JPS6431874A - Electroconductive resin paste for semiconductor - Google Patents

Electroconductive resin paste for semiconductor

Info

Publication number
JPS6431874A
JPS6431874A JP18772287A JP18772287A JPS6431874A JP S6431874 A JPS6431874 A JP S6431874A JP 18772287 A JP18772287 A JP 18772287A JP 18772287 A JP18772287 A JP 18772287A JP S6431874 A JPS6431874 A JP S6431874A
Authority
JP
Japan
Prior art keywords
silver powder
particle size
semiconductor
compound
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18772287A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0567670B2 (enrdf_load_stackoverflow
Inventor
Masuo Mizuno
Mitsuo Waki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP18772287A priority Critical patent/JPS6431874A/ja
Publication of JPS6431874A publication Critical patent/JPS6431874A/ja
Publication of JPH0567670B2 publication Critical patent/JPH0567670B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Conductive Materials (AREA)
JP18772287A 1987-07-29 1987-07-29 Electroconductive resin paste for semiconductor Granted JPS6431874A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18772287A JPS6431874A (en) 1987-07-29 1987-07-29 Electroconductive resin paste for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18772287A JPS6431874A (en) 1987-07-29 1987-07-29 Electroconductive resin paste for semiconductor

Publications (2)

Publication Number Publication Date
JPS6431874A true JPS6431874A (en) 1989-02-02
JPH0567670B2 JPH0567670B2 (enrdf_load_stackoverflow) 1993-09-27

Family

ID=16211030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18772287A Granted JPS6431874A (en) 1987-07-29 1987-07-29 Electroconductive resin paste for semiconductor

Country Status (1)

Country Link
JP (1) JPS6431874A (enrdf_load_stackoverflow)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368660A (ja) * 1988-06-13 1991-03-25 Ici Composites Inc 電磁シールド用樹脂製造用の充填剤ブレンド
JPH0394078A (ja) * 1989-06-23 1991-04-18 Toyo Ink Mfg Co Ltd 導電性粒子の製造方法
US5227093A (en) * 1991-11-29 1993-07-13 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
EP0820217A1 (en) * 1996-07-18 1998-01-21 E.I. Du Pont De Nemours And Company Composition and process for filling vias
JP2006286366A (ja) * 2005-03-31 2006-10-19 The Inctec Inc 導電性ペースト組成物およびプリント配線板
US7198736B2 (en) 2004-03-03 2007-04-03 Sumitomo Electric Industries, Ltd. Conductive silver paste and conductive film formed using the same
CN100418390C (zh) * 1997-10-14 2008-09-10 揖斐电株式会社 填充印制线路板通孔的树脂组合物
JP2011526960A (ja) * 2008-07-03 2011-10-20 ヘンケル コーポレイション チクソ伝導性組成物
WO2014050156A1 (ja) * 2012-09-27 2014-04-03 三ツ星ベルト株式会社 導電性組成物及びそれを用いた導電性成形体
WO2016021535A1 (ja) * 2014-08-08 2016-02-11 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール
CN106062084A (zh) * 2014-02-24 2016-10-26 三之星机带株式会社 导电性组合物及导电性成形体
JP2017071707A (ja) * 2015-10-08 2017-04-13 信越化学工業株式会社 液状熱伝導性樹脂組成物及び電子部品
JP2023153928A (ja) * 2015-05-08 2023-10-18 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 焼結可能フィルムおよびペーストおよびその使用方法

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368660A (ja) * 1988-06-13 1991-03-25 Ici Composites Inc 電磁シールド用樹脂製造用の充填剤ブレンド
JPH0394078A (ja) * 1989-06-23 1991-04-18 Toyo Ink Mfg Co Ltd 導電性粒子の製造方法
US5227093A (en) * 1991-11-29 1993-07-13 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
EP0820217A1 (en) * 1996-07-18 1998-01-21 E.I. Du Pont De Nemours And Company Composition and process for filling vias
CN100418390C (zh) * 1997-10-14 2008-09-10 揖斐电株式会社 填充印制线路板通孔的树脂组合物
US7198736B2 (en) 2004-03-03 2007-04-03 Sumitomo Electric Industries, Ltd. Conductive silver paste and conductive film formed using the same
JP2006286366A (ja) * 2005-03-31 2006-10-19 The Inctec Inc 導電性ペースト組成物およびプリント配線板
JP2011526960A (ja) * 2008-07-03 2011-10-20 ヘンケル コーポレイション チクソ伝導性組成物
WO2014050156A1 (ja) * 2012-09-27 2014-04-03 三ツ星ベルト株式会社 導電性組成物及びそれを用いた導電性成形体
JP2014080559A (ja) * 2012-09-27 2014-05-08 Mitsuboshi Belting Ltd 導電性組成物
CN104685002A (zh) * 2012-09-27 2015-06-03 三之星机带株式会社 导电性组合物及使用该导电性组合物的导电性成形体
CN104685002B (zh) * 2012-09-27 2018-09-07 三之星机带株式会社 导电性组合物及使用该导电性组合物的导电性成形体
CN106062084A (zh) * 2014-02-24 2016-10-26 三之星机带株式会社 导电性组合物及导电性成形体
US11242471B2 (en) 2014-02-24 2022-02-08 Mitsuboshi Belting Ltd. Conductive composition and conductive molded article
WO2016021535A1 (ja) * 2014-08-08 2016-02-11 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール
JPWO2016021535A1 (ja) * 2014-08-08 2017-05-18 横浜ゴム株式会社 導電性組成物、太陽電池セルおよび太陽電池モジュール
JP2023153928A (ja) * 2015-05-08 2023-10-18 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 焼結可能フィルムおよびペーストおよびその使用方法
JP2017071707A (ja) * 2015-10-08 2017-04-13 信越化学工業株式会社 液状熱伝導性樹脂組成物及び電子部品

Also Published As

Publication number Publication date
JPH0567670B2 (enrdf_load_stackoverflow) 1993-09-27

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term