KR0136202B1 - Brazing filler rod of ti-alloy with good collectivity - Google Patents
Brazing filler rod of ti-alloy with good collectivityInfo
- Publication number
- KR0136202B1 KR0136202B1 KR1019940040116A KR19940040116A KR0136202B1 KR 0136202 B1 KR0136202 B1 KR 0136202B1 KR 1019940040116 A KR1019940040116 A KR 1019940040116A KR 19940040116 A KR19940040116 A KR 19940040116A KR 0136202 B1 KR0136202 B1 KR 0136202B1
- Authority
- KR
- South Korea
- Prior art keywords
- filler metal
- alloy
- brazing
- brazing filler
- temperature
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/325—Ti as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C14/00—Alloys based on titanium
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Ceramic Products (AREA)
Abstract
티타늄 합금용 브레이징 용가재로써, 중량기준으로 Ti 60∼62%, Cu 19∼20%, Ni 19∼20%로 조성된다.As a brazing filler metal for titanium alloy, it is composed of 60 to 62% of Ti, 19 to 20% of Cu, and 19 to 20% of Ni.
이조성으로 용가재를 조성하는 경우 모재와의 브레이징 접합시 접합강도가 우수하다.In the case of forming filler metal with two compositions, the bonding strength is excellent at brazing bonding with the base material.
Description
본 발명은 티타늄 합금 소재를 진공브레이징에 의해 접합할 때 사용되는 브레이징 용가재에 관한 것이다.The present invention relates to a brazing filler metal used when joining a titanium alloy material by vacuum brazing.
이같은 용가재에 관한 종래의 기술로서는 구리 및 니켈 박판을 각각 한 장씩 두 개의 티타늄 박판사이에 넣은, 즉 4개의 층(Ti-Cu-Ni-Ti)으로된 판재를 그대로 압연하여 두께 50∼70㎛정도의 적층형태로 만들고, 70% Ti, 15% Ni, 15% Cu조성을 갖는 용가재가 개시된 바 있다. (미국 특허 3,652,257).As a conventional technique related to such filler metal, a sheet of copper and nickel sheets, each of which is sandwiched between two titanium sheets, that is, four layers (Ti-Cu-Ni-Ti) is rolled as it is and is about 50 to 70 µm thick. A filler material having a 70% Ti, 15% Ni, and 15% Cu composition has been disclosed. (US Pat. No. 3,652,257).
그러나 이 특허에 개시된 용가재는 용융점이 높아 티타늄 합금 브레이징의 적정온도로 생각되는 950℃정도에서 완전한 용융이 되지 못하며, 따라서 브레이징 온도를 높이면 모재의 금속조직적, 기계적 특성에 손상을 줄 우려가 있고, 브레이징 온도를 낮추면 접합부의 접합강도가 모재강도에 비해 충분치 못하다는 단점이 있는 것이다.However, the filler metal disclosed in this patent cannot be completely melted at about 950 ° C, which is considered to be a proper temperature of titanium alloy brazing due to its high melting point. Therefore, if the brazing temperature is increased, the metallographic and mechanical properties of the base metal may be damaged. Lowering the temperature has the disadvantage that the joint strength of the joint is not sufficient compared to the base material strength.
또한, Ti계의 브레이징 용가재로서 Ni의 함량을 Cu보다 많게 하여 Ti기지에 15∼21% Cu, 24∼30% Ni을 함유한 용가재가 미국특허 4,725,509에 개시되어 있으나, 이용가재는 브레이징시 955℃ 온도에서의 적정 접합시간이 약 1시간 정도로 접합공정에 소요되는 시간이 매우 길뿐만아니라 NI함량이 20%를 상회함으로써 Ti합금접합시 TiNi3와 같은 금속간 화합물을 형성하여 접합부의 성능을 저해할 우려가 있는 것이다.In addition, a filler material containing 15 to 21% Cu and 24 to 30% Ni in a Ti base having a Ni content higher than Cu as a brazing filler metal based on Ti is disclosed in US Pat. No. 4,725,509. The proper bonding time at temperature is about 1 hour, and the time required for the bonding process is very long, and the NI content exceeds 20%, forming an intermetallic compound such as TiNi 3 during Ti alloy bonding. There is concern.
