JPS6422375A - Treating device for resin film - Google Patents

Treating device for resin film

Info

Publication number
JPS6422375A
JPS6422375A JP62178904A JP17890487A JPS6422375A JP S6422375 A JPS6422375 A JP S6422375A JP 62178904 A JP62178904 A JP 62178904A JP 17890487 A JP17890487 A JP 17890487A JP S6422375 A JPS6422375 A JP S6422375A
Authority
JP
Japan
Prior art keywords
wafer
preheater
resin film
resin
laid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62178904A
Other languages
Japanese (ja)
Inventor
Kenji Jingu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62178904A priority Critical patent/JPS6422375A/en
Publication of JPS6422375A publication Critical patent/JPS6422375A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

PURPOSE:To prevent a material to be treated from being adhered by resin infiltrated to the back by providing a relief part on the outer circumferential part of a preheater to subject to baking treatment on resin film applied onto said material. CONSTITUTION:A wafer 1 to be the material to be treated is revolved as it is held in a vacuum state, coating material such as liquid photosensitive polyimide resin 17, etc., is dropped onto the center of the wafer and diffused to form resin film 18. Then, the wafer 1 is supplied to the preheater 22A on a 1st step in an oven 21 of a baking equipment 20 and laid there. Accordingly, the wafer 1 is heated effectively and uniformly by heat conduction of a preheater 22 to undergo baking treatment. At this time, the projection part 19 of resin formed by infiltration on the back of the wafer 1 at the time of application is dried without bringing into contact with the preheater 22A since the relief part 25 is cut and laid on the outer circumference of the upper surface of the heater body 23.
JP62178904A 1987-07-20 1987-07-20 Treating device for resin film Pending JPS6422375A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62178904A JPS6422375A (en) 1987-07-20 1987-07-20 Treating device for resin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62178904A JPS6422375A (en) 1987-07-20 1987-07-20 Treating device for resin film

Publications (1)

Publication Number Publication Date
JPS6422375A true JPS6422375A (en) 1989-01-25

Family

ID=16056718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62178904A Pending JPS6422375A (en) 1987-07-20 1987-07-20 Treating device for resin film

Country Status (1)

Country Link
JP (1) JPS6422375A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04300671A (en) * 1991-03-29 1992-10-23 Sharp Corp Heat-treating mechanism of applicator
JPH08252506A (en) * 1996-03-08 1996-10-01 Dainippon Screen Mfg Co Ltd Substrate treating device for forming silica film

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50141879A (en) * 1974-05-02 1975-11-14
JPS5573240A (en) * 1978-11-28 1980-06-02 Tokyo Shibaura Electric Co Measuring device of pulse frequency or respiratory frequency

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50141879A (en) * 1974-05-02 1975-11-14
JPS5573240A (en) * 1978-11-28 1980-06-02 Tokyo Shibaura Electric Co Measuring device of pulse frequency or respiratory frequency

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04300671A (en) * 1991-03-29 1992-10-23 Sharp Corp Heat-treating mechanism of applicator
JPH08252506A (en) * 1996-03-08 1996-10-01 Dainippon Screen Mfg Co Ltd Substrate treating device for forming silica film

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