JPS6426880U - - Google Patents
Info
- Publication number
- JPS6426880U JPS6426880U JP12153487U JP12153487U JPS6426880U JP S6426880 U JPS6426880 U JP S6426880U JP 12153487 U JP12153487 U JP 12153487U JP 12153487 U JP12153487 U JP 12153487U JP S6426880 U JPS6426880 U JP S6426880U
- Authority
- JP
- Japan
- Prior art keywords
- land
- board
- printed wiring
- wiring board
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例のプリント配線板を
説明するための一部断面側面図、第２図は第１図
の要部の拡大図、第３図ないし第６図はそれぞれ
第１図の絶縁保護層を説明するための平面図、第
７図は従来のプリント配線板を説明するための一
部断面側面図、第８図および第９図はそれぞれ第
７図の従来の絶縁保護層を説明するための平面図
である。
１１……部品、１２……リード、１３……プリ
ント基板、１３ａ……導体パターン、１４……ラ
ンド、１５……スルーホール、１６……ソルダー
レジスト、１７……絶縁保護層。
Fig. 1 is a partially sectional side view for explaining a printed wiring board according to an embodiment of the present invention, Fig. 2 is an enlarged view of the main part of Fig. 1, and Figs. 7 is a partially sectional side view illustrating the conventional printed wiring board, and FIGS. 8 and 9 are respectively the conventional insulation protection layer shown in FIG. 7. FIG. 3 is a plan view for explaining layers. 11...Component, 12...Lead, 13...Printed circuit board, 13a...Conductor pattern, 14...Land, 15...Through hole, 16...Solder resist, 17...Insulating protective layer.
Claims (1)
リードが挿入されるランドおよびこのランドに近
接して配線パターンが形成され前記ランドを除く
基板面をソルダーレジストで覆つてなるプリント
配線基板おいて、前記対向したランドを結ぶ線上
を含みこのランドの周辺部に所定の角度に渡つて
保護絶縁層を形成したことを特徴とするプリント
配線板。 A printed wiring board comprising a land formed opposite to a predetermined location of the board into which a lead of an electronic component is inserted, a wiring pattern formed in proximity to the land, and the board surface other than the land covered with a solder resist, A printed wiring board characterized in that a protective insulating layer is formed at a predetermined angle around the land including on the line connecting the opposing lands.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153487U JPS6426880U (en) | 1987-08-10 | 1987-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12153487U JPS6426880U (en) | 1987-08-10 | 1987-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6426880U true JPS6426880U (en) | 1989-02-15 |
Family
ID=31368627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12153487U Pending JPS6426880U (en) | 1987-08-10 | 1987-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6426880U (en) |
-
1987
- 1987-08-10 JP JP12153487U patent/JPS6426880U/ja active Pending