JPS6429829U - - Google Patents

Info

Publication number
JPS6429829U
JPS6429829U JP12493187U JP12493187U JPS6429829U JP S6429829 U JPS6429829 U JP S6429829U JP 12493187 U JP12493187 U JP 12493187U JP 12493187 U JP12493187 U JP 12493187U JP S6429829 U JPS6429829 U JP S6429829U
Authority
JP
Japan
Prior art keywords
lead frame
heater block
burr
groove
sinks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12493187U
Other languages
English (en)
Other versions
JPH0526744Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12493187U priority Critical patent/JPH0526744Y2/ja
Publication of JPS6429829U publication Critical patent/JPS6429829U/ja
Application granted granted Critical
Publication of JPH0526744Y2 publication Critical patent/JPH0526744Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案を説明する為の断面図、第２図
及び第３図は夫々従来例を説明する為の平面図及
び断面図である。 １１は半導体ペレツト、１２はリードフレーム
１３のアイランド、１８はヒータブロツク、１９
は溝、２０はアイランド１２のバリである。

Claims (1)

    【実用新案登録請求の範囲】
  1. 打抜き加工によつて作られたリードフレームを
    ステージ上に載置し、前記リードフレームの被ボ
    ンデイング部分の裏面をヒータブロツクで加熱し
    ながら作業を行うボンデイング装置において、前
    記ヒータブロツク表面に前記リードフレームのバ
    リが没する溝を設けたことを特徴とするボンデイ
    ング装置。
JP12493187U 1987-08-17 1987-08-17 Expired - Lifetime JPH0526744Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12493187U JPH0526744Y2 (ja) 1987-08-17 1987-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12493187U JPH0526744Y2 (ja) 1987-08-17 1987-08-17

Publications (2)

Publication Number Publication Date
JPS6429829U true JPS6429829U (ja) 1989-02-22
JPH0526744Y2 JPH0526744Y2 (ja) 1993-07-07

Family

ID=31375086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12493187U Expired - Lifetime JPH0526744Y2 (ja) 1987-08-17 1987-08-17

Country Status (1)

Country Link
JP (1) JPH0526744Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7409175B2 (en) 2005-02-07 2008-08-05 Samsung Electronics Co., Ltd. Image forming apparatus and image reading apparatus with locking unit for locking movable object
JP2014120544A (ja) * 2012-12-14 2014-06-30 Mitsubishi Electric Corp 発光装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7409175B2 (en) 2005-02-07 2008-08-05 Samsung Electronics Co., Ltd. Image forming apparatus and image reading apparatus with locking unit for locking movable object
JP2014120544A (ja) * 2012-12-14 2014-06-30 Mitsubishi Electric Corp 発光装置

Also Published As

Publication number Publication date
JPH0526744Y2 (ja) 1993-07-07

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