JPS6396992A - Board with hole for holding lead wire - Google Patents
Board with hole for holding lead wireInfo
- Publication number
- JPS6396992A JPS6396992A JP24276586A JP24276586A JPS6396992A JP S6396992 A JPS6396992 A JP S6396992A JP 24276586 A JP24276586 A JP 24276586A JP 24276586 A JP24276586 A JP 24276586A JP S6396992 A JPS6396992 A JP S6396992A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- hole
- board
- predetermined
- outer diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 35
- 241000219122 Cucurbita Species 0.000 claims description 3
- 235000009852 Cucurbita pepo Nutrition 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は、リード線付の電子部品を例えばプリント基
板に対してリード線を利用して仮止めする場合、あるい
は単にリード線の途中と所定基板に保持する場合に適用
するリード線保持孔付の基板に関する。[Detailed Description of the Invention] <Industrial Application Field> This invention is useful when temporarily fixing an electronic component with a lead wire to a printed circuit board, for example, using a lead wire, or simply fixing an electronic component with a lead wire in the middle of a lead wire and a predetermined position. The present invention relates to a board with a lead wire holding hole that is used when holding the lead wire on the board.
〈従来の技術〉
リード線を有する電子部品を使用して所定の電気製品を
組立てる際に、その電子部品が最終的には確実に固定さ
れるようになっていてもある工程までは仮止め状態で工
程間を移動するような場合がある。例えば、第5図(吠
(b)、(c)、(d)に示すような各部品の組立てに
おいて、プリント基板lの切欠部2にビニル被覆リード
線3を有する電子部品番を仮止め状態として、リード+
!3の端部を所定の接続位置へ接続するなどの別の工程
を経て、最後にケース部品5.6とプリント基板lを組
立てることによって電子部品4が確実に固定されるよう
な場合である。このような場合に、電子部品番の仮止め
は、接着剤によりプリント基板1に接着するか、リード
線を最短距離でプリント基板lに半田付することが行わ
れていた。<Conventional technology> When assembling a specified electrical product using electronic components with lead wires, even if the electronic components are eventually fixed securely, they are temporarily fixed until a certain step. There are cases where the process is moved between processes. For example, when assembling each component as shown in FIG. As, lead +
! This is a case where the electronic component 4 is securely fixed by going through another process such as connecting the end of the electronic component 3 to a predetermined connection position, and finally assembling the case component 5.6 and the printed circuit board 1. In such cases, the electronic part number has been temporarily fixed by adhering it to the printed circuit board 1 with an adhesive, or by soldering the lead wire to the printed circuit board 1 at the shortest distance.
〈発明が解決しようとする問題点〉
従来のIJ−F線を有する部品の仮止めが接着剤による
場合は、接着剤が乾くまでに時間がかかり十分に乾かな
いうちに振動などが加わると接着位置が変化したり、外
れたりする問題があった。また、仮止めがリード線を最
短距離でプリント基板へ半田付けする場合は、そのリー
ド線を他の部品や場所に接続する必要のある場合に別の
リード線を用いる必要があり、リード線の接続部が増加
することや電子部品を位置決めして短いリード線を半田
付けすることが必ずしも容易でないことなどの問題があ
った。いずれにしても組立てに時間と手間がかかるので
ある。<Problems to be solved by the invention> When parts with conventional IJ-F wires are temporarily fixed using adhesive, it takes time for the adhesive to dry, and if vibration etc. are applied before the adhesive is sufficiently dried, the adhesion may occur. There was a problem with the position changing or coming off. In addition, if temporarily soldering the lead wire to the printed circuit board at the shortest distance, it is necessary to use another lead wire when the lead wire needs to be connected to other parts or locations. There have been problems such as an increase in the number of connection parts and the fact that it is not always easy to position electronic components and solder short lead wires. In either case, assembly takes time and effort.
また別に、比較的長いリード線を有する電子部品にあっ
ては電子部品を良好に仮止めできたとしてもリード線が
自由な状態では他の工程で作業のじゃまになる問題もあ
る。Another problem with electronic components having relatively long lead wires is that even if the electronic components can be temporarily fastened well, if the lead wires are free, they may interfere with work in other processes.
く問題点を解決するための手段〉
この発明の手段は、所定外径の被覆リート線の断面寸法
よりもわずかに大きい円孔が2個でひようたん形に連続
するように又は4個で四つ葉形に連続するように所定の
基板に穿設されかつその孔の内周で相対向する突部間の
距離を前記ひようたん形の孔にあっては前記所定外径に
また前記口つ葉形の孔にあっては前記所定外径の2倍に
略等しくなるように拡大形成されていることを特徴とす
る。Means for Solving the Problems> The means of the present invention is such that two or four circular holes, which are slightly larger than the cross-sectional dimension of the coated wire with a predetermined outer diameter, are continuous in a gourd shape. In the case of the gourd-shaped hole, the distance between protrusions that are continuously drilled in a predetermined substrate in a quatrefoil shape and that face each other on the inner periphery of the hole is equal to the predetermined outer diameter and The leaf-shaped hole is characterized in that it is enlarged to be approximately twice the predetermined outer diameter.