이에 본 발명의 목적은 상기와 같은 종래의 문제점을 해결한 보다 개선된, 티타늄합금용 브레이징 용가재를 제공하는데 있다.It is an object of the present invention to provide an improved, brazing filler metal for titanium alloys that solves the conventional problems as described above.
나아가 본 발명의 목적은 티타늄 합금브레이징의 적정온도에서도 단시간내에 모재강도와 대등한 접합강도를 나타내는 보다 개선된 티나늄 합금용 브레이징 용가재를 제공하는데 있다.It is further an object of the present invention to provide an improved brazing filler metal for a titanium alloy which exhibits a bonding strength comparable to that of the base metal in a short time even at an appropriate temperature of the titanium alloy brazing.
상기와 같은 본발명의 목적은 브레이징시에 접합부에서의 접합반응을 원활하게 할 수 있도록 성분조성을 변화시킨 본 발명의 용가재에 의해 달성될 수 있다.The object of the present invention as described above can be achieved by the filler material of the present invention by changing the composition of the composition to facilitate the bonding reaction at the joint during brazing.
본발명에 의한 티타늄 합금용 브레이징 용가재는 Ti 60∼62%, Cu 19∼20%, Ni: 10∼20%를 포함하여 조성된다.The brazing filler metal for titanium alloy according to the present invention comprises 60 to 62% of Ti, 19 to 20% of Cu, and 10 to 20% of Ni.
Ti-Cu상태도에 따르면 Ti-Cu합금계의 용융점을 낮추기 위하여는 Cu함량이 18∼30%정도가 적합하며, Ti-Ni상태도에서는 Ni함량이 약 35%정도일 때 낮은 용융점을 갖게 된다.According to the Ti-Cu diagram, the Cu content of about 18 to 30% is suitable to lower the melting point of the Ti-Cu alloy system, and the Ti-Cu diagram has a low melting point when the Ni content is about 35%.
또한 Ti-Cu-Ni의 3원계 상태도에 의하면 Ni함량 약 25%, Cu함량 약 15%인 경우 가장 낮은 액상온도를 갖는다.In addition, according to the ternary state diagram of Ti-Cu-Ni, when the Ni content is about 25% and the Cu content is about 15%, it has the lowest liquidus temperature.
그러나 실제에 있어서는 Cu와 Ni이 Ti와 합금화될 때 취약한 금속간 화합물이 형성되기 때문에 Cu와 Ni의 함량을 20%이상 조성하는 것은 곤란한 것이다.In practice, however, when Cu and Ni are alloyed with Ti, fragile intermetallic compounds are formed, so it is difficult to make the Cu and Ni content of 20% or more.
따라서 Cu 의 함량 변화가 용가재의 용융점에 미치는 영향이나 Ni함량에 따른 취약한 금속간화합물의 생성을 고려하여 본 발명에서는 Cu와 Ni의 함량을 전체 용가재의 중량기준으로 각각 19∼20%범위로 정하였다.Therefore, in consideration of the effect of the change of Cu content on the melting point of the filler metal and the formation of a weak intermetallic compound according to the Ni content, in the present invention, the Cu and Ni contents were set in the range of 19 to 20%, respectively, based on the weight of the filler metal. .
또한, 본발명에서는 용가재를 종래의 적층형과는 달리 비정질 박막형으로 제조함으로써 공정시간을 줄일수 있으며 공정상의 편의를 도모할 수 있다.In addition, in the present invention, by manufacturing the filler metal in an amorphous thin film type unlike the conventional laminated type, it is possible to reduce the process time and to facilitate the process.
이하 본발명의 실시예에 대하여 설명한다.Hereinafter, embodiments of the present invention will be described.
[실시예1]Example 1
용가재의 조성을 표1에서와 같이 종래용가재의 조성인 Ti 70%, Cu 15%, Ni 15%(시료A,B) 및 본발명에 의한 조성인 Ti 60%, Cu 20%, Ni 20%(시료 C)로 하였으며, 종래조성의 용가제는 원래의 적층형(시료 A)과 새로운 비정질 박막형(시료 B)으로 된 두가지 형태를 이용하였다.As shown in Table 1, the composition of the filler metal is Ti 70%, Cu 15%, Ni 15% (Samples A and B) and Ti 60%, Cu 20% and Ni 20% (samples) according to the present invention. C), and conventionally used solubilizers were used in two forms, the original laminated type (Sample A) and the new amorphous thin film type (Sample B).
