JPS6074656A - Ｉｃモジユ−ル用放熱器 - Google Patents

Ｉｃモジユ−ル用放熱器

Info

Publication number
JPS6074656A
JPS6074656A JP58182788A JP18278883A JPS6074656A JP S6074656 A JPS6074656 A JP S6074656A JP 58182788 A JP58182788 A JP 58182788A JP 18278883 A JP18278883 A JP 18278883A JP S6074656 A JPS6074656 A JP S6074656A
Authority
JP
Japan
Prior art keywords
container
module
modules
planes
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58182788A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6412101B2 (enExample
Inventor
Masaru Ishizuka
勝 石塚
Yoshiro Miyazaki
芳郎 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58182788A priority Critical patent/JPS6074656A/ja
Publication of JPS6074656A publication Critical patent/JPS6074656A/ja
Publication of JPS6412101B2 publication Critical patent/JPS6412101B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58182788A 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器 Granted JPS6074656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58182788A JPS6074656A (ja) 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58182788A JPS6074656A (ja) 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器

Publications (2)

Publication Number Publication Date
JPS6074656A true JPS6074656A (ja) 1985-04-26
JPS6412101B2 JPS6412101B2 (enExample) 1989-02-28

Family

ID=16124424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58182788A Granted JPS6074656A (ja) 1983-09-30 1983-09-30 Ｉｃモジユ−ル用放熱器

Country Status (1)

Country Link
JP (1) JPS6074656A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11411156B2 (en) 2017-03-21 2022-08-09 Nec Corporation Heat exchange device, heat exchange system, and heat exchange method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147751U (enExample) * 1979-04-10 1980-10-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55147751U (enExample) * 1979-04-10 1980-10-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11411156B2 (en) 2017-03-21 2022-08-09 Nec Corporation Heat exchange device, heat exchange system, and heat exchange method

Also Published As

Publication number Publication date
JPS6412101B2 (enExample) 1989-02-28

Similar Documents

Publication Publication Date Title
US10816275B2 (en) Semiconductor device assembly with vapor chamber
US11832419B2 (en) Full package vapor chamber with IHS
US10622283B2 (en) Self-contained liquid cooled semiconductor packaging
US5168919A (en) Air cooled heat exchanger for multi-chip assemblies
US7545647B2 (en) Compliant thermal interface structure utilizing spring elements
US20140015119A1 (en) Semiconductor device/electronic component mounting structure
CN109962043A (zh) 电子装置
US11239133B2 (en) Apparatus and method for dissipating heat in multiple semiconductor device modules
US12199001B2 (en) Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same
US20050088823A1 (en) Variable density graphite foam heat sink
US20050274487A1 (en) Method and apparatus for reducing thermal resistance in a vertical heat sink assembly
US20080142192A1 (en) Heat dissipation device with a heat pipe
US5477084A (en) Microelectronic device packaging containing a liquid and method
GB2342152A (en) Plate type heat pipe and its installation structure
US7227257B2 (en) Cooling micro-channels
JP5018555B2 (ja) 冷却モジュール及び複合実装基板
US20060227515A1 (en) Cooling apparatus for electronic device
JPS6074656A (ja) Ｉｃモジユ−ル用放熱器
JPS60254641A (ja) 液体封入型パツケ−ジ
JPH07112029B2 (ja) 電子部品冷却装置
JPS6285449A (ja) 半導体装置の冷却構造
WO2018179162A1 (ja) 冷却装置
JPS6142864B2 (enExample)
US20250336755A1 (en) Semiconductor package with double-sided thermal solution and method for forming the same
JPH0320070B2 (enExample)