JPS6397393A - Silver brazing filler metal - Google Patents
Silver brazing filler metalInfo
- Publication number
- JPS6397393A JPS6397393A JP24274986A JP24274986A JPS6397393A JP S6397393 A JPS6397393 A JP S6397393A JP 24274986 A JP24274986 A JP 24274986A JP 24274986 A JP24274986 A JP 24274986A JP S6397393 A JPS6397393 A JP S6397393A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- brazing filler
- brazing
- component
- silver brazing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title abstract description 30
- 229910052751 metal Inorganic materials 0.000 title abstract description 18
- 239000002184 metal Substances 0.000 title abstract description 18
- 239000000945 filler Substances 0.000 title abstract description 14
- 229910052709 silver Inorganic materials 0.000 title abstract description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract description 6
- 239000004332 silver Substances 0.000 title abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 229910017944 Ag—Cu Inorganic materials 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 238000007872 degassing Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910017888 Cu—P Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は真空中もしくは雰囲気中で使用する銀ろう材に
関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a silver brazing material used in vacuum or atmosphere.
（従来技術とその問題点）
従来より金属のろう付には銀ろう、金ろう、パラジウム
ろう、白金ろう等が用いられている。その中でも銀ろう
は融点が比較的低く作業性がよいこと及び価格が比較的
低度であることから特殊な場合を除いては広く用いられ
ている。銀ろうの中でも特にＡｇ７２ｗｔ％−Ｃｕ合金
（ＢＡｇ−８）が電子管や真空管等の電子部品などをは
じめとして多用されており、また、融点あるいは価格を
考慮して銀の含有量を増減させたＡｇ−Ｃｕ合金が使用
されている。(Prior art and its problems) Conventionally, silver solder, gold solder, palladium solder, platinum solder, etc. have been used for brazing metals. Among these, silver solder is widely used except in special cases because it has a relatively low melting point, good workability, and a relatively low price. Among silver solders, Ag72wt%-Cu alloy (BAg-8) is particularly widely used in electronic components such as electron tubes and vacuum tubes. -Cu alloy is used.
しかしながら、特に電子工業の分野においては、ろう付
後の工程の関係からろう付後の表面の平滑度が要求され
る。それは、ろう付後の表面の粗さの度合が大きいとそ
の後のはんだ付工程の作業性が低下し、まためっき工程
において前処理の脱脂が充分に行なわれなかったり、酸
洗処理の酸が表面に残留して表面が腐食されたりしてめ
っき不良をきたす等の問題を起す虞れがあるからであり
、できるだけ平滑な表面に仕上がるろう材が要求されて
いる。However, especially in the field of electronics industry, the smoothness of the surface after brazing is required due to the post-brazing process. If the degree of roughness of the surface after brazing is large, the workability of the subsequent soldering process will be reduced, and the pre-treatment degreasing may not be carried out sufficiently during the plating process, or the acid during pickling process may cause the surface to deteriorate. This is because there is a risk that the brazing filler metal may remain on the surface and cause problems such as corrosion of the surface and defective plating, and there is a need for a brazing filler metal that can finish as smooth a surface as possible.
そしてろう付表面の粗さの原因は以下の二つによるもの
と考えられる。ｉ）ろう材凝固時に生ずるガスによって
表面が粗される。ｉｉ）ろう材凝固時の金属組織が微細
化しないことにより粗される。The roughness of the brazed surface is thought to be due to the following two reasons. i) The surface is roughened by the gas generated during solidification of the brazing material. ii) The metal structure during solidification of the brazing material is not refined and becomes rough.
従って上記の原因を取除くことによりろう材面の表面の
平滑さは得られることになる。Therefore, by eliminating the above-mentioned causes, the surface smoothness of the brazing material surface can be obtained.
