JPS6419786A - Semiconductor laser package - Google Patents

Semiconductor laser package

Info

Publication number
JPS6419786A
JPS6419786A JP62174720A JP17472087A JPS6419786A JP S6419786 A JPS6419786 A JP S6419786A JP 62174720 A JP62174720 A JP 62174720A JP 17472087 A JP17472087 A JP 17472087A JP S6419786 A JPS6419786 A JP S6419786A
Authority
JP
Japan
Prior art keywords
cap
reference plane
sub
face
mount block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62174720A
Other languages
Japanese (ja)
Other versions
JPH0797690B2 (en
Inventor
Kazuo Shigeno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62174720A priority Critical patent/JPH0797690B2/en
Publication of JPS6419786A publication Critical patent/JPS6419786A/en
Publication of JPH0797690B2 publication Critical patent/JPH0797690B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To enable application of a package of this design to a device which demands a high precision by a method wherein at least one reference plane is formed with an accuracy of 1 deg. or higher in relative angle with reference to an element pellet mounting face on a sub-mount block and the element pellet is encapsulated in a cap taking advantage of the reference plane so as to improve the element pellet in angular accuracy with reference to the package. CONSTITUTION:A sub-mount block 7 of copper, of which section is a irregular shape, is fixed in a piece on the upper face of a stem base 1 through a Ag-Cu brazing. The sub-mount block 7 is composed of such a structure as an inner vertical face 7a of the sub-mount block is a mounting face for a semiconductor laser element pellet and an outer vertical face 7b facing the face 7a is a reference plane used for an angle alignment. These faces 7a and 7b are structured with the accuracy by 1 deg. or less in a relative angle as parallel planes. When the stem which is structured as mentioned above is encapsulated in a cap (not shown in Figure), the stem is fixed after an angle alignment of it is performed as a reference plane jig is pressed against the reference plane 7b firmly not producing the looseness and thereafter the cap is put on after the jig is taken off and the angle alignment of the cap is also performed, then the cap is encapsulated as it is clamped.
JP62174720A 1987-07-15 1987-07-15 Semiconductor laser container Expired - Lifetime JPH0797690B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62174720A JPH0797690B2 (en) 1987-07-15 1987-07-15 Semiconductor laser container

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62174720A JPH0797690B2 (en) 1987-07-15 1987-07-15 Semiconductor laser container

Publications (2)

Publication Number Publication Date
JPS6419786A true JPS6419786A (en) 1989-01-23
JPH0797690B2 JPH0797690B2 (en) 1995-10-18

Family

ID=15983471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62174720A Expired - Lifetime JPH0797690B2 (en) 1987-07-15 1987-07-15 Semiconductor laser container

Country Status (1)

Country Link
JP (1) JPH0797690B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61153360U (en) * 1985-03-14 1986-09-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61153360U (en) * 1985-03-14 1986-09-22

Also Published As

Publication number Publication date
JPH0797690B2 (en) 1995-10-18

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