JPS6439646U - - Google Patents
Info
- Publication number
- JPS6439646U JPS6439646U JP13445387U JP13445387U JPS6439646U JP S6439646 U JPS6439646 U JP S6439646U JP 13445387 U JP13445387 U JP 13445387U JP 13445387 U JP13445387 U JP 13445387U JP S6439646 U JPS6439646 U JP S6439646U
- Authority
- JP
- Japan
- Prior art keywords
- case
- heat dissipation
- semiconductor device
- protrusion
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図および第２図は本考案の一実施例を示す
ものであつて、第１図は半導体装置の要部縦断正
面図、第２図は半導体装置の底面図である。第３
図ないし第５図は従来例を示すものであつて、第
３図は従来の半導体装置を示す要部縦断正面図、
第４図はこの半導体装置を外部機器における薄板
状をなす放熱板にビス締めしたときの状態を示す
要部縦断正面図、第５図はこの半導体装置を外部
機器における厚板状をなす放熱板にビス締めした
ときの状態を示す要部縦断正面図である。
１は樹脂製ケース（ケース）、２は液状樹脂、
３は放熱用基板、４は接着剤、５は内部回路部品
、６は外部出力端子、７はビス穴、８はビス、１
２は突起部である。
1 and 2 show an embodiment of the present invention, in which FIG. 1 is a longitudinal sectional front view of the main part of a semiconductor device, and FIG. 2 is a bottom view of the semiconductor device. Third
5 to 5 show conventional examples, and FIG. 3 is a longitudinal sectional front view of the main part showing a conventional semiconductor device;
Fig. 4 is a longitudinal sectional front view of the main part showing the state when this semiconductor device is screwed to a thin plate-shaped heat sink of an external device, and Fig. 5 is a longitudinal sectional front view of this semiconductor device showing a state in which this semiconductor device is screwed to a thick plate-shaped heat sink of an external device. FIG. 6 is a longitudinal sectional front view of the main part showing the state when the screws are tightened. 1 is a resin case (case), 2 is a liquid resin,
3 is a heat dissipation board, 4 is an adhesive, 5 is an internal circuit component, 6 is an external output terminal, 7 is a screw hole, 8 is a screw, 1
2 is a protrusion.
Claims (1)
着剤にて固定し、同ケース内部上部に液状樹脂が
注入され硬化されてモールドされてなる半導体装
置において、 上記ケースの底面に、放熱用基板の底面とケー
ス底面との間に形成されるギヤツプの最大値とほ
ぼ同じ高さの突起部が、外部機器の放熱板に取り
付け固定するためのケースのビス穴の位置よりも
外周側に形成されていることを特徴とする樹脂注
入型半導体装置。[Scope of Claim for Utility Model Registration] A semiconductor device in which a heat dissipation substrate is fixed to the lower end of a cylindrical case with an adhesive, and a liquid resin is injected into the upper part of the case and hardened and molded. On the bottom of the case, there is a protrusion that is approximately the same height as the maximum value of the gap formed between the bottom of the heat dissipation board and the bottom of the case, and is located in the screw hole of the case for attaching and fixing to the heat dissipation plate of an external device. A resin injection type semiconductor device characterized in that the device is formed on the outer circumferential side of the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13445387U JPS6439646U (en) | 1987-09-02 | 1987-09-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13445387U JPS6439646U (en) | 1987-09-02 | 1987-09-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6439646U true JPS6439646U (en) | 1989-03-09 |
Family
ID=31393220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13445387U Pending JPS6439646U (en) | 1987-09-02 | 1987-09-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6439646U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019047049A (en) * | 2017-09-06 | 2019-03-22 | 三菱電機株式会社 | Semiconductor device |
-
1987
- 1987-09-02 JP JP13445387U patent/JPS6439646U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019047049A (en) * | 2017-09-06 | 2019-03-22 | 三菱電機株式会社 | Semiconductor device |
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