く作 用〉
との゛発明は、ひようたん形の孔に対して1本のリード
線を所望の保持位置で2つ折シに折曲げて折曲げ部を挿
入し、基板の反対側へリート線の直径の2〜3倍程度の
寸法突出させることでリード線保持状態となる。また四
つ葉形の孔に対して2本のリード線を平行に引揃え所望
の保持位置で2つ折りに折曲げて折曲げ部を挿入し、基
板の反対側へリート線の直径の2〜3倍程度の寸法突出
させることでリード線保持状態となる。この保持状態に
あるリード線は、全部を、つまり2本又は4本を同時に
引張ると比較的波は易いが、一連のリード線の一方を引
張った場合には容易に抜けない。In the invention, one lead wire is bent in half at a desired holding position into a gourd-shaped hole, the bent part is inserted, and the lead wire is led to the opposite side of the board. The lead wire is held in a state of being held by protruding the lead wire by about 2 to 3 times the diameter of the wire. In addition, align the two lead wires parallel to the quatrefoil-shaped hole, bend them in half at the desired holding position, insert the bent part, and insert the bent part into the opposite side of the board. By making the lead wire protrude by about three times as much, the lead wire is held in a state. The lead wires in this held state are relatively easy to wave if all of them, that is, two or four of them are pulled at the same time, but they do not easily come off when one of the series of lead wires is pulled.
これは一方が抜は出ようとするとき、挿入時に2つ折り
に折曲げた折曲げ部が孔の側に引き込まれる状態となる
が、この場合に折曲げ部が延ばされると共に他の部分で
折曲げられるようになることでその双方の反力が抜は止
め作用をすることになる。突部間の距離をリード線の外
径に又は外径の2倍に略等しくしたことは、折シ曲げ部
を挿入できるようにすると共に挿入後はできるだけ抜は
難い状態とするためである。なお、リード線の被覆が比
較的軟質である場合はこれを考慮して突部間の距離を折
曲げ部の挿入に支障がない程度にわずかに短かくするの
がよい。This means that when one side is about to be pulled out, the bent part that was folded in half during insertion is pulled into the hole, but in this case, the bent part is extended and the other part is folded. By being able to bend, the reaction forces from both sides will act to prevent it from being pulled out. The reason why the distance between the protrusions is set to be approximately equal to the outer diameter of the lead wire or twice the outer diameter is to enable insertion of the bent portion and to make it as difficult as possible to remove the lead wire after insertion. Note that if the lead wire has a relatively soft covering, it is preferable to take this into consideration and make the distance between the protrusions slightly short enough to not interfere with insertion of the bent portion.
〈実施例〉
第1実施例を第1図乃至第3図を用いて説明する。この
実施例は、第5図を用いて説明したと同じ電気製品に実
施したものであり、図には同じ部品及び部分を同じ符号
で示す。図において1は基板で、この基板1にリード線
3を保持する孔lOを穿設しである。<Example> A first example will be described using FIGS. 1 to 3. This embodiment is implemented in the same electrical product as described using FIG. 5, and the same parts and portions are indicated by the same reference numerals in the figure. In the figure, reference numeral 1 denotes a substrate, in which a hole 10 for holding a lead wire 3 is bored.
孔10は、電子部品番を位置させる切欠部2の両側に夫
々2個ずつ4個設けである。その孔10はひようたん形
のものであり、第3図に拡大して示すように、リード線
3の外径よシもわずかに大きい2つの円をわずかに重複
させた形であり、中間の幅の狭くなった部分はすなわち
内周面の相対向する突部11.11間の距離はリード線
3の外径寸法と等しくなるように拡大しである。図に示
す寸法a、b、cについて説明すると、寸法aがリード
線の直径に等しい寸法であり、寸法すが寸法aの1.1
倍、寸法Cが寸法aの2.2倍である。この寸法関係は
寸法すがaの1.05〜1.2倍、寸法Cがaの2.1
〜2.4倍くらいの範囲内で定めるのがよい0
この孔10を設け、た基板1に電子部品番を仮止めする
と第2図に示すようになる。すなわち、各リード線3の
適切な位置を2つ折りにして孔10に押し込めばよい。Four holes 10 are provided, two on each side of the notch 2 in which the electronic part number is located. The hole 10 is calabash-shaped, and as shown in the enlarged view in FIG. In other words, the distance between the opposing protrusions 11 and 11 on the inner circumferential surface is expanded to be equal to the outer diameter dimension of the lead wire 3. To explain the dimensions a, b, and c shown in the figure, dimension a is equal to the diameter of the lead wire, and the dimension is 1.1 of dimension a.