本発明は上記の要求を満たすことを目的とし、Ａｇ−Ｃ
ｕ−Ｐ−Ｆｅ合金をろう材とすることにより平滑なろう
付表面が得られることを特徴とする。The present invention aims to meet the above requirements, and
A feature is that a smooth brazing surface can be obtained by using u-P-Fe alloy as the brazing material.
（問題点を解決するための手段）
本発明の銀ろう材は、Ｆ ｅ Ｏ，ＯＯ１〜０．５ｗｔ
％、Ｐ０．０１〜３ｗｔ％、Ａ ｇ ５０〜９５ｗｔ％
、残部Ｃｕより成るものである。（以下ｗｔ％を単に％
という）ここで、添加するＦｅは蒸気圧の低い金属であ
り、その添加量は０．００１％未満であると結晶の微細
化および表面を粗さない効果を上げることはできず、ま
た０、５％を越えると、ｉ）偏析が生じる。(Means for solving the problem) The silver brazing material of the present invention contains F e O, OO 1 to 0.5 wt.
%, P0.01-3wt%, A g 50-95wt%
, the remainder being Cu. (Hereinafter, wt% is simply %
Here, the Fe added is a metal with a low vapor pressure, and if the amount added is less than 0.001%, it will not be possible to refine the crystals and prevent the surface from becoming rough; If it exceeds 5%, i) segregation will occur.
ｉｉ ）流動性が低下する。ｉｉｉ ）加工性が低下し
て鋳造後の製造工程に支障をきたす。等の欠点が生ずる
。ii) Fluidity decreases. iii) Workability deteriorates, causing problems in the manufacturing process after casting. Such disadvantages arise.
Ｐはろう材製造中及びろう材使用中の脱ガス効果特に脱
酸効果があり、さらに流動性を改善する。P has a degassing effect, especially a deoxidizing effect, during the manufacture and use of the brazing material, and further improves fluidity.
Ｐを添加することによって強度は従来のろう材より弱ま
る。しかし、Ｆｅの添加によって強度の低下をおさえる
ことができる。By adding P, the strength becomes weaker than that of conventional brazing filler metals. However, the decrease in strength can be suppressed by adding Fe.
次に本発明の実施例について説明する。Next, examples of the present invention will be described.
（実施例）
（１１Ａｇ８５％−Ｃｕ残−Ｐ ０．００５％−Ｆ ｅ
Ｏ，００５％（２１Ａｇ７２％−Ｃｕ残−Ｐ ０．５
％−ＦｅＯ，０５％（３１Ａｇ６０％−Ｃｕ残−Ｐ２．
５％−Ｆｅ０．２％以上の本発明の試料について従来品
及びその従来品にＰを添加した試料とを性能を比較して
みた。(Example) (11Ag85%-Cu balance-P 0.005%-Fe
O,005% (21Ag72%-Cu balance-P 0.5
%-FeO, 05% (31Ag60%-Cu balance-P2.
The performance of the sample of the present invention containing 5%-Fe0.2% or more was compared with a conventional product and a sample in which P was added to the conventional product.
従来品及び従来品にＰを添加した試料について以下に６
種を挙げる。Below are 6 points regarding the conventional product and the sample with P added to the conventional product.
List the seeds.
（４１Ａｇ８５％−Ｃｕ１５％
（５）Ａｇ７２％−Ｃｕ２８％
（６１Ａｇ６０％−Ｃｕ４０％
（７１Ａｇ８５％−Ｃｕ残−Ｐ０．０５％（８１Ａｇ７
２％−（、ｕ残−Ｐ ０．５％（９） Ａ ｇ ６０％
−Ｃｕ残−Ｐ２．５％（１）ろう付の引張強度について
下記の第１表のような結果を得た。(41Ag85%-Cu15% (5)Ag72%-Cu28% (61Ag60%-Cu40% (71Ag85%-Cu remainder-P0.05% (81Ag7
2%-(, u remaining-P 0.5% (9) A g 60%
-Cu remaining-P2.5% (1) Results as shown in Table 1 below were obtained regarding the tensile strength of brazing.
