JPS6441145U - - Google Patents
Info
- Publication number
- JPS6441145U JPS6441145U JP13617787U JP13617787U JPS6441145U JP S6441145 U JPS6441145 U JP S6441145U JP 13617787 U JP13617787 U JP 13617787U JP 13617787 U JP13617787 U JP 13617787U JP S6441145 U JPS6441145 U JP S6441145U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- pair
- positioning
- positioning lead
- notches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987136177U JPH0739241Y2 (ja) | 1987-09-08 | 1987-09-08 | 樹脂封止型半導体装置用リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987136177U JPH0739241Y2 (ja) | 1987-09-08 | 1987-09-08 | 樹脂封止型半導体装置用リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6441145U true JPS6441145U (US06724976-20040420-M00002.png) | 1989-03-13 |
| JPH0739241Y2 JPH0739241Y2 (ja) | 1995-09-06 |
Family
ID=31396440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987136177U Expired - Lifetime JPH0739241Y2 (ja) | 1987-09-08 | 1987-09-08 | 樹脂封止型半導体装置用リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739241Y2 (US06724976-20040420-M00002.png) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |
| JPH0547975A (ja) * | 1990-09-25 | 1993-02-26 | Sanyo Electric Co Ltd | リードフレームおよび表面実装型半導体装置 |
| JP2012247336A (ja) * | 2011-05-30 | 2012-12-13 | Seiko Epson Corp | 物理量検出器の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5653556U (US06724976-20040420-M00002.png) * | 1979-10-01 | 1981-05-11 | ||
| JPS6156420A (ja) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
-
1987
- 1987-09-08 JP JP1987136177U patent/JPH0739241Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5653556U (US06724976-20040420-M00002.png) * | 1979-10-01 | 1981-05-11 | ||
| JPS6156420A (ja) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | 樹脂封止形半導体装置の製造方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0547975A (ja) * | 1990-09-25 | 1993-02-26 | Sanyo Electric Co Ltd | リードフレームおよび表面実装型半導体装置 |
| JPH04162550A (ja) * | 1990-10-26 | 1992-06-08 | Nec Corp | 樹脂封止型半導体装置およびその製造方法 |
| JP2012247336A (ja) * | 2011-05-30 | 2012-12-13 | Seiko Epson Corp | 物理量検出器の製造方法 |
| US9188600B2 (en) | 2011-05-30 | 2015-11-17 | Seiko Epson Corporation | Method for manufacturing physical quantity detector, and physical quantity detector |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0739241Y2 (ja) | 1995-09-06 |