상기 용가재의 성분조성은, 공업용 순수 원자재를 기계적으로 파쇄한후, 세척하고 일부는 산세하여 0.001g 까지의 정밀도를 갖는 천칭으로 측량하여 사용하였다.The composition of the filler metal was used after mechanically crushing the industrial pure raw material, washing it, pickling part of it, and weighing it with a balance having an accuracy of up to 0.001 g.
Ti은 상용 99.7%순도의 Ti판재나 봉상형태의 것을 기계적으로 세척하여 사용하였다.Ti was mechanically washed with a commercially available 99.7% pure Ti sheet or rod-shaped one.
용가재 제조방법은 시료 A의 경우는 적층형태로, 시료 B 및 C의 경우는 비정질 박막 제조에 많이 사용되는 급냉응고 장치를 이용한 멜트 스피닝(melt spinning)방식을 이용하였다.The filler metal manufacturing method was a melt spinning method using a quenching and solidifying apparatus, which is frequently used for preparing the amorphous thin film in the case of Sample A and Laminated Form.
이와같이 제조된 3가지 용가재에 대하여 용융온도를 DTA(Differential Thermo Analysis)시험으로 측정하였으며 그 결과를 하기 표1에 나타내었다.Melting temperature of the three filler materials prepared as described above was measured by DTA (Differential Thermo Analysis) test, and the results are shown in Table 1 below.
상기 표1에 의하면, 종래의 조성으로 제조된 적층형인 시료 A의 경우는 가열시 용융개시온도가 900℃, 완전히 용융되는 온도가 997℃인데 반하여, 시료 A와 동일한 성분 및 량으로 조성하되 비정질 박막형으로 제조한 시료는 B는 용융 온도범위가 가열시 902℃, 완전용융온도 998℃로 시료 A와 거의 비슷함을 알 수 있다.According to Table 1, in the case of Sample A, which is a laminated type manufactured with a conventional composition, the melting start temperature is 900 ° C. and the temperature at which the complete melting is 997 ° C., but the composition is the same as that of Sample A. In the sample prepared by B, it can be seen that the melting temperature range is almost the same as that of Sample A at the heating temperature of 902 ° C and the complete melting temperature of 998 ° C.
이에 반하여 Cu와 Ni을 각각 20%씩 첨가한 본발명의 용가재인 시료C의 경우는 용융개시온도가 915℃로 시료 A및 B보다 약간 높지만 완전히 용융되는 온도는 936℃로써 시료 A 및 B보다 훨씬 낮음을 알수 있다.On the contrary, in the case of sample C, which is the filler metal of the present invention in which 20% of Cu and Ni were added, the melting start temperature was 915 ° C, slightly higher than Samples A and B. You can see the low.
따라서 Ti합금을 통상 사용하는 온도인 약 950℃정도에서 브레이징 하는 경우 시료 A나 B는 완전한 용융이 이루어지지 않아 불량한 접합부를 얻게 되나, 본발명에 의한 시료 C의 경우는 충분한 용융이 이루어져 양호간 접합이 가능하다고 예측할수 있는 것이다.Therefore, when brazing at about 950 ° C, which is the temperature at which Ti alloy is normally used, Sample A or B is not completely melted, so that a poor joint is obtained. However, in the case of Sample C according to the present invention, sufficient melting is performed to make a good joint. You can predict that this is possible.
[실시예2]Example 2
실제로 브레이징 접합을 한후 접합부의 인장강도를 조사하기 위하여 상기 시료 B및 C를 950℃에서 10분간 처리하여 접합시킨후 그 항복강도 및 인장강도를 측정하였다.In order to investigate the tensile strength of the joint after the brazing joint, the samples B and C were treated at 950 ° C. for 10 minutes, and then the yield strength and the tensile strength were measured.
