JPS6432501A - Microwave circuit device - Google Patents
Microwave circuit deviceInfo
- Publication number
- JPS6432501A JPS6432501A JP18655987A JP18655987A JPS6432501A JP S6432501 A JPS6432501 A JP S6432501A JP 18655987 A JP18655987 A JP 18655987A JP 18655987 A JP18655987 A JP 18655987A JP S6432501 A JPS6432501 A JP S6432501A
- Authority
- JP
- Japan
- Prior art keywords
- board
- circuit
- mismatching
- impedance
- dielectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
Abstract
PURPOSE:To prevent the deterioration in the circuit characteristic due to the case such as mismatching of impedance or increase in pad capacitance by decreasing the dielectric constant of a dielectric board using an FET and increasing the part of the board using an IC. CONSTITUTION:The circuit characteristic is deteriorated in the circuit where microwave circuit components such as FETs and ICs exist in mixture because of the case such as mismatching of impedance or increase in pad capacitance. The pad capacitance is decreased by making the thickness of the dielectric material of the board with the FET mounted thereupon thick or employing a material with a lower dielectric constant, and the impedance mismatching is prevented by employing a material with a high dielectric constant (hatched part 2 of a board 1) or making the thickness (part 12 of a board 13) thin. Moreover, a dielectric substance having a ground plate on its upper face is coated around the parts of ground board with an IC mounted thereupon as the other way. Thus, a stable microwave circuit without the deterioration in the characteristic is obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18655987A JPS6432501A (en) | 1987-07-28 | 1987-07-28 | Microwave circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18655987A JPS6432501A (en) | 1987-07-28 | 1987-07-28 | Microwave circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6432501A true JPS6432501A (en) | 1989-02-02 |
Family
ID=16190645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18655987A Pending JPS6432501A (en) | 1987-07-28 | 1987-07-28 | Microwave circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6432501A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002334947A (en) * | 2001-05-10 | 2002-11-22 | Sony Corp | High-frequency module substrate device and method of manufacturing the same |
-
1987
- 1987-07-28 JP JP18655987A patent/JPS6432501A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002334947A (en) * | 2001-05-10 | 2002-11-22 | Sony Corp | High-frequency module substrate device and method of manufacturing the same |
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