JPS6430880U - - Google Patents
Info
- Publication number
- JPS6430880U JPS6430880U JP12672387U JP12672387U JPS6430880U JP S6430880 U JPS6430880 U JP S6430880U JP 12672387 U JP12672387 U JP 12672387U JP 12672387 U JP12672387 U JP 12672387U JP S6430880 U JPS6430880 U JP S6430880U
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- plating layer
- solder plating
- wiring fixing
- flexible member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る配線固定構造の一実施例
を示す平面図、第２図は第１図の正面図、第３図
及び第５図は本実施例の作用を示す平面図、第４
図及び第６図はそれぞれ第３図及び第５図の正面
図、第７図及び第８図は従来の配線固定構造を示
すそれぞれ平面図及び正面図、第９図は磁気デイ
スク装置の磁気ヘツドを示す斜視図、第１０図及
び第１１図は従来の配線固定構造の作用を示すそ
れぞれ平面図及び正面図である。
１……ベースフイルム（可撓性部材）、１ｂ…
…切欠き部、２，１２……導体パターン、３，１
３……半田メツキ層、９……線材。
FIG. 1 is a plan view showing an embodiment of the wiring fixing structure according to the present invention, FIG. 2 is a front view of FIG. 4
6 and 6 are front views of FIGS. 3 and 5, respectively, FIGS. 7 and 8 are plan views and front views showing conventional wiring fixing structures, respectively, and FIG. 9 is a magnetic head of a magnetic disk device. FIG. 10 and FIG. 11 are a plan view and a front view, respectively, showing the operation of the conventional wiring fixing structure. 1...Base film (flexible member), 1b...
...Notch, 2, 12...Conductor pattern, 3, 1
3... Solder plating layer, 9... Wire rod.
Claims (1)
上面に半田メツキ層を設け、該半田メツキ層を溶
融して線材を前記導体パターンに接続固定する配
線固定構造において、前記導体パターンを前記半
田メツキ層とともにほぼＵ字状に形成するととも
に、このＵ字状の導体パターン及び半田メツキ層
の凹部に前記線材を保持固定したことを特徴とす
る配線固定構造。 (2) 可撓性部材の一辺の導体パターンに整合す
る位置には、切欠き部が形成されたことを特徴と
する実用新案登録請求の範囲第１項記載の配線固
定構造。[Claims for Utility Model Registration] (1) Wiring fixing in which a solder plating layer is provided on the upper surface of a conductor pattern formed on a flexible member, and the solder plating layer is melted to connect and fix a wire to the conductor pattern. A wiring fixing structure characterized in that the conductor pattern is formed into a substantially U-shape together with the solder plating layer, and the wire is held and fixed in a recessed portion of the U-shaped conductor pattern and the solder plating layer. (2) The wiring fixing structure according to claim 1, wherein a notch is formed at a position matching the conductor pattern on one side of the flexible member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12672387U JPS6430880U (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12672387U JPS6430880U (en) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430880U true JPS6430880U (en) | 1989-02-27 |
Family
ID=31378494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12672387U Pending JPS6430880U (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430880U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5411379B1 (en) * | 2013-05-20 | 2014-02-12 | 株式会社日本サクドリー | Adhesive mousetrap with adhesive mousetrap holder and adhesive mousetrap holder |
-
1987
- 1987-08-20 JP JP12672387U patent/JPS6430880U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5411379B1 (en) * | 2013-05-20 | 2014-02-12 | 株式会社日本サクドリー | Adhesive mousetrap with adhesive mousetrap holder and adhesive mousetrap holder |