JPS6410221A - Method for connecting external circuit of liquid crystal panel - Google Patents
Method for connecting external circuit of liquid crystal panelInfo
- Publication number
- JPS6410221A JPS6410221A JP16641787A JP16641787A JPS6410221A JP S6410221 A JPS6410221 A JP S6410221A JP 16641787 A JP16641787 A JP 16641787A JP 16641787 A JP16641787 A JP 16641787A JP S6410221 A JPS6410221 A JP S6410221A
- Authority
- JP
- Japan
- Prior art keywords
- external circuit
- electrodes
- tool
- power supply
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To set the resistance in a connecting part at a sufficiently low value and to connect an external circuit by disposing a film body between electrodes for connecting the external circuit and the electrodes of the external circuit and impressing pulse voltages on a heat tool under the impression of a pressure. CONSTITUTION:An anisotropic conductive adhesive agent 11 is disposed between the electrodes 13 of the external circuit of a film carrier tape 12 and the electrodes 15 for connecting the external circuit and after the adhesive agent is pressed by the heat tool 16, a voltage is impressed on a heating power supply 17 of the heat tool 16, by which the electrodes are thermocompression bonded. The voltage of the power supply 17 is thereafter removed and the pressing of the tool 16 is released. The pulse voltages are impressed on the tool 16 from the power supply 17 in order to carry out this operation repeatedly. The process temp. is thereby suppressed to the phase transition temp. of a ferroelectric liquid crystal or below and the connection without inducing a disturbance in orientation during the connection stage of the film carrier tape is enabled.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166417A JPH0666015B2 (en) | 1987-07-02 | 1987-07-02 | External circuit connection method of liquid crystal panel |
DE3852563T DE3852563T2 (en) | 1987-05-01 | 1988-04-28 | Method of connecting an external circuit and packaging structure. |
EP88106849A EP0289026B1 (en) | 1987-05-01 | 1988-04-28 | External circuit connecting method and packaging structure |
US07/463,486 US5042919A (en) | 1987-05-01 | 1990-01-11 | External-circuit connecting and packaging structure |
US07/483,312 US5019201A (en) | 1987-05-01 | 1990-02-21 | External-circuit connecting method and packaging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166417A JPH0666015B2 (en) | 1987-07-02 | 1987-07-02 | External circuit connection method of liquid crystal panel |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6410221A true JPS6410221A (en) | 1989-01-13 |
JPH0666015B2 JPH0666015B2 (en) | 1994-08-24 |
Family
ID=15831037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62166417A Expired - Lifetime JPH0666015B2 (en) | 1987-05-01 | 1987-07-02 | External circuit connection method of liquid crystal panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0666015B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129412A (en) * | 1989-10-14 | 1991-06-03 | Mitsubishi Electric Corp | Heat tool heating controller |
JPH03150531A (en) * | 1989-11-07 | 1991-06-26 | Nec Corp | Method for connecting liquid crystal display driving substrate |
KR100232678B1 (en) * | 1996-12-18 | 1999-12-01 | 구본준 | A structure and a method of ridged bump |
KR100254942B1 (en) * | 1996-09-24 | 2000-05-01 | 전주범 | A bonding method of the pad of thin film actuated mirror arrays |
-
1987
- 1987-07-02 JP JP62166417A patent/JPH0666015B2/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03129412A (en) * | 1989-10-14 | 1991-06-03 | Mitsubishi Electric Corp | Heat tool heating controller |
JPH03150531A (en) * | 1989-11-07 | 1991-06-26 | Nec Corp | Method for connecting liquid crystal display driving substrate |
KR100254942B1 (en) * | 1996-09-24 | 2000-05-01 | 전주범 | A bonding method of the pad of thin film actuated mirror arrays |
KR100232678B1 (en) * | 1996-12-18 | 1999-12-01 | 구본준 | A structure and a method of ridged bump |
Also Published As
Publication number | Publication date |
---|---|
JPH0666015B2 (en) | 1994-08-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |