JPS6424867U - - Google Patents
Info
- Publication number
- JPS6424867U JPS6424867U JP1987121546U JP12154687U JPS6424867U JP S6424867 U JPS6424867 U JP S6424867U JP 1987121546 U JP1987121546 U JP 1987121546U JP 12154687 U JP12154687 U JP 12154687U JP S6424867 U JPS6424867 U JP S6424867U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- emitting diode
- light
- content
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/281—Auxiliary members
- H10W72/283—Reinforcing structures, e.g. bump collars
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987121546U JPH0528782Y2 (https=) | 1987-08-05 | 1987-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987121546U JPH0528782Y2 (https=) | 1987-08-05 | 1987-08-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6424867U true JPS6424867U (https=) | 1989-02-10 |
| JPH0528782Y2 JPH0528782Y2 (https=) | 1993-07-23 |
Family
ID=31368647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987121546U Expired - Lifetime JPH0528782Y2 (https=) | 1987-08-05 | 1987-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528782Y2 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058882U (ja) * | 1991-07-19 | 1993-02-05 | 住友電装株式会社 | コネクタの接続検出装置 |
-
1987
- 1987-08-05 JP JP1987121546U patent/JPH0528782Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH058882U (ja) * | 1991-07-19 | 1993-02-05 | 住友電装株式会社 | コネクタの接続検出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528782Y2 (https=) | 1993-07-23 |
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