JPS6418745U - - Google Patents
Info
- Publication number
- JPS6418745U JPS6418745U JP1987114427U JP11442787U JPS6418745U JP S6418745 U JPS6418745 U JP S6418745U JP 1987114427 U JP1987114427 U JP 1987114427U JP 11442787 U JP11442787 U JP 11442787U JP S6418745 U JPS6418745 U JP S6418745U
- Authority
- JP
- Japan
- Prior art keywords
- insulating member
- ceramic insulating
- heat sink
- interposed
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000008188 pellet Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000009413 insulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987114427U JPS6418745U (it) | 1987-07-24 | 1987-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987114427U JPS6418745U (it) | 1987-07-24 | 1987-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418745U true JPS6418745U (it) | 1989-01-30 |
Family
ID=31355166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987114427U Pending JPS6418745U (it) | 1987-07-24 | 1987-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418745U (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7388573B1 (en) * | 1991-12-17 | 2008-06-17 | Sony Corporation | Audio equipment and method of displaying operation thereof |
-
1987
- 1987-07-24 JP JP1987114427U patent/JPS6418745U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7388573B1 (en) * | 1991-12-17 | 2008-06-17 | Sony Corporation | Audio equipment and method of displaying operation thereof |