JPS6421505U - - Google Patents
Info
- Publication number
- JPS6421505U JPS6421505U JP11541387U JP11541387U JPS6421505U JP S6421505 U JPS6421505 U JP S6421505U JP 11541387 U JP11541387 U JP 11541387U JP 11541387 U JP11541387 U JP 11541387U JP S6421505 U JPS6421505 U JP S6421505U
- Authority
- JP
- Japan
- Prior art keywords
- buffer plate
- metal container
- microwave
- lead terminals
- microwave device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Wire Bonding (AREA)
- Waveguide Connection Structure (AREA)
Description
図面は、本考案の実施例に係り、第1図は一実
施例の実装状態を示す縦断面図、第2図、第3図
は金属バツフア板の平面図、縦断面図、第4図は
上記と別の形状を有する金属バツフア板の平面図
である。
01……マイクロ波回路モジユール、02……
金属バツフア板、03……(マイクロ波装置の)
構体、05A,05B……入出力リード端子、0
6……マイクロ波集積回路、07A,07B……
マイクロ波伝送線路、11A,11B,21A,
21B……(金属バツフア板の)開孔部。
The drawings relate to an embodiment of the present invention, and FIG. 1 is a vertical sectional view showing the mounting state of one embodiment, FIGS. 2 and 3 are a plan view and a longitudinal sectional view of a metal buffer plate, and FIG. FIG. 7 is a plan view of a metal buffer plate having a shape different from that described above. 01...Microwave circuit module, 02...
Metal buffer plate, 03... (of microwave equipment)
Structure, 05A, 05B...Input/output lead terminal, 0
6...Microwave integrated circuit, 07A, 07B...
Microwave transmission line, 11A, 11B, 21A,
21B...Opening part (of the metal buffer plate).
Claims (1)
たマイクロ波回路モジユールを、該金属容器の底
面を構体の一平面と、板状の金属バツフア板を介
して固定したマイクロ波装置であつて、前記金属
バツフア板は、リード端子の貫通する開孔部のう
ち、少なくとも入出力端子リードに該当する1の
開孔部が周縁に櫛の歯状の形状の突起部を有し、
該突起部をたがいちがいに上下に屈曲し、ばね性
をもたせたものであることを特徴とするマイクロ
波装置。 A microwave device in which a microwave circuit module housed in a metal container having lead terminals on the bottom surface is fixed to the bottom surface of the metal container to one plane of the structure via a plate-shaped metal buffer plate, In the buffer plate, among the openings through which the lead terminals pass, at least one opening corresponding to the input/output terminal lead has a comb-shaped protrusion on the periphery;
A microwave device characterized in that the protrusions are bent vertically one after the other to provide spring properties.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11541387U JPS6421505U (en) | 1987-07-27 | 1987-07-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11541387U JPS6421505U (en) | 1987-07-27 | 1987-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6421505U true JPS6421505U (en) | 1989-02-02 |
Family
ID=31357047
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11541387U Pending JPS6421505U (en) | 1987-07-27 | 1987-07-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6421505U (en) |
-
1987
- 1987-07-27 JP JP11541387U patent/JPS6421505U/ja active Pending
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