JPS6425979A - Sputtering device of planar magnetron system - Google Patents
Sputtering device of planar magnetron systemInfo
- Publication number
- JPS6425979A JPS6425979A JP11241388A JP11241388A JPS6425979A JP S6425979 A JPS6425979 A JP S6425979A JP 11241388 A JP11241388 A JP 11241388A JP 11241388 A JP11241388 A JP 11241388A JP S6425979 A JPS6425979 A JP S6425979A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic polar
- magnetic
- providing
- film thickness
- magnetomotive forces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To desirably change the magnetomotive forces of respective magnetic polar bodies and to obtain a sputtered film having distribution of uniform film thickness deposited on an objective substrate for film formation by providing a first-third magnetic polar bodies to the center part of a target material in a vacuum tank, the inner and outer parts around it and controlling them throughly separately. CONSTITUTION:The electrode part of the titled device is constituted by fixing a circular target plate 21 to a packing plate 22 made of copper which is provided with a flow path 34 for cooling to the rear side and made to a cathode e.g. by brazing and providing a magnetic field generating yoke 23, an inner electromagnet coil 24, an outer electromagnet coil 25, a central magnetic polar end 26, an inner magnetic polar end 27, an outer magnetic polar end 28, an electrode support 30, an O-ring 31, a shielding 32 made to an anode and insulating spaces 33 as a means for generating the prescribed magnetic flux distribution in the hollow space on a first main surface of the target plate 21 and providing a first-third magnetic polar bodies controllably so that required magnetomotive forces are generated. Then a sputtered film having uniform film thickness is formed by impressing voltage between the anode 32 and the cathode 22 and changing the magnetomotive forces of respective magnetic polar bodies independently and desirably and performing operation so as to form the required film thickness distribution on an objective substrate for film formation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11241388A JPS6425979A (en) | 1988-05-11 | 1988-05-11 | Sputtering device of planar magnetron system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11241388A JPS6425979A (en) | 1988-05-11 | 1988-05-11 | Sputtering device of planar magnetron system |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6425979A true JPS6425979A (en) | 1989-01-27 |
Family
ID=14586021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11241388A Pending JPS6425979A (en) | 1988-05-11 | 1988-05-11 | Sputtering device of planar magnetron system |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6425979A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5131818A (en) * | 1991-05-07 | 1992-07-21 | Hauhinco Maschinenfabrik G. Hausherr, Jochums Gmbh & Co. Kg | High-pressure water pump having a polyetheretherketone cylinder bushing for pure water |
CN108796468A (en) * | 2017-04-26 | 2018-11-13 | 冯·阿登纳资产股份有限公司 | vacuum chamber device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583976A (en) * | 1981-06-29 | 1983-01-10 | Hitachi Ltd | Method and device for formation of film by sputtering |
-
1988
- 1988-05-11 JP JP11241388A patent/JPS6425979A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS583976A (en) * | 1981-06-29 | 1983-01-10 | Hitachi Ltd | Method and device for formation of film by sputtering |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5131818A (en) * | 1991-05-07 | 1992-07-21 | Hauhinco Maschinenfabrik G. Hausherr, Jochums Gmbh & Co. Kg | High-pressure water pump having a polyetheretherketone cylinder bushing for pure water |
CN108796468A (en) * | 2017-04-26 | 2018-11-13 | 冯·阿登纳资产股份有限公司 | vacuum chamber device |
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