JPS6413146U - - Google Patents
Info
- Publication number
- JPS6413146U JPS6413146U JP10543187U JP10543187U JPS6413146U JP S6413146 U JPS6413146 U JP S6413146U JP 10543187 U JP10543187 U JP 10543187U JP 10543187 U JP10543187 U JP 10543187U JP S6413146 U JPS6413146 U JP S6413146U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit element
- notch
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W70/682—
-
- H10W70/685—
-
- H10W90/737—
-
- H10W90/754—
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10543187U JPS6413146U (cg-RX-API-DMAC10.html) | 1987-07-09 | 1987-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10543187U JPS6413146U (cg-RX-API-DMAC10.html) | 1987-07-09 | 1987-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413146U true JPS6413146U (cg-RX-API-DMAC10.html) | 1989-01-24 |
Family
ID=31338038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10543187U Pending JPS6413146U (cg-RX-API-DMAC10.html) | 1987-07-09 | 1987-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413146U (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156610A (ja) * | 2004-11-29 | 2006-06-15 | Nidec Copal Electronics Corp | 回路基板 |
| JP2009123736A (ja) * | 2007-11-12 | 2009-06-04 | Nec Corp | デバイスの実装構造及びデバイスの実装方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141576A (en) * | 1977-05-16 | 1978-12-09 | Matsushita Electric Ind Co Ltd | Fixing device of semiconductor |
| JPS5946087A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板 |
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
-
1987
- 1987-07-09 JP JP10543187U patent/JPS6413146U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53141576A (en) * | 1977-05-16 | 1978-12-09 | Matsushita Electric Ind Co Ltd | Fixing device of semiconductor |
| JPS5946087A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板 |
| JPS5946086A (ja) * | 1982-09-09 | 1984-03-15 | イビデン株式会社 | プリント配線基板とその製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006156610A (ja) * | 2004-11-29 | 2006-06-15 | Nidec Copal Electronics Corp | 回路基板 |
| JP2009123736A (ja) * | 2007-11-12 | 2009-06-04 | Nec Corp | デバイスの実装構造及びデバイスの実装方法 |