JPH0236037U - - Google Patents

Info

Publication number
JPH0236037U
JPH0236037U JP1988115358U JP11535888U JPH0236037U JP H0236037 U JPH0236037 U JP H0236037U JP 1988115358 U JP1988115358 U JP 1988115358U JP 11535888 U JP11535888 U JP 11535888U JP H0236037 U JPH0236037 U JP H0236037U
Authority
JP
Japan
Prior art keywords
recess
wiring board
printed wiring
insulating substrate
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988115358U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988115358U priority Critical patent/JPH0236037U/ja
Publication of JPH0236037U publication Critical patent/JPH0236037U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30
    • H10W72/536
    • H10W72/5363

Landscapes

  • Structure Of Printed Boards (AREA)
  • Die Bonding (AREA)
JP1988115358U 1988-08-31 1988-08-31 Pending JPH0236037U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988115358U JPH0236037U (cg-RX-API-DMAC10.html) 1988-08-31 1988-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988115358U JPH0236037U (cg-RX-API-DMAC10.html) 1988-08-31 1988-08-31

Publications (1)

Publication Number Publication Date
JPH0236037U true JPH0236037U (cg-RX-API-DMAC10.html) 1990-03-08

Family

ID=31356946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988115358U Pending JPH0236037U (cg-RX-API-DMAC10.html) 1988-08-31 1988-08-31

Country Status (1)

Country Link
JP (1) JPH0236037U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008131039A (ja) * 2006-11-21 2008-06-05 Samsung Electro-Mechanics Co Ltd 電子素子内蔵型印刷回路基板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008131039A (ja) * 2006-11-21 2008-06-05 Samsung Electro-Mechanics Co Ltd 電子素子内蔵型印刷回路基板の製造方法

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