JPS642447U - - Google Patents

Info

Publication number
JPS642447U
JPS642447U JP9635287U JP9635287U JPS642447U JP S642447 U JPS642447 U JP S642447U JP 9635287 U JP9635287 U JP 9635287U JP 9635287 U JP9635287 U JP 9635287U JP S642447 U JPS642447 U JP S642447U
Authority
JP
Japan
Prior art keywords
curved surface
resin sealing
sealing member
semiconductor element
radius
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9635287U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9635287U priority Critical patent/JPS642447U/ja
Publication of JPS642447U publication Critical patent/JPS642447U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の第一の実施例を説明するため
のホトカツプラの断面図、第２図は本考案の第二
の実施例を説明するための光反射センサーの断面
図、第３図は従来の一例を説明するための半導体
装置の断面図、第４図は従来の半導体装置の製造
において割り型により形成される金型の断面図、
第５図は第４図と同様に従来の半導体装置の製造
において放電加工により形成される金型の断面図
である。 １……発光ダイオード、２……ホトトランジス
タ、３……金線、４……電極部材、５……第一の
樹脂封止材、６……第二の樹脂封止材、７……コ
ーナー部、８……突出部。

Claims (1)

  1. 【実用新案登録請求の範囲】 １ 半導体素子と、前記半導体素子を搭載し金属
    配線により接続した電極部材と、前記半導体素子
    および前記電極部材を封止し外形コーナー部もし
    くは突出部に所定半径以上の曲面を形成した第一
    の樹脂封止部材と、前記第一の樹脂封止部材をほ
    ぼ覆つて封止する第二の樹脂封止部材とを含むこ
    とを特徴とする半導体装置。 ２ 前記外形コーナー部もしくは突出部に形成す
    る曲面を半径０．３mm以上の曲面に形成した実用
    新案登録請求の範囲第１項記載の半導体装置。
JP9635287U 1987-06-22 1987-06-22 Pending JPS642447U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9635287U JPS642447U (ja) 1987-06-22 1987-06-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9635287U JPS642447U (ja) 1987-06-22 1987-06-22

Publications (1)

Publication Number Publication Date
JPS642447U true JPS642447U (ja) 1989-01-09

Family

ID=31321236

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9635287U Pending JPS642447U (ja) 1987-06-22 1987-06-22

Country Status (1)

Country Link
JP (1) JPS642447U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55166971A (en) * 1979-06-14 1980-12-26 Nec Corp Photocoupling device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55166971A (en) * 1979-06-14 1980-12-26 Nec Corp Photocoupling device

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