JPS6419735A - Adhesive tape for die-bonding - Google Patents

Adhesive tape for die-bonding

Info

Publication number
JPS6419735A
JPS6419735A JP62174826A JP17482687A JPS6419735A JP S6419735 A JPS6419735 A JP S6419735A JP 62174826 A JP62174826 A JP 62174826A JP 17482687 A JP17482687 A JP 17482687A JP S6419735 A JPS6419735 A JP S6419735A
Authority
JP
Japan
Prior art keywords
bonding
agent
die
adhesive
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62174826A
Other languages
English (en)
Other versions
JPH0628269B2 (ja
Inventor
Yukinori Sakumoto
Atsushi Koshimura
Hiroshi Matsushita
Masaki Tsushima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tomoegawa Co Ltd
Original Assignee
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tomoegawa Paper Co Ltd filed Critical Tomoegawa Paper Co Ltd
Priority to JP62174826A priority Critical patent/JPH0628269B2/ja
Priority to KR1019870009633A priority patent/KR960002767B1/ko
Publication of JPS6419735A publication Critical patent/JPS6419735A/ja
Priority to US07/325,090 priority patent/US4933219A/en
Publication of JPH0628269B2 publication Critical patent/JPH0628269B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP62174826A 1987-07-15 1987-07-15 ダイボンデイング用接着テ−プ Expired - Fee Related JPH0628269B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP62174826A JPH0628269B2 (ja) 1987-07-15 1987-07-15 ダイボンデイング用接着テ−プ
KR1019870009633A KR960002767B1 (ko) 1987-07-15 1987-09-01 다이 결합용 접착 테이프
US07/325,090 US4933219A (en) 1987-07-15 1989-03-20 Adhesive tapes for die bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62174826A JPH0628269B2 (ja) 1987-07-15 1987-07-15 ダイボンデイング用接着テ−プ

Publications (2)

Publication Number Publication Date
JPS6419735A true JPS6419735A (en) 1989-01-23
JPH0628269B2 JPH0628269B2 (ja) 1994-04-13

Family

ID=15985336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62174826A Expired - Fee Related JPH0628269B2 (ja) 1987-07-15 1987-07-15 ダイボンデイング用接着テ−プ

Country Status (3)

Country Link
US (1) US4933219A (ja)
JP (1) JPH0628269B2 (ja)
KR (1) KR960002767B1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100311820B1 (ko) * 1999-12-08 2001-10-17 이형도 연성기판의 엠보싱 스페이서
US6716674B2 (en) 2000-09-11 2004-04-06 Texas Instruments Incorporated Method of forming a semiconductor package
US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6946328B2 (en) 2003-08-11 2005-09-20 Samsung Electronics Co. Ltd. Method for manufacturing semiconductor devices

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7575653B2 (en) * 1993-04-15 2009-08-18 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US6485589B1 (en) 1993-04-15 2002-11-26 3M Innovative Properties Company Melt-flowable materials and method of sealing surfaces
US5436063A (en) * 1993-04-15 1995-07-25 Minnesota Mining And Manufacturing Company Coated abrasive article incorporating an energy cured hot melt make coat
KR0137826B1 (ko) * 1994-11-15 1998-04-28 문정환 반도체 디바이스 패키지 방법 및 디바이스 패키지
WO1996029730A1 (fr) 1994-12-26 1996-09-26 Hitachi Chemical Company, Ltd. Procede de stratification utilisant un film de stratification en un materiau organique adherant a la matrice, procede d'adhesion a la matrice, dispositif de stratification, dispositif d'adhesion a la matrice, dispositif semi-conducteur et procede pour fabriquer le dispositif semi-conducteur
JP3535281B2 (ja) * 1995-08-31 2004-06-07 株式会社巴川製紙所 電子部品用接着テープ及び液状接着剤
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JP3898958B2 (ja) * 2002-02-18 2007-03-28 ソニーケミカル＆インフォメーションデバイス株式会社 異方導電性接着剤及び電気装置

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JPS6049636A (ja) * 1983-08-29 1985-03-18 Sumitomo Bakelite Co Ltd チップのマウント方法

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US6717242B2 (en) 1995-07-06 2004-04-06 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US6855579B2 (en) 1995-07-06 2005-02-15 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7012320B2 (en) 1995-07-06 2006-03-14 Hitachi Chemical Company, Ltd. Semiconductor device and process for fabrication thereof
US7057265B2 (en) 1995-07-06 2006-06-06 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
US7078094B2 (en) 1995-07-06 2006-07-18 Hitachi Chemical Co., Ltd. Semiconductor device and process for fabrication thereof
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US6716674B2 (en) 2000-09-11 2004-04-06 Texas Instruments Incorporated Method of forming a semiconductor package
US6774496B2 (en) 2000-09-11 2004-08-10 Texas Instruments Incorporated Semiconductor package with a thermoset bond
US6946328B2 (en) 2003-08-11 2005-09-20 Samsung Electronics Co. Ltd. Method for manufacturing semiconductor devices

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KR960002767B1 (ko) 1996-02-26
JPH0628269B2 (ja) 1994-04-13
US4933219A (en) 1990-06-12
KR890003024A (ko) 1989-04-12

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