JPS6422744U - - Google Patents

Info

Publication number
JPS6422744U
JPS6422744U JP11441687U JP11441687U JPS6422744U JP S6422744 U JPS6422744 U JP S6422744U JP 11441687 U JP11441687 U JP 11441687U JP 11441687 U JP11441687 U JP 11441687U JP S6422744 U JPS6422744 U JP S6422744U
Authority
JP
Japan
Prior art keywords
tape
adhesive
applying
semi
backed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11441687U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11441687U priority Critical patent/JPS6422744U/ja
Publication of JPS6422744U publication Critical patent/JPS6422744U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Die Bonding (AREA)
JP11441687U 1987-07-24 1987-07-24 Pending JPS6422744U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11441687U JPS6422744U (ko) 1987-07-24 1987-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11441687U JPS6422744U (ko) 1987-07-24 1987-07-24

Publications (1)

Publication Number Publication Date
JPS6422744U true JPS6422744U (ko) 1989-02-06

Family

ID=31355143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11441687U Pending JPS6422744U (ko) 1987-07-24 1987-07-24

Country Status (1)

Country Link
JP (1) JPS6422744U (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256251A (ja) * 1988-09-27 1990-10-17 Matsushita Electron Corp 半導体装置の製造方法
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
JP2012174913A (ja) * 2011-02-22 2012-09-10 Denso Corp 両面粘着物を有する構造体の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028971A (ko) * 1973-07-14 1975-03-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5028971A (ko) * 1973-07-14 1975-03-24

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02256251A (ja) * 1988-09-27 1990-10-17 Matsushita Electron Corp 半導体装置の製造方法
US7387914B2 (en) 1995-07-06 2008-06-17 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7781896B2 (en) 1995-07-06 2010-08-24 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
JP2012174913A (ja) * 2011-02-22 2012-09-10 Denso Corp 両面粘着物を有する構造体の製造方法

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