접합시 사용된 접합시편모재는 공업용 티타늄 합금으로 가장 많이 사용되는 Ti-6Al-4V 재료를 이용하였다.As the bonded specimen base material used in the bonding, Ti-6Al-4V material, which is the most used industrial titanium alloy, was used.
상기 접합강도시험 결과를 하기 표2에 나타내었다.The bond strength test results are shown in Table 2 below.
상기 표2에 의하면 Cu와 Ni를 각각 20%씩 첨가한 본발명에 의한 시료 C의 경우가, Cu와 Ni을 각각 15%씩 첨가한 시료 B보다 우수한 접합강도를 나타내며, 그 강도는 모재의 강도와 거의 일치함으로써 이상적인 접합강도를 나타낸다고 할수 있다.According to Table 2, in the case of Sample C according to the present invention in which 20% of Cu and Ni were added, the bonding strength was superior to that of Sample B in which 15% of Cu and Ni were added, respectively. It can be said that it shows the ideal joint strength by almost matching with.
상기한 바와같이, 본 발명에 의한 용가재는 Ti합금접합시 모재의 특성을 변화시키지 않는 950℃정도의 온도에서 약10분정도의 짧은 유지시간에서도 모재강도와 거의 대등한 접합강도를 나타내므로써 기존의 용가재들 보다 더 낮은 온도, 더 짧은 시간에 접합을 이룰수 있는 효과를 갖는다.As described above, the filler metal according to the present invention exhibits almost the same bond strength as the base metal strength even at a short holding time of about 10 minutes at a temperature of about 950 ° C. that does not change the properties of the base metal during Ti alloy bonding. It has the effect of bonding at lower temperature and shorter time than filler materials.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940040116A KR0136202B1 (en) | 1994-12-30 | 1994-12-30 | Brazing filler rod of ti-alloy with good collectivity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019940040116A KR0136202B1 (en) | 1994-12-30 | 1994-12-30 | Brazing filler rod of ti-alloy with good collectivity |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960021358A KR960021358A (en) | 1996-07-18 |
KR0136202B1 true KR0136202B1 (en) | 1998-07-01 |
Family
ID=19405992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940040116A KR0136202B1 (en) | 1994-12-30 | 1994-12-30 | Brazing filler rod of ti-alloy with good collectivity |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0136202B1 (en) |
-
1994
- 1994-12-30 KR KR1019940040116A patent/KR0136202B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR960021358A (en) | 1996-07-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100930348B1 (en) | Solder Alloy for Oxide Bonding | |
US4253870A (en) | Homogeneous brazing foils of copper based metallic glasses | |
US6299835B1 (en) | Cadmium-free silver alloy as low-melting brazing filler material | |
JPH06238479A (en) | Lead-free solder material | |
JPH02101132A (en) | Low melting point solder | |
US5130090A (en) | Copper alloys to be used as brazing filler metals | |
KR0136202B1 (en) | Brazing filler rod of ti-alloy with good collectivity | |
JPH0665440B2 (en) | Homogeneous low melting point copper base alloy | |
JPS6247117B2 (en) | ||
JPS6247935B2 (en) | ||
US4802933A (en) | Nickel-palladium based brazing alloys | |
JPS6218275B2 (en) | ||
JPH0113960B2 (en) | ||
WO1994003305A1 (en) | Gold-nickel-vanadium brazing materials | |
US4316573A (en) | Homogeneous brazing foils of copper based metallic glasses | |
US5178827A (en) | Copper alloys to be used as brazing filler metals | |
JPS6218276B2 (en) | ||
RU2009241C1 (en) | Zirconium-base alloy | |
Shimokawa et al. | Mechanical properties and microstructure of tin-silver-bismuth lead-free solder | |
US5301861A (en) | Gold-nickel-vanadium brazing materials | |
JPS60166195A (en) | Brazing filler metal consisting of active metal | |
JPS60238446A (en) | Alloy for lead frame for ic with superior corrosion resistance | |
JPS63159B2 (en) | ||
JPS60230949A (en) | Material for quartz oscillator case | |
JPH02213440A (en) | Ni-base alloy for member contacting glass having excellent erosion resistance to glass used under non energizing |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20070104 Year of fee payment: 10 |
|
LAPS | Lapse due to unpaid annual fee |