JPS6441146U - - Google Patents

Info

Publication number
JPS6441146U
JPS6441146U JP13739187U JP13739187U JPS6441146U JP S6441146 U JPS6441146 U JP S6441146U JP 13739187 U JP13739187 U JP 13739187U JP 13739187 U JP13739187 U JP 13739187U JP S6441146 U JPS6441146 U JP S6441146U
Authority
JP
Japan
Prior art keywords
lead frame
die pad
combining
utility
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13739187U
Other languages
English (en)
Other versions
JPH0735403Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987137391U priority Critical patent/JPH0735403Y2/ja
Publication of JPS6441146U publication Critical patent/JPS6441146U/ja
Application granted granted Critical
Publication of JPH0735403Y2 publication Critical patent/JPH0735403Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案リードフレームの一実施例を示
す斜視図、第２図は第１図例のリードフレームを
製造する工程を示す線図、第３図は本考案の他の
実施例を示す斜視図、第４図は従来のリードフレ
ームの一例を示す斜視図、第５図は従来のリード
フレームの他の例を示す斜視図である。 ８はダイパツド部、９は外部リードフレーム、
１０は応力緩和用の溝、１１は結合片、１３はカ
シメ片部、１３Ａはカシメ片である。

Claims (1)

    【実用新案登録請求の範囲】
  1. ダイパツド部と外部リードフレームとを結合し
    て成ることを特徴とするリードフレーム。
JP1987137391U 1987-09-08 1987-09-08 リードフレーム Expired - Lifetime JPH0735403Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987137391U JPH0735403Y2 (ja) 1987-09-08 1987-09-08 リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987137391U JPH0735403Y2 (ja) 1987-09-08 1987-09-08 リードフレーム

Publications (2)

Publication Number Publication Date
JPS6441146U true JPS6441146U (ja) 1989-03-13
JPH0735403Y2 JPH0735403Y2 (ja) 1995-08-09

Family

ID=31398773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987137391U Expired - Lifetime JPH0735403Y2 (ja) 1987-09-08 1987-09-08 リードフレーム

Country Status (1)

Country Link
JP (1) JPH0735403Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129392A (ja) * 2010-12-16 2012-07-05 Shindengen Electric Mfg Co Ltd フレーム組立体、半導体装置及びその製造方法
JP2020094933A (ja) * 2018-12-13 2020-06-18 日立オートモティブシステムズ株式会社 熱式流量計

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662345A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Load frame and semiconductor device
JPS6284541A (ja) * 1985-10-08 1987-04-18 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム
JPS62136059A (ja) * 1985-12-09 1987-06-19 Mitsubishi Electric Corp 樹脂封止半導体装置用リ−ドフレ−ム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5662345A (en) * 1979-10-26 1981-05-28 Hitachi Ltd Load frame and semiconductor device
JPS6284541A (ja) * 1985-10-08 1987-04-18 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム
JPS62136059A (ja) * 1985-12-09 1987-06-19 Mitsubishi Electric Corp 樹脂封止半導体装置用リ−ドフレ−ム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012129392A (ja) * 2010-12-16 2012-07-05 Shindengen Electric Mfg Co Ltd フレーム組立体、半導体装置及びその製造方法
JP2020094933A (ja) * 2018-12-13 2020-06-18 日立オートモティブシステムズ株式会社 熱式流量計

Also Published As

Publication number Publication date
JPH0735403Y2 (ja) 1995-08-09

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