JPS6418600A - Flux for soldering - Google Patents

Flux for soldering

Info

Publication number
JPS6418600A
JPS6418600A JP17307887A JP17307887A JPS6418600A JP S6418600 A JPS6418600 A JP S6418600A JP 17307887 A JP17307887 A JP 17307887A JP 17307887 A JP17307887 A JP 17307887A JP S6418600 A JPS6418600 A JP S6418600A
Authority
JP
Japan
Prior art keywords
flux
activator
group
compound
molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17307887A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0217279B2 (enrdf_load_stackoverflow
Inventor
Yusuke Iida
Takeshi Sakamoto
Noriyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NIPPON ALMIT KK
NIPPON ARUMITSUTO KK
Original Assignee
NIPPON ALMIT KK
NIPPON ARUMITSUTO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NIPPON ALMIT KK, NIPPON ARUMITSUTO KK filed Critical NIPPON ALMIT KK
Priority to JP17307887A priority Critical patent/JPS6418600A/ja
Publication of JPS6418600A publication Critical patent/JPS6418600A/ja
Publication of JPH0217279B2 publication Critical patent/JPH0217279B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP17307887A 1987-07-13 1987-07-13 Flux for soldering Granted JPS6418600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17307887A JPS6418600A (en) 1987-07-13 1987-07-13 Flux for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17307887A JPS6418600A (en) 1987-07-13 1987-07-13 Flux for soldering

Publications (2)

Publication Number Publication Date
JPS6418600A true JPS6418600A (en) 1989-01-23
JPH0217279B2 JPH0217279B2 (enrdf_load_stackoverflow) 1990-04-19

Family

ID=15953795

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17307887A Granted JPS6418600A (en) 1987-07-13 1987-07-13 Flux for soldering

Country Status (1)

Country Link
JP (1) JPS6418600A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919317A (en) * 1994-12-07 1999-07-06 Nippondenso Co., Ltd. Soldering flux, soldering paste and soldering method using the same
US6218030B1 (en) 1995-03-24 2001-04-17 Nippondenso Co., Ltd. Soldered product
WO2002089152A1 (en) * 2001-04-25 2002-11-07 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices
US6488781B1 (en) 1998-08-27 2002-12-03 Denso Corporation Soldering paste, soldering method, and surface-mounted type electronic device
US6605357B1 (en) 1999-07-28 2003-08-12 Denso Corporation Bonding method and bonding structure of thermoplastic resin material

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100553772B1 (ko) 2004-08-05 2006-02-21 삼성에스디아이 주식회사 플라즈마 디스플레이 패널구동방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127096A (ja) * 1983-12-12 1985-07-06 Nippon Telegr & Teleph Corp <Ntt> マイクロエレクトロニクス部品接合用フラツクス

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60127096A (ja) * 1983-12-12 1985-07-06 Nippon Telegr & Teleph Corp <Ntt> マイクロエレクトロニクス部品接合用フラツクス

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5919317A (en) * 1994-12-07 1999-07-06 Nippondenso Co., Ltd. Soldering flux, soldering paste and soldering method using the same
US6142363A (en) * 1994-12-07 2000-11-07 Nippondenso Co., Ltd. Soldering method using soldering flux and soldering paste
US6218030B1 (en) 1995-03-24 2001-04-17 Nippondenso Co., Ltd. Soldered product
US6562147B2 (en) 1995-03-24 2003-05-13 Denso Corporation Soldered product
US6488781B1 (en) 1998-08-27 2002-12-03 Denso Corporation Soldering paste, soldering method, and surface-mounted type electronic device
US6605357B1 (en) 1999-07-28 2003-08-12 Denso Corporation Bonding method and bonding structure of thermoplastic resin material
WO2002089152A1 (en) * 2001-04-25 2002-11-07 National Starch And Chemical Investment Holding Corporation Conductive materials with electrical stability for use in electronics devices

Also Published As

Publication number Publication date
JPH0217279B2 (enrdf_load_stackoverflow) 1990-04-19

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