JPS6424449A - Manufacture of electric component using lead frame - Google Patents

Manufacture of electric component using lead frame

Info

Publication number
JPS6424449A
JPS6424449A JP18069087A JP18069087A JPS6424449A JP S6424449 A JPS6424449 A JP S6424449A JP 18069087 A JP18069087 A JP 18069087A JP 18069087 A JP18069087 A JP 18069087A JP S6424449 A JPS6424449 A JP S6424449A
Authority
JP
Japan
Prior art keywords
extension
parts
side edges
coupling band
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18069087A
Other languages
Japanese (ja)
Other versions
JPH0424865B2 (en
Inventor
Sadao Yoshida
Masaharu Yoshizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP18069087A priority Critical patent/JPS6424449A/en
Publication of JPS6424449A publication Critical patent/JPS6424449A/en
Publication of JPH0424865B2 publication Critical patent/JPH0424865B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Abstract

PURPOSE:To facilitate the insertion of lead extension parts into through holes of a circuit board without causing any step difference and burr regardless of a slip in cutting position by forming lead extension parts using a coupling band. CONSTITUTION:Recessions 16, 17 are previously provided on both side edges of regions of a coupling band 5 of leads 2-4. The coupling band 5 is cut- removed so that both side edges 20a, 20b of extension parts 2a-4a may be positioned between the extension lines of both side edges 18a, 18b of the narrow width parts 18 and the other extension lines of both edges 19a, 19b of the wide width parts 19 adjacent to the narrow width parts 18 when the extension parts 2a-4a of leads 2-4 are formed. At this time, the recessions 16, 17 prevent a step difference or a burring from occurring due to the position slip in case of cutting the coupling band 5. Furthermore, both side edges 20a, 20b of extension 2a-4a can be prevented from taking positions outside the extension of both side edges 19a, 19b of the wide width parts 19 of leads.
JP18069087A 1987-07-20 1987-07-20 Manufacture of electric component using lead frame Granted JPS6424449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18069087A JPS6424449A (en) 1987-07-20 1987-07-20 Manufacture of electric component using lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18069087A JPS6424449A (en) 1987-07-20 1987-07-20 Manufacture of electric component using lead frame

Publications (2)

Publication Number Publication Date
JPS6424449A true JPS6424449A (en) 1989-01-26
JPH0424865B2 JPH0424865B2 (en) 1992-04-28

Family

ID=16087603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18069087A Granted JPS6424449A (en) 1987-07-20 1987-07-20 Manufacture of electric component using lead frame

Country Status (1)

Country Link
JP (1) JPS6424449A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7961585B2 (en) 2007-12-13 2011-06-14 Panasonic Corporation Semiconductor device and optical pickup device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7961585B2 (en) 2007-12-13 2011-06-14 Panasonic Corporation Semiconductor device and optical pickup device

Also Published As

Publication number Publication date
JPH0424865B2 (en) 1992-04-28

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees