JPS6425440A - Circuit substrate - Google Patents

Circuit substrate

Info

Publication number
JPS6425440A
JPS6425440A JP18094187A JP18094187A JPS6425440A JP S6425440 A JPS6425440 A JP S6425440A JP 18094187 A JP18094187 A JP 18094187A JP 18094187 A JP18094187 A JP 18094187A JP S6425440 A JPS6425440 A JP S6425440A
Authority
JP
Japan
Prior art keywords
mesh
wirings
ground
signal wiring
electric characteristics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18094187A
Other languages
Japanese (ja)
Inventor
Takeshi Miyagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP18094187A priority Critical patent/JPS6425440A/en
Publication of JPS6425440A publication Critical patent/JPS6425440A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits

Abstract

PURPOSE:To reduce variations of characteristic impedance of wirings and to improve electric characteristics by forming a mesh shape of ground mesh wirings which cross a signal wiring in a longitudinally long rhombic structure in a direction parallel to the signal wiring. CONSTITUTION:When the crossing angle between ground mesh wirings 2-1, 2-2 and a signal wiring 1 is set to 45 deg. or less and the mesh shape of the ground mesh wirings is formed in a longitudinally long rhombic shape, the variations of characteristic impedance are reduced to obtain preferable electric characteristics. Further, since the electric characteristics are preferable even if the mesh ground is employed, the thickness of an insulating layer can be reduced to improve its yield.
JP18094187A 1987-07-22 1987-07-22 Circuit substrate Pending JPS6425440A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18094187A JPS6425440A (en) 1987-07-22 1987-07-22 Circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18094187A JPS6425440A (en) 1987-07-22 1987-07-22 Circuit substrate

Publications (1)

Publication Number Publication Date
JPS6425440A true JPS6425440A (en) 1989-01-27

Family

ID=16091954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18094187A Pending JPS6425440A (en) 1987-07-22 1987-07-22 Circuit substrate

Country Status (1)

Country Link
JP (1) JPS6425440A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2535381A1 (en) 2011-06-17 2012-12-19 Fujifilm Corporation Image forming method
JP2014027154A (en) * 2012-07-27 2014-02-06 Mitsubishi Electric Corp Semiconductor chip for flip-chip mounting
JP2019192786A (en) * 2018-04-25 2019-10-31 住友電工プリントサーキット株式会社 Flexible printed wiring board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2535381A1 (en) 2011-06-17 2012-12-19 Fujifilm Corporation Image forming method
JP2014027154A (en) * 2012-07-27 2014-02-06 Mitsubishi Electric Corp Semiconductor chip for flip-chip mounting
JP2019192786A (en) * 2018-04-25 2019-10-31 住友電工プリントサーキット株式会社 Flexible printed wiring board

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