JPS6412101B2 - - Google Patents

Info

Publication number
JPS6412101B2
JPS6412101B2 JP58182788A JP18278883A JPS6412101B2 JP S6412101 B2 JPS6412101 B2 JP S6412101B2 JP 58182788 A JP58182788 A JP 58182788A JP 18278883 A JP18278883 A JP 18278883A JP S6412101 B2 JPS6412101 B2 JP S6412101B2
Authority
JP
Japan
Prior art keywords
container
module
refrigerant
heat
airtight container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58182788A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6074656A (ja
Inventor
Masaru Ishizuka
Yoshiro Myazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP58182788A priority Critical patent/JPS6074656A/ja
Publication of JPS6074656A publication Critical patent/JPS6074656A/ja
Publication of JPS6412101B2 publication Critical patent/JPS6412101B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58182788A 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器 Granted JPS6074656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58182788A JPS6074656A (ja) 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58182788A JPS6074656A (ja) 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器

Publications (2)

Publication Number Publication Date
JPS6074656A JPS6074656A (ja) 1985-04-26
JPS6412101B2 true JPS6412101B2 (enExample) 1989-02-28

Family

ID=16124424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58182788A Granted JPS6074656A (ja) 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器

Country Status (1)

Country Link
JP (1) JPS6074656A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11411156B2 (en) 2017-03-21 2022-08-09 Nec Corporation Heat exchange device, heat exchange system, and heat exchange method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147751U (enExample) * 1979-04-10 1980-10-23

Also Published As

Publication number Publication date
JPS6074656A (ja) 1985-04-26

Similar Documents

Publication Publication Date Title
US11688664B2 (en) Semiconductor device assembly with through-mold cooling channel formed in encapsulant
US10816275B2 (en) Semiconductor device assembly with vapor chamber
US10930579B2 (en) Self-contained liquid cooled semiconductor packaging
US5168919A (en) Air cooled heat exchanger for multi-chip assemblies
US5436793A (en) Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
US5396947A (en) Radiating device
US6081037A (en) Semiconductor component having a semiconductor chip mounted to a chip mount
US6749013B2 (en) Heat sink
US20140015119A1 (en) Semiconductor device/electronic component mounting structure
KR0121438B1 (ko) 반도체 장치
JP4278720B2 (ja) 板型ヒートパイプ
US20050034841A1 (en) Integral chip lid and heat sink
US5477084A (en) Microelectronic device packaging containing a liquid and method
US7327028B2 (en) Embedded heat spreader for folded stacked chip-scale package
US12315781B2 (en) Heat spreader for a semiconductor package
JPS6412101B2 (enExample)
JPH0342512B2 (enExample)
JPS6142864B2 (enExample)
US20250364362A1 (en) Hybrid Vapor Chamber Lid
US20250372475A1 (en) Heat-Dissipating Lid Module
JPS61114563A (ja) 集積回路容器
JPS5911515Y2 (ja) 液体含有冷却器
JPS6243346B2 (enExample)
JP2768018B2 (ja) 半導体素子実装体
JPH0529512A (ja) 電子部品パツケージ