JPS6411932A - High pure oxygen-free copper and its use - Google Patents

High pure oxygen-free copper and its use

Info

Publication number
JPS6411932A
JPS6411932A JP16839087A JP16839087A JPS6411932A JP S6411932 A JPS6411932 A JP S6411932A JP 16839087 A JP16839087 A JP 16839087A JP 16839087 A JP16839087 A JP 16839087A JP S6411932 A JPS6411932 A JP S6411932A
Authority
JP
Japan
Prior art keywords
oxygen
free copper
high pure
pure oxygen
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16839087A
Other languages
English (en)
Inventor
Shuji Sakai
Yasumutsu Nagai
Yutaka Ouchi
Akio Sugino
Kazuo Kimijima
Shinichi Nishiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP16839087A priority Critical patent/JPS6411932A/ja
Publication of JPS6411932A publication Critical patent/JPS6411932A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Manufacture And Refinement Of Metals (AREA)
JP16839087A 1987-07-06 1987-07-06 High pure oxygen-free copper and its use Pending JPS6411932A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16839087A JPS6411932A (en) 1987-07-06 1987-07-06 High pure oxygen-free copper and its use

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16839087A JPS6411932A (en) 1987-07-06 1987-07-06 High pure oxygen-free copper and its use

Publications (1)

Publication Number Publication Date
JPS6411932A true JPS6411932A (en) 1989-01-17

Family

ID=15867224

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16839087A Pending JPS6411932A (en) 1987-07-06 1987-07-06 High pure oxygen-free copper and its use

Country Status (1)

Country Link
JP (1) JPS6411932A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02263959A (ja) * 1989-04-04 1990-10-26 Hitachi Cable Ltd 無酸素銅圧延箔およびそれを用いたフレキシブルプリント基板
JPH0533141U (ja) * 1991-10-09 1993-04-30 旭光学工業株式会社 一眼レフレツクスカメラ
DE102004010040A1 (de) * 2004-03-02 2005-09-15 Norddeutsche Affinerie Ag Kupferdraht sowie Verfahren und Vorrichtung zur Herstellung eines Kupferdrahtes
JP2008255418A (ja) * 2007-04-05 2008-10-23 Hitachi Cable Ltd 銅材の製造方法及び銅材

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02263959A (ja) * 1989-04-04 1990-10-26 Hitachi Cable Ltd 無酸素銅圧延箔およびそれを用いたフレキシブルプリント基板
JPH0533141U (ja) * 1991-10-09 1993-04-30 旭光学工業株式会社 一眼レフレツクスカメラ
DE102004010040A1 (de) * 2004-03-02 2005-09-15 Norddeutsche Affinerie Ag Kupferdraht sowie Verfahren und Vorrichtung zur Herstellung eines Kupferdrahtes
JP2008255418A (ja) * 2007-04-05 2008-10-23 Hitachi Cable Ltd 銅材の製造方法及び銅材

Similar Documents

Publication Publication Date Title
JP2000015476A (ja) 無鉛はんだ
GB2433944A (en) Solder alloy
MY122835A (en) A control method for copper density in a solder dipping bath
KR100328157B1 (ko) 카드뮴부재땜납용은합금
JPS6411932A (en) High pure oxygen-free copper and its use
ATE334775T1 (de) Bleifreies weichlot
ATE284294T1 (de) Bleifreie lötlegierung und deren verwendung in elektronischen bauelementen
JP3768849B2 (ja) 半田ごて用の半田
JPS572849A (en) Copper alloy for electronic parts
JPS5568663A (en) Lead wire material for ic
JP3601278B2 (ja) はんだ材料
JP4338854B2 (ja) スズ−ビスマス系無鉛はんだ
JPS57108235A (en) Copper alloy for lead frame
US2196304A (en) Copper silver alloy
JPS644445A (en) Copper alloy for terminal-connector
JPS6452034A (en) Copper alloy for terminal and connector
JPS57152437A (en) Low grade gold alloy
JPS5511145A (en) Heat resisting high conductive copper alloy
JPS648237A (en) Copper alloy for terminal and connector
JPS56144893A (en) Solder alloy for fitting lead on silver electrode
KR100232524B1 (ko) 고강도 무연 땜납용 재료
KR100220801B1 (ko) 솔더 조성물
SU667365A1 (ru) Флюс дл лужени и пайки
JPS57169048A (en) High strength copper alloy with high electric conductivity
JPS57158349A (en) Copper alloy for resistance