JPS6436626A - Prepreg for rail bonding - Google Patents

Prepreg for rail bonding

Info

Publication number
JPS6436626A
JPS6436626A JP19022787A JP19022787A JPS6436626A JP S6436626 A JPS6436626 A JP S6436626A JP 19022787 A JP19022787 A JP 19022787A JP 19022787 A JP19022787 A JP 19022787A JP S6436626 A JPS6436626 A JP S6436626A
Authority
JP
Japan
Prior art keywords
epoxy resin
group
drying
lower alkyl
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19022787A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0355500B2 (en:Method
Inventor
Takaharu Nagafuji
Katsuya Kirimura
Noritsugu Abe
Hitoshi Murata
Atsushi Yokota
Hiroshi Matsumura
Shozo Kitagawa
Katsunori Miyoshi
Nobuyuki Matsuura
Masaki Tomori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Railway Technical Research Institute
Dainippon Shikizai Kogyo Co Ltd
Original Assignee
Railway Technical Research Institute
Dainippon Shikizai Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Railway Technical Research Institute, Dainippon Shikizai Kogyo Co Ltd filed Critical Railway Technical Research Institute
Priority to JP19022787A priority Critical patent/JPS6436626A/ja
Publication of JPS6436626A publication Critical patent/JPS6436626A/ja
Publication of JPH0355500B2 publication Critical patent/JPH0355500B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Reinforced Plastic Materials (AREA)
JP19022787A 1987-07-31 1987-07-31 Prepreg for rail bonding Granted JPS6436626A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19022787A JPS6436626A (en) 1987-07-31 1987-07-31 Prepreg for rail bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19022787A JPS6436626A (en) 1987-07-31 1987-07-31 Prepreg for rail bonding

Publications (2)

Publication Number Publication Date
JPS6436626A true JPS6436626A (en) 1989-02-07
JPH0355500B2 JPH0355500B2 (en:Method) 1991-08-23

Family

ID=16254601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19022787A Granted JPS6436626A (en) 1987-07-31 1987-07-31 Prepreg for rail bonding

Country Status (1)

Country Link
JP (1) JPS6436626A (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006518414A (ja) * 2003-02-07 2006-08-10 レイセオン・カンパニー 高強度、長期耐久性の構造用布帛／シーム系
JP2008007756A (ja) * 2006-05-30 2008-01-17 Hitachi Chem Co Ltd 粘弾性樹脂組成物、プリプレグ、導体張積層板、樹脂付き金属箔及び樹脂フィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006518414A (ja) * 2003-02-07 2006-08-10 レイセオン・カンパニー 高強度、長期耐久性の構造用布帛／シーム系
JP2008007756A (ja) * 2006-05-30 2008-01-17 Hitachi Chem Co Ltd 粘弾性樹脂組成物、プリプレグ、導体張積層板、樹脂付き金属箔及び樹脂フィルム

Also Published As

Publication number Publication date
JPH0355500B2 (en:Method) 1991-08-23

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