JPH0810784B2 - Method for manufacturing electric circuit molded body - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a method for producing a three-dimensionally shaped synthetic resin molded product having an electric circuit on the surface thereof.

(Prior Art) Conventionally, as a method of integrally forming an electric circuit on a synthetic resin molded body, a method of forming an electric circuit by electroless plating on the surface of a molded body molded by a conventional method, Methods are used to print electrical circuits using conductive ink.

(Problems to be Solved by the Invention) However, in any of these methods, it was difficult to form an electric circuit inside the deep recess of the molded body. Therefore, there is a problem that only a relatively flat plate-shaped electric circuit molded body can be practically manufactured.

The present invention has been made to solve such a problem, and reliably forms an electric circuit even in a deep recess of a molded body,
An object of the present invention is to provide a method for efficiently producing an electric circuit molded body having good characteristics.

[Structure of the Invention] (Means for Solving the Problems) That is, the method for producing an electric circuit molded body of the present invention is characterized in that a cavity of a mold in which a heat insulating layer is formed on a part of an inner peripheral surface is
An electric circuit film having an electric circuit formed on one surface of a thermoplastic resin film is placed in close contact with the heat insulating layer, and then the melted thermoplastic resin is injected and filled into the cavity of the mold. Then, it is characterized by being cooled and cured.

In the present invention, the thermoplastic resin forming the thermoplastic resin film serving as the base of the electric circuit film and the base thermoplastic resin injected and filled into the mold cavity are polycarbonate resin, polysulfone resin, and polyether, respectively. It is preferable to use a resin selected from a sulfone resin, a polyetherimide resin, a polyphenylene oxide resin, and a polyphenylene sulfide resin.

Further, it is desirable to use the same kind of thermoplastic resin that constitutes the thermoplastic resin film and the thermoplastic resin that constitutes the molded body.

In this case, the thermoplastic resin film having an electric circuit and the molded body are more favorably fused during molding, and an electric circuit molded body in which the electric circuit is completely integrated with the molded body can be obtained.

(Operation) In the method for producing an electric circuit molded body of the present invention, the heat melted in the cavity in a state where the electric circuit film is inserted and arranged so that the electric circuit is in close contact with the heat insulating layer on the inner peripheral surface of the mold. Since the plastic resin is injected and filled and cooled and hardened,
In the portion close to the heat insulating layer having low thermal conductivity, the cooling rate of the molten resin becomes slower than in other portions. In this way, the thermoplastic resin in the part in contact with the electric circuit film maintains a high-temperature molten state for a longer time than other parts, and at this time, the base thermoplastic resin of the electric circuit film is firmly melted into the molded resin in this part. The molded body and the electric circuit are completely bonded to each other via the fusion layer.

(Example) Hereinafter, the Example of this invention is described based on drawing.

In the embodiment, first, as shown in FIG. 1, in a die 4 having a box-shaped cavity 3 with a step made up of a core 1 and a female die 2, the surface of the core 1 in contact with the cavity 3 is as follows. The heat insulating layer 5 having low heat conductivity is buried by the method.

That is, at a predetermined position on the inner peripheral surface of the core 1, a block made of a heat-resistant synthetic resin such as ceramics, fluororesin, or polyphenylene sulfide resin is inserted as a nest, or the inner peripheral surface of the core 1 is made of ceramic or The heat insulating layer 5 is formed by the method of coating and baking the heat resistant synthetic resin. More simply, a heat-resistant synthetic resin film may be provided on the inner peripheral surface of the core 1 for molding.

Next, in the cavity 3 of the mold 4, an electric circuit film formed by forming an electric circuit 7 on one surface of the thermoplastic resin film 6 by etching a copper foil, printing a conductive ink, or the like is provided on the electric circuit 7 side. After arranging them in close contact with the surface of the heat insulating layer 5, in this state, the thermoplastic resin 8 that has been heated and melted is injected and filled into the cavity 3 and cooled and cured.

At this time, the molten thermoplastic resin 8 in the portion close to the heat insulating layer 5 of the core 1 keeps a high temperature for a long time because the cooling is delayed compared to other portions, whereby the thermoplastic resin film 6 of the electric circuit film is melted into the molded body. Be worn.

Finally, after the thermoplastic resin 8 in the cavity 3 is completely cooled and hardened, the mold 4 is released and the molded body is taken out.

In this manner, as shown in FIG. 2, a deep box-shaped electric circuit molded body 9 in which the electric circuit 7 is integrally provided on the stepped inner bottom surface is obtained.

[Effects of the Invention] As is clear from the above description, according to the method of the present invention, a synthetic resin molded body in which an electric circuit is integrally formed on the concave surface of the molded body having a complicated shape is efficiently manufactured. be able to.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining an embodiment of the present invention, and FIG.
The figure is a front view of an electric circuit molded body obtained in Examples. 1 ... Core 3 ... Cavity 5 ... Thermal insulation layer 6 ... Thermoplastic resin film 7 ... Electric circuit 8 ... Molten thermoplastic resin 9 ... Electric circuit molded body

Claims (3)

[Claims] 1. An electric circuit film having an electric circuit formed on one surface of a thermoplastic resin film in a cavity of a mold having a heat insulating layer formed on a part of an inner peripheral surface, and the electric circuit being formed on the heat insulating layer. A method for producing an electric circuit molded body, characterized in that the molten thermoplastic resin is injected and filled into the cavity of the mold, and then cooled and hardened. 2. The electric circuit molded body according to claim 1, wherein the thermoplastic resin forming the thermoplastic resin film and the thermoplastic resin injected and filled in the mold cavity are of the same type. Manufacturing method. 3. The thermoplastic resin is a polycarbonate resin,
The method for producing an electric circuit molded body according to claim 2, which is a resin selected from polysulfone resin, polyether sulfone resin, polyetherimide resin, polyphenylene oxide resin, and polyphenylene sulfide resin.