（以下余白）
第１表 単位ｋｇ ／ ｘ＊ ”但し
アムスラー材料試験機により行い、各試料の液相温度よ
り４０℃高い温度にて真空中または水素雰囲気中でろう
付を行った。(Margin below) Table 1 Unit: kg/x* "However, brazing was performed using an Amsler material testing machine, and brazing was performed in vacuum or in a hydrogen atmosphere at a temperature 40° C. higher than the liquidus temperature of each sample.
断面が４Ｘ、４＋ｎの突合わせ継手を測定した。A butt joint with a cross section of 4X and 4+n was measured.
（２）拡がり試験については下記の第２表のような結果
を得た。(2) Regarding the spreading test, the results shown in Table 2 below were obtained.
（以下余白）
第２表
但し
拡がり試験は厚さ０．１１ｍ、１（ｉｎ角のろう材を用
い、各ろう材の液相温度より４０℃高い温度にて真空中
または水素雰囲気中で行い、２分間保持した。(Margin below) Table 2 However, the spread test was conducted using a 0.11 m thick, 1 (in square) brazing filler metal in a vacuum or hydrogen atmosphere at a temperature 40°C higher than the liquidus temperature of each filler filler metal. Hold for 2 minutes.
以上の第１表および第２表に示す如く本発明によるろう
材の基本的性能は、添加金属の種類や添加量によって若
干の変動はあるが、ろう付引張強度は
Ａｇ−Ｃｕ−Ｐ−Ｆｅ上Ａｇ −Ｃｕ ＞ Ａｇ −Ｃ
ｕ −Ｐとなり、拡がり面積は
Ａｇ −Ｃｕ −Ｐ −Ｆｅ上Ａｇ −Ｃｕ−Ｐ ＞
Ａｇ −Ｃｕとなる。As shown in Tables 1 and 2 above, the basic performance of the brazing filler metal according to the present invention varies slightly depending on the type and amount of added metal, but the brazing tensile strength of Ag-Cu-P-Fe Upper Ag-Cu > Ag-C
u -P, and the spreading area is Ag -Cu-P on Ag -Cu-P -Fe >
It becomes Ag-Cu.
（発明の効果）
以上の如く本発明はＡｇ−Ｃｕ系のろう材の基本的性能
を損なうことなく、ろう付後の表面の状態を改善し、多
方面に亘って有用なろう材となる。(Effects of the Invention) As described above, the present invention improves the surface condition after brazing without impairing the basic performance of Ag-Cu-based brazing filler metal, making it a brazing filler metal useful in many fields.
さらにＡｇ−Ｃｕ系合金の脱ガス効果を計ったことによ
り、表面のざらつきを改善し、その結果電子工業の分野
はもちろん装飾品についてもより美しい外観を与えるこ
とになる。Furthermore, by measuring the degassing effect of the Ag-Cu alloy, the roughness of the surface can be improved, resulting in a more beautiful appearance not only in the field of electronics industry but also in decorative items.
Claims (1)
、Ａｇ５０〜９５ｗｔ％、残部Ｃｕより成る銀ろう材。Fe0.001-0.5wt%, P0.01-3wt%
, Ag 50 to 95 wt%, balance Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24274986A JPH0638994B2 (en) | 1986-10-13 | 1986-10-13 | Silver brazing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24274986A JPH0638994B2 (en) | 1986-10-13 | 1986-10-13 | Silver brazing material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6397393A true JPS6397393A (en) | 1988-04-28 |
| JPH0638994B2 JPH0638994B2 (en) | 1994-05-25 |
Family
ID=17093691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24274986A Expired - Lifetime JPH0638994B2 (en) | 1986-10-13 | 1986-10-13 | Silver brazing material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638994B2 (en) |
-
1986
- 1986-10-13 JP JP24274986A patent/JPH0638994B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0638994B2 (en) | 1994-05-25 |
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