JPS6397359A - Supplementary method for high viscosity agent for fitting surface mounting parts - Google Patents

Abstract

PURPOSE:To prevent air contamination and to reduce the generation of defects in soldering by giving resistance to the flow to the other end side of a syringe with supplying a high viscosity agent with its pressurizing from one end in the longitudinal direction of the syringe and diffusing it in the radial direction of the syringe. CONSTITUTION:An adhesive extruding device 3 is provided with a discharging port 4a at the front part and a freely movable in parallel bottom plate 4b at the rear part, and the holding part 3a holding the tube 4 in which the adhesive A for supply is stored, the trigger 3c giving pressing force to the disk 3b pressing the bottom plate 4b and the member 3d locking the disk 3b are taken as its component. In case of supplying the adhesive 1 inside a syringe 1 by using such extrusion device 3, an adhesive regulating jig 6 gives resistance to the flow to the other end side of the syringe 1 of the adhesive A to which the adhesive A left in sticking state at the discharging side 1a of the syringe 1 and the adhesive A is diffused in the radial direction, so the supply of the adhesive in such state as a snake coiling up is eliminated and no air is contaminated as well.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for replenishing a syringe with a high viscosity agent for attaching surface mount components, such as adhesive or paste solder.

[Conventional technology]

When a surface mount component such as a chip resistor or a capacitor is soldered to a printed circuit board, the surface mount component is temporarily fixed to the printed circuit board in a pre-soldering process. Specifically, as shown in Fig. 3, the temporary attachment involves filling a predetermined amount of adhesive (A) into a container called a syringe (1), and inserting it into the inside of the syringe (1). Pulse pressure is applied using the controller (7) from the discharge port (1a) at the tip of the syringe (1) (strictly speaking,
from the needle (2) attached to its discharge port (1a))
The adhesive (A) is applied to a predetermined portion of the printed circuit board by dispensing a certain amount, and the surface mount component is placed thereon, and the adhesive (A) is thermally cured by means such as ultraviolet irradiation to fix the temporary attachment. It will be done.

By the way, when the adhesive (A) inside the syringe (1) becomes insufficient, it becomes necessary to replenish the adhesive (A), but this replenishment has conventionally been carried out by the method shown in FIG. It was done. That is, the wide mouth side (1b) of the syringe (1)
The opening of the tube (8) containing adhesive (A) for replenishment (
8a) and remove the adhesive (A) from the tube (4).
) was to be extruded and replenished into the syringe (1).

[Problem that the invention seeks to solve]

When replenishing the adhesive (A) using such a conventional method, since the adhesive (A) has a very high viscosity of tens of thousands of centimeters at room temperature, the adhesive (A) has a high viscosity as shown in FIG. As shown in the figure, as a result of the discharge and replenishment as if the snake were coiled, air is drawn in between the coils. Note that this air remains entangled for a long time because the adhesive (A) is difficult to flow and deform due to its high viscosity.

Then, a needle (2) is glued to the discharge port (1a) at the tip of the syringe (1), which is supplied with the adhesive (A) while the air is being drawn in, and the adhesive (A) is passed through the needle (2). When discharging a fixed amount of 8), the adhesive (A) is not dispensed in a fixed amount every time the part of the trapped air is discharged,
In some cases, blank discharge occurs, resulting in insufficient fixation of surface mount components on a printed circuit board, and problems such as misalignment of surface mount components before the soldering process is completed. A dot had appeared.

Therefore, conventionally, a syringe (
1) was applied to a centrifuge or vacuum deaerator for a long period of several minutes to remove the air, but the reality was that the air could not be completely removed even with this method. .

The present invention has been made with attention to such circumstances,
The purpose of this is to provide a method for replenishing a high viscosity agent such as the adhesive for attaching surface mount components while preventing the air from being drawn into the syringe so that the above problem does not occur. However, the purpose of soldering is to reduce the incidence of defects in the process.

[Means for solving problems]

A method for replenishing a high viscosity agent for attaching surface mount components according to the present invention is a method for replenishing the high viscosity agent for attaching surface mount components into the inside of a syringe that dispenses a fixed amount of the agent from the tip, comprising: While replenishing the high viscosity agent under pressure from one end in the longitudinal direction of the syringe, resistance is applied to the flow of the high viscosity agent supplied under pressure to the other end of the syringe, and the high viscosity agent is transferred in the radial direction of the syringe. It is characterized by the fact that it diffuses into

[For production]

When replenishing the high viscosity agent using the method of the present invention, the high viscosity agent is replenished under pressure from one end in the longitudinal direction of the syringe, and the high viscosity agent supplied under pressure is transferred to the other end of the syringe. This creates resistance to the flow of the high viscosity agent and causes the high viscosity agent to diffuse in the radial direction of the syringe, allowing the high viscosity agent remaining in a sticky state inside the syringe to move to Shintenmu while creating a new high viscosity agent. The viscosity agent will be replenished. As a result, the high viscosity agent is not replenished in the form of a coiled snake (as is the case in the past), and air is no longer drawn in.

