JPS6422744U - - Google Patents
Info
- Publication number
- JPS6422744U JPS6422744U JP11441687U JP11441687U JPS6422744U JP S6422744 U JPS6422744 U JP S6422744U JP 11441687 U JP11441687 U JP 11441687U JP 11441687 U JP11441687 U JP 11441687U JP S6422744 U JPS6422744 U JP S6422744U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- adhesive
- applying
- semi
- backed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11441687U JPS6422744U (ko) | 1987-07-24 | 1987-07-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11441687U JPS6422744U (ko) | 1987-07-24 | 1987-07-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6422744U true JPS6422744U (ko) | 1989-02-06 |
Family
ID=31355143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11441687U Pending JPS6422744U (ko) | 1987-07-24 | 1987-07-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6422744U (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02256251A (ja) * | 1988-09-27 | 1990-10-17 | Matsushita Electron Corp | 半導体装置の製造方法 |
US7387914B2 (en) | 1995-07-06 | 2008-06-17 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
JP2012174913A (ja) * | 2011-02-22 | 2012-09-10 | Denso Corp | 両面粘着物を有する構造体の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5028971A (ko) * | 1973-07-14 | 1975-03-24 |
-
1987
- 1987-07-24 JP JP11441687U patent/JPS6422744U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5028971A (ko) * | 1973-07-14 | 1975-03-24 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02256251A (ja) * | 1988-09-27 | 1990-10-17 | Matsushita Electron Corp | 半導体装置の製造方法 |
US7387914B2 (en) | 1995-07-06 | 2008-06-17 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
US7781896B2 (en) | 1995-07-06 | 2010-08-24 | Hitachi Chemical Co., Ltd. | Semiconductor device and process for fabrication thereof |
JP2012174913A (ja) * | 2011-02-22 | 2012-09-10 | Denso Corp | 両面粘着物を有する構造体の製造方法 |
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