JPS6435983A - Manufacture of electric circuit molding - Google Patents

Abstract

PURPOSE:To efficiently manufacture a synthetic resin molding formed integrally with an electric circuit on a recess face of a complicated shape of the molding by disposing the electric circuit in close contact with an adiabatic layer in the cavity of a metal mold. CONSTITUTION:Melted thermoplastic resin 8 is poured and filled in a cavity 3, and so cooled to be cured in a state that an electric circuit film 6 is inserted and disposed as to bring an electric circuit 7 in close contact with an adiabatic layer 5 on the inner periphery of a metal mold. Thus, the cooling speed of the melted resin becomes slower than that of other part at a part near the adiabatic layer having low thermal conductivity. Since the resin 8 of the part in contact with the film 6 is held in a high temperature melted state for a longer time than that of the other part, the resin of the base of the film 6 is rigidly fusion-bonded to the molding resin of this part at this time, and the molding body is bonded to the circuit 7 through the fusion-bonded layer. Thus, an electric circuit molding in which the circuit is completely integrated with the molding body is efficiently obtained.