〔Effect of the invention〕

When replenishing the high viscosity agent into a syringe using the method of the present invention, the above-mentioned air is not caught up in the high viscosity agent inside the syringe, so centrifugal separation and vacuum treatment are required to remove air. In addition to eliminating the need for defoaming treatment, the high viscosity agent is prevented from being ejected in a fixed amount or being ejected blankly due to the air. Furthermore, the rate of defects in the post-process using the high viscosity agent, ie, soldering, is also significantly reduced.

〔Example〕

Hereinafter, the method of the present invention will be specifically explained based on the drawings.

In Fig. 1, (1) is adhesive (A), which is a type of high-viscosity agent for attaching surface-mounted components and is filled in a predetermined amount inside.
This is a syringe that dispenses a fixed amount of the adhesive (A) from the discharge port (1a) at the tip (strictly speaking, from the needle (2) shown in FIGS.
) is in a shortage state, and into the syringe (1),
Adhesive (A) is supplied using an adhesive extrusion device (3) as shown.

The adhesive extrusion device (3) is provided with a discharge port (4a) in the front part, a bottom plate (4b) which is movable in parallel in the rear part, and has a replenishing adhesive (A) inside. The tube holding part (3a) holds the tube (4) (see Fig. 2) containing the agent (A), which is naturally prepared so that there is no entrainment of air, etc.); A trigger (3c) that indirectly applies a pressing force to a disc (3b) that presses the bottom plate (4b) from behind, and the disc (3b)
The main component is a locking member (3d) that locks the holder at an arbitrary position.

Note that (5) in Figures 1 and 2 indicates the tube (
4) and the discharge port (4a) of the syringe (1).
1a), and (6) in Fig. 1 is a joint jig for connecting the adhesive (1) in the syringe (1).
This is an adhesive regulating jig for pressing the adhesive (A) toward the discharge port (1a) to prevent the adhesive (A) from moving away from the discharge port (1a), and its tip shape is similar to that of a syringe ( It is formed to approximately match the inner surface shape of 1).

When pressurizing and replenishing the adhesive (A) into the syringe (1) from the discharge port (1a) side using the adhesive extrusion device (3), use the discharge port (1a) inside the syringe (1). The adhesive (8) remaining in a sticky state due to its high viscosity on the side provides resistance to the flow of the adhesive (A) to the other end of the syringe (1), which is being replenished under pressure. As a result, the remaining adhesive (A) is moved in the radial direction, and new adhesive (A) is spread out.
) will be replenished from the tube (4). As a result, the adhesive (A) is no longer replenished in the form of a coiled snake, as is the case in the past, and air is no longer drawn in.

Note that the adhesive (8) remaining in the syringe (1) has a high viscosity, so it remains on the discharge port (1a) side, but there is a long time lost in replenishing the adhesive (8). When this occurs, the adhesive (A) remaining in the syringe (1) may gradually move away from the discharge port (1a), which may cause air entrainment. The adhesive regulating jig (6) is effective in preventing the adhesive (A) from moving. In other words, the adhesive regulating jig (6) is connected to the newly supplied adhesive (A) syringe (
1) It functions to provide resistance to the flow toward the other end. Such an adhesive regulating jig (6) is particularly effective when the amount of adhesive (A) remaining in the syringe (1) is small or when the adhesive (A) is not present. .

Further, in the above embodiment, the case where the high viscosity agent for attaching surface mount components is an adhesive was explained, but it goes without saying that the method of the present invention can also be applied even if the high viscosity agent is paste solder. be.

Note that although reference numerals are written in the claims section for convenient comparison with the drawings, the present invention is not limited to the method shown by the accompanying drawings.

FIG. 2 is a perspective view showing a tube and a joint jig, FIG. 3 is a perspective view showing the principle of dispensing a fixed amount of adhesive, and FIG. 4 is a perspective view showing a conventional adhesive replenishment method.

(1)...Syringe, (A)...High viscosity agent.

Claims (1)

[Claims] A method for replenishing a high viscosity agent (A) for mounting surface mount components into the interior of a syringe (1) that dispenses a fixed amount of the high viscosity agent (A) from its tip, the method comprising: dispensing a high viscosity agent (A) into the interior of a syringe (1) at one end in the longitudinal direction of the syringe (1); While replenishing the high viscosity agent (A) under pressure from ) in the radial direction of a syringe (1).