd filed Critical Kyushu Hitachi Maxell Ltd
Priority to JP62196315A priority Critical patent/JP2525824B2/en
Publication of JPS6441251A publication Critical patent/JPS6441251A/en
Application granted granted Critical
Publication of JP2525824B2 publication Critical patent/JP2525824B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To decrease the defective percentage of products, by sticking a mask on the bottom surface of a prism, performing alignment and exposure via the prism, and attaching accurately a bump to a lead. CONSTITUTION:A prism apparatus 20 is mounted on a resist layer 15. A light beam for position recognition is emitted from a light emitting part 23. While the light is reflected by a prism 21 to illuminate a mask 22 surface, the apparatus 20 is slightly moved to the front and the rear and the right and the left to align the position of the mask 22. By emitting a light beam for resist-setting from the light emitting part 23, a set part and a non-set part are formed on the resist layer 15. By eliminating the non-set part, the set resist layer 15 only is left. Electroforming of a lead is performed on the eliminated part of the resist layer 15. Thereby, a bump is accurately attached to the lead, and the defective percentage of products can be decreased.
JP62196315A 1987-08-07 1987-08-07 Method for manufacturing lead frame Expired - Lifetime JP2525824B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62196315A JP2525824B2 (en) 1987-08-07 1987-08-07 Method for manufacturing lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62196315A JP2525824B2 (en) 1987-08-07 1987-08-07 Method for manufacturing lead frame

Publications (2)

Publication Number Publication Date
JPS6441251A true JPS6441251A (en) 1989-02-13
JP2525824B2 JP2525824B2 (en) 1996-08-21

Family

ID=16355768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62196315A Expired - Lifetime JP2525824B2 (en) 1987-08-07 1987-08-07 Method for manufacturing lead frame

Country Status (1)

Country Link
JP (1) JP2525824B2 (en)

Also Published As

Publication number Publication date
JP2525824B2 (en) 1996-08-21

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