JPS6418600A - Flux for soldering - Google Patents
Flux for solderingInfo
- Publication number
- JPS6418600A JPS6418600A JP17307887A JP17307887A JPS6418600A JP S6418600 A JPS6418600 A JP S6418600A JP 17307887 A JP17307887 A JP 17307887A JP 17307887 A JP17307887 A JP 17307887A JP S6418600 A JPS6418600 A JP S6418600A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- activator
- group
- compound
- molecule
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 title abstract 6
- 238000005476 soldering Methods 0.000 title abstract 2
- 239000012190 activator Substances 0.000 abstract 6
- 150000001875 compounds Chemical class 0.000 abstract 3
- 125000000524 functional group Chemical group 0.000 abstract 3
- 150000002894 organic compounds Chemical class 0.000 abstract 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 2
- 125000004433 nitrogen atom Chemical group N* 0.000 abstract 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 2
- VTWKXBJHBHYJBI-SOFGYWHQSA-N (ne)-n-benzylidenehydroxylamine Chemical compound O\N=C\C1=CC=CC=C1 VTWKXBJHBHYJBI-SOFGYWHQSA-N 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 150000002923 oximes Chemical class 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17307887A JPS6418600A (en) | 1987-07-13 | 1987-07-13 | Flux for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17307887A JPS6418600A (en) | 1987-07-13 | 1987-07-13 | Flux for soldering |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6418600A true JPS6418600A (en) | 1989-01-23 |
JPH0217279B2 JPH0217279B2 (enrdf_load_stackoverflow) | 1990-04-19 |
Family
ID=15953795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17307887A Granted JPS6418600A (en) | 1987-07-13 | 1987-07-13 | Flux for soldering |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6418600A (enrdf_load_stackoverflow) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5919317A (en) * | 1994-12-07 | 1999-07-06 | Nippondenso Co., Ltd. | Soldering flux, soldering paste and soldering method using the same |
US6218030B1 (en) | 1995-03-24 | 2001-04-17 | Nippondenso Co., Ltd. | Soldered product |
WO2002089152A1 (en) * | 2001-04-25 | 2002-11-07 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
US6488781B1 (en) | 1998-08-27 | 2002-12-03 | Denso Corporation | Soldering paste, soldering method, and surface-mounted type electronic device |
US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100553772B1 (ko) | 2004-08-05 | 2006-02-21 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널구동방법 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127096A (ja) * | 1983-12-12 | 1985-07-06 | Nippon Telegr & Teleph Corp <Ntt> | マイクロエレクトロニクス部品接合用フラツクス |
-
1987
- 1987-07-13 JP JP17307887A patent/JPS6418600A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60127096A (ja) * | 1983-12-12 | 1985-07-06 | Nippon Telegr & Teleph Corp <Ntt> | マイクロエレクトロニクス部品接合用フラツクス |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5919317A (en) * | 1994-12-07 | 1999-07-06 | Nippondenso Co., Ltd. | Soldering flux, soldering paste and soldering method using the same |
US6142363A (en) * | 1994-12-07 | 2000-11-07 | Nippondenso Co., Ltd. | Soldering method using soldering flux and soldering paste |
US6218030B1 (en) | 1995-03-24 | 2001-04-17 | Nippondenso Co., Ltd. | Soldered product |
US6562147B2 (en) | 1995-03-24 | 2003-05-13 | Denso Corporation | Soldered product |
US6488781B1 (en) | 1998-08-27 | 2002-12-03 | Denso Corporation | Soldering paste, soldering method, and surface-mounted type electronic device |
US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
WO2002089152A1 (en) * | 2001-04-25 | 2002-11-07 | National Starch And Chemical Investment Holding Corporation | Conductive materials with electrical stability for use in electronics devices |
Also Published As
Publication number | Publication date |
---|---|
JPH0217279B2 (enrdf_load_stackoverflow) | 1990-04-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |