JPS6437016A - Wet processor and substrate holding jig used for same - Google Patents

Wet processor and substrate holding jig used for same

Info

Publication number
JPS6437016A
JPS6437016A JP62193362A JP19336287A JPS6437016A JP S6437016 A JPS6437016 A JP S6437016A JP 62193362 A JP62193362 A JP 62193362A JP 19336287 A JP19336287 A JP 19336287A JP S6437016 A JPS6437016 A JP S6437016A
Authority
JP
Japan
Prior art keywords
wet
processor
wet processing
same
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62193362A
Other languages
English (en)
Other versions
JP2601831B2 (ja
Inventor
Masateru Wakui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62193362A priority Critical patent/JP2601831B2/ja
Priority to EP88306024A priority patent/EP0301710A1/en
Priority to KR1019880009339A priority patent/KR890002986A/ko
Publication of JPS6437016A publication Critical patent/JPS6437016A/ja
Application granted granted Critical
Publication of JP2601831B2 publication Critical patent/JP2601831B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
    • G03D3/08—Liquid processing apparatus involving immersion; Washing apparatus involving immersion having progressive mechanical movement of exposed material
    • G03D3/10—Liquid processing apparatus involving immersion; Washing apparatus involving immersion having progressive mechanical movement of exposed material for plates, films, or prints held individually
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3085—Imagewise removal using liquid means from plates or webs transported vertically; from plates suspended or immersed vertically in the processing unit

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Liquid Crystal (AREA)
JP62193362A 1987-07-31 1987-07-31 ウェット処理装置 Expired - Fee Related JP2601831B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62193362A JP2601831B2 (ja) 1987-07-31 1987-07-31 ウェット処理装置
EP88306024A EP0301710A1 (en) 1987-07-31 1988-07-01 A wet etching apparatus suitable for processing large plates such as glass plates of the liquid-crystal display panels
KR1019880009339A KR890002986A (ko) 1987-07-31 1988-07-25 웨트 처리장치 및 그것에 사용하는 기판유지치구

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62193362A JP2601831B2 (ja) 1987-07-31 1987-07-31 ウェット処理装置

Publications (2)

Publication Number Publication Date
JPS6437016A true JPS6437016A (en) 1989-02-07
JP2601831B2 JP2601831B2 (ja) 1997-04-16

Family

ID=16306649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62193362A Expired - Fee Related JP2601831B2 (ja) 1987-07-31 1987-07-31 ウェット処理装置

Country Status (3)

Country Link
EP (1) EP0301710A1 (ja)
JP (1) JP2601831B2 (ja)
KR (1) KR890002986A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014009132A (ja) * 2012-06-29 2014-01-20 Hoya Corp ガラス基板ホルダ、及び電子機器用カバーガラスのガラス基板の製造方法
JP2015185631A (ja) * 2014-03-24 2015-10-22 株式会社荏原製作所 基板処理装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69032262T2 (de) * 1989-11-30 1998-08-27 Toyo Boseki Vorrichtung und Verfahren zur Entwicklung von Photopolymer-Druckplatten
EP0802527B1 (en) * 1995-10-09 2001-08-29 Matsushita Electric Industrial Co., Ltd. Recorder for optical disks
KR100775201B1 (ko) * 2001-06-01 2007-11-12 에스.이.에스 카부시키가이샤 기판세정시스템
JP2009229771A (ja) * 2008-03-21 2009-10-08 Fujifilm Corp 平版印刷版用自動現像方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140274A (ja) * 1974-04-29 1975-11-10
JPS6085529A (ja) * 1983-10-17 1985-05-15 Mitsubishi Electric Corp 半導体ウエ−ハ薬液処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3727533A (en) * 1971-07-20 1973-04-17 T Perl Lightproofed dental radiographic film developer
GB2094671B (en) * 1981-03-17 1984-06-13 Base Electronics Ltd Fluid treatment apparatus
DE3147002A1 (de) * 1981-11-27 1983-06-01 Hoechst Ag, 6230 Frankfurt Verarbeitungsgeraet fuer bildmaessig belichtete fotoempfindliche materialien
DE3631668A1 (de) * 1986-09-18 1988-03-24 Hoechst Ag Vorrichtung zum verarbeiten von fotoempfindlichen materialien

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140274A (ja) * 1974-04-29 1975-11-10
JPS6085529A (ja) * 1983-10-17 1985-05-15 Mitsubishi Electric Corp 半導体ウエ−ハ薬液処理装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014009132A (ja) * 2012-06-29 2014-01-20 Hoya Corp ガラス基板ホルダ、及び電子機器用カバーガラスのガラス基板の製造方法
JP2015185631A (ja) * 2014-03-24 2015-10-22 株式会社荏原製作所 基板処理装置
US9786532B2 (en) 2014-03-24 2017-10-10 Ebara Corporation Substrate processing apparatus and method of transferring a substrate
US10141211B2 (en) 2014-03-24 2018-11-27 Ebara Corporation Substrate processing apparatus and substrate transfer method

Also Published As

Publication number Publication date
EP0301710A1 (en) 1989-02-01
KR890002986A (ko) 1989-04-12
JP2601831B2 (ja) 1997-04-16

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees