JPS6411572U - - Google Patents

Info

Publication number
JPS6411572U
JPS6411572U JP10413087U JP10413087U JPS6411572U JP S6411572 U JPS6411572 U JP S6411572U JP 10413087 U JP10413087 U JP 10413087U JP 10413087 U JP10413087 U JP 10413087U JP S6411572 U JPS6411572 U JP S6411572U
Authority
JP
Japan
Prior art keywords
circuit
groove
conductive
circuit groove
carved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10413087U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10413087U priority Critical patent/JPS6411572U/ja
Publication of JPS6411572U publication Critical patent/JPS6411572U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図はいずれも本案実施例を説明するもので、第
1図は平面図、第2図は、第1図の−断面図
、第3図は、第2図の部分拡大図であつて、引用
数字は、いずれも下記のものを示す。 1…回路溝、2…底面、3…電導回路、4…回
路表面、5…絶縁板表面、6…絶縁板。
The figures are for explaining the embodiment of the present invention, and Fig. 1 is a plan view, Fig. 2 is a cross-sectional view of Fig. 1, and Fig. 3 is a partially enlarged view of Fig. 2. All numbers indicate the following. DESCRIPTION OF SYMBOLS 1... Circuit groove, 2... Bottom surface, 3... Conductive circuit, 4... Circuit surface, 5... Insulating plate surface, 6... Insulating plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電気絶縁板の表面に、所望の電気回路に対応し
た比較的巾狭い回路溝1を刻設すると共に、該回
路溝の底面2を粗面化し、この回路溝の溝中に無
電解メツキを施して、電導回路3を設け、且、該
電導回路表面4を該絶縁板表面5より僅かに沈め
たことを特徴とするプリント基板。
A relatively narrow circuit groove 1 corresponding to a desired electric circuit is carved on the surface of an electrical insulating board, the bottom surface 2 of the circuit groove is roughened, and electroless plating is applied to the inside of the circuit groove. A printed circuit board characterized in that a conductive circuit 3 is provided, and the conductive circuit surface 4 is slightly sunken below the insulating plate surface 5.
JP10413087U 1987-07-08 1987-07-08 Pending JPS6411572U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10413087U JPS6411572U (en) 1987-07-08 1987-07-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10413087U JPS6411572U (en) 1987-07-08 1987-07-08

Publications (1)

Publication Number Publication Date
JPS6411572U true JPS6411572U (en) 1989-01-20

Family

ID=31335574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10413087U Pending JPS6411572U (en) 1987-07-08 1987-07-08

Country Status (1)

Country Link
JP (1) JPS6411572U (en)

Similar Documents

Publication Publication Date Title
JPS6411572U (en)
JPS6188262U (en)
JPH01104619U (en)
JPH0227671U (en)
JPS6351478U (en)
JPH01123374U (en)
JPS63150393U (en)
JPS6387862U (en)
JPS62129774U (en)
JPS62118473U (en)
JPS62151780U (en)
JPS6175156U (en)
JPS6411512U (en)
JPS642467U (en)
JPS61192473U (en)
JPH0231066U (en)
JPS6232573U (en)
JPS60137466U (en) electrical circuit board
JPS6413718U (en)
JPH0325270U (en)
JPS6418776U (en)
JPS6181180U (en)
JPS6189501U (en)
JPS62190374U (en)
JPH0179273U (en)