JPS6415936A - Production device for semiconductor device - Google Patents
Production device for semiconductor deviceInfo
- Publication number
- JPS6415936A JPS6415936A JP17217987A JP17217987A JPS6415936A JP S6415936 A JPS6415936 A JP S6415936A JP 17217987 A JP17217987 A JP 17217987A JP 17217987 A JP17217987 A JP 17217987A JP S6415936 A JPS6415936 A JP S6415936A
- Authority
- JP
- Japan
- Prior art keywords
- treating
- dehydrating
- solution
- semiconductor
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To prevent scattering onto the surface of a semiconductor wafer of the droplet of a dehydrating treating solution by installing a filter section between the dehydrating treating solution and a semiconductor wafer treating section. CONSTITUTION:In an example in which a dehydrating treating solution 4 and a semiconductor wafer are made to coexist in the same sealed vessel, the dehydrating treating solution 4 such as alcohol solution of hexamethyldisilaxane, etc., is bubbled with nitrogen gas (hereinafter called N2) in a solution tank 5, thus promoting the vaporization of the dehydrating treating solution 4. Several dozen semiconductor wafers 1 are positioned into a sealed vessel 3 by a fixture 2. The vaporized particles of the dehydrating treating liquid 4 generated by the bubbling of N2 pass through a filter section 6 consisting of three plates 6, spaces of which are formed alternately, and reach a semiconductor-wafer treating section. On the other hand, droplets generated by the explosion of bubbles on the surface of the dehydrating treating liquid 4 are trapped by the filter section 6, and do not reach the semiconductor-wafer 1 treating section. A mesh, etc., may be used as the shape of the filter section 6 at that time.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17217987A JPS6415936A (en) | 1987-07-10 | 1987-07-10 | Production device for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17217987A JPS6415936A (en) | 1987-07-10 | 1987-07-10 | Production device for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6415936A true JPS6415936A (en) | 1989-01-19 |
Family
ID=15937041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17217987A Pending JPS6415936A (en) | 1987-07-10 | 1987-07-10 | Production device for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6415936A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8268078B2 (en) * | 2006-03-16 | 2012-09-18 | Tokyo Electron Limited | Method and apparatus for reducing particle contamination in a deposition system |
-
1987
- 1987-07-10 JP JP17217987A patent/JPS6415936A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8268078B2 (en) * | 2006-03-16 | 2012-09-18 | Tokyo Electron Limited | Method and apparatus for reducing particle contamination in a deposition system |
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