JPS6428927A - Metallized structure for chip-on glass mounting - Google Patents

Metallized structure for chip-on glass mounting

Info

Publication number
JPS6428927A
JPS6428927A JP18347987A JP18347987A JPS6428927A JP S6428927 A JPS6428927 A JP S6428927A JP 18347987 A JP18347987 A JP 18347987A JP 18347987 A JP18347987 A JP 18347987A JP S6428927 A JPS6428927 A JP S6428927A
Authority
JP
Japan
Prior art keywords
layer
transparent electrode
phosphorus concentration
pattern
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18347987A
Other languages
Japanese (ja)
Inventor
Kotaro Yoneda
Toshihiko Tsuboi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP18347987A priority Critical patent/JPS6428927A/en
Publication of JPS6428927A publication Critical patent/JPS6428927A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To manufacture the title structure at a low cost and easily and to realize a large-sized structure by a method wherein a transparent electrode having a prescribed circuit pattern is formed on a glass substrate, an Ni-P layer of high phosphorus concentration and an Ni-P layer of low phosphorus concentration which have a pattern of a drive circuit, an extraction electrode or the like are formed on the transparent electrode and, furthermore, an Au layer is formed on the layer. CONSTITUTION:A transparent electrode 13 by an ITO film having various patterns is formed on a glass substrate 11; this transparent electrode 13 is patterned to a prescribed circuit pattern; in succession, an Ni-P layer of high phosphorus concentration, e.g. about 10%, and an Ni-P layer 15 of low phosphorus concentration, e.g. about 1%, are formed selectively on the pattern of the transparent electrode 13 by a non-electrolytic plating method. Then, an Au layer 16 is formed on the Ni-P layer 15 by a substitution reaction. By this setup, a three-layer metallized structure is formed on the transparent electrode 13. As a result, it is possible to obtain a substrate for chip-on glass mounting use at a low cost and with the excellent productivity.
JP18347987A 1987-07-24 1987-07-24 Metallized structure for chip-on glass mounting Pending JPS6428927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18347987A JPS6428927A (en) 1987-07-24 1987-07-24 Metallized structure for chip-on glass mounting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18347987A JPS6428927A (en) 1987-07-24 1987-07-24 Metallized structure for chip-on glass mounting

Publications (1)

Publication Number Publication Date
JPS6428927A true JPS6428927A (en) 1989-01-31

Family

ID=16136526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18347987A Pending JPS6428927A (en) 1987-07-24 1987-07-24 Metallized structure for chip-on glass mounting

Country Status (1)

Country Link
JP (1) JPS6428927A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109224A (en) * 1975-03-20 1976-09-28 Satosen Co Ltd TAINETSUSEICHOKO GOKINHIFUKUOJUSURU KOZOTAI
JPS56136966A (en) * 1980-03-31 1981-10-26 Hitachi Ltd Electroless plating method
JPS5992598A (en) * 1982-11-18 1984-05-28 鳴海製陶株式会社 Ceramic substrate for carrying electronic part
JPS6191630A (en) * 1984-10-11 1986-05-09 Citizen Watch Co Ltd Structure for mounting liquid crystal display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51109224A (en) * 1975-03-20 1976-09-28 Satosen Co Ltd TAINETSUSEICHOKO GOKINHIFUKUOJUSURU KOZOTAI
JPS56136966A (en) * 1980-03-31 1981-10-26 Hitachi Ltd Electroless plating method
JPS5992598A (en) * 1982-11-18 1984-05-28 鳴海製陶株式会社 Ceramic substrate for carrying electronic part
JPS6191630A (en) * 1984-10-11 1986-05-09 Citizen Watch Co Ltd Structure for mounting liquid crystal display device

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