The dimension C is 2.2 times the dimension a. This dimensional relationship is that dimension S is 1.05 to 1.2 times a, and dimension C is 2.1 times a.
The hole 10 is preferably set within a range of about 2.4 times. If the hole 10 is provided and an electronic part number is temporarily attached to the board 1, the result will be as shown in FIG. That is, each lead wire 3 may be folded in half at an appropriate position and then pushed into the hole 10.
各リード線3が電子部品4・に近い位置を基板1に保持
されるから、電子部品番はその位置に仮止めされる。Since each lead wire 3 is held on the board 1 at a position close to the electronic component 4, the electronic component number is temporarily fixed at that position.
第2実施例を第4図を用いて説明する。図はリード線3
を2本まとめて保持する孔20を示す。この孔20は第
1実施例における両側の夫々2個の孔10を1つにまと
めて形成したもので一つ葉形となっている。この形状は
リード線3の外径よりも:bずかに大きい4個の円を同
一周上に配置して互いにわずかtて重複するようにした
形で、その相対向する突部21X 21間の寸法dをリ
ート線3の外径の2倍としである。図では突部22.2
2間も同様に拡大したものを示しであるが、これは一方
を拡大すればリード線を挿入可能であるから他方は省略
できる。A second embodiment will be explained using FIG. 4. The figure shows lead wire 3
A hole 20 for holding two pieces together is shown. This hole 20 is formed by combining the two holes 10 on both sides in the first embodiment into one, and has a monolobal shape. This shape has four circles slightly larger than the outer diameter of the lead wire 3 arranged on the same circumference and overlapping each other with a slight distance t, between the opposing protrusions 21X and 21. The dimension d is twice the outer diameter of the Riet wire 3. In the figure, the protrusion 22.2
The space between the two parts is shown enlarged in the same way, but since it is possible to insert a lead wire by enlarging one part, the other part can be omitted.
この孔20を第1図における夫々の側の2つの孔ユOに
代えて設け、夫々の側の2本のリード線3.3を平行に
揃えて折曲げて押し込めば、リード線3が2本ずつ保持
され、電子部品番が第1実施例と略同様に仮止めされる
。If this hole 20 is provided in place of the two holes O on each side in Fig. 1, and the two lead wires 3. Each book is held, and electronic part numbers are temporarily attached in substantially the same manner as in the first embodiment.
上記実施例はいずれも電子部品を仮止めするためにリー
ド線を保持するものであるが、場合によっては比較的長
いリード線の途中を保持して所定位置に拘束するために
適用してもよい。All of the above embodiments are for holding lead wires for temporarily fixing electronic components, but in some cases, the lead wires may be held in the middle of a relatively long lead wire to restrain it in a predetermined position. .
上記実施例における基板はプリント基板であるが、この
ほかに単なるプラスチックあるいは金属等の板であって
もよく、リード線の保持作用は殆ど変らない。Although the substrate in the above embodiment is a printed circuit board, it may also be a simple plate of plastic or metal, and the holding effect of the lead wires will hardly change.
く発明の効果〉
この発明によれば、基板にリード線保持孔を設けてリー
ド線を押し込むだけで保持するようにしたものであるか
ら、別に接着剤や半田を必要とせず、接着作業や半田付
作業よりも手間や時間のかからない簡単な作業で電子部
品を基板に仮止めできる。またリード線の弛るみ部分を
基板の適所に拘束することにも利用でき、その場合拘束
用部品を別に必要としない。Effects of the Invention According to the present invention, since lead wire holding holes are provided in the board and the lead wires are held by simply pushing them in, no adhesive or solder is required, and no bonding work or soldering is required. Electronic components can be temporarily attached to a board with a simple process that requires less effort and time than mounting. It can also be used to restrain the slack portion of the lead wire in a proper position on the board, in which case no separate restraining part is required.
第1図はこの発明の第1実施例の基板の部分拡大平面図
、第2図は同実施例の基板に電子部品を仮止めした状態
を示す部分正面図、第3図は同実施例の孔10の拡大平
面図、第4図は第2実施例の孔20の拡大平面図、第5
図は従来の電気製品の主要部のみの分解図であり (a
)はケース部品、(b)はリード線付電子部品、(C)
は基板、(d)はケース部品を夫々示す斜視図である。
1・・・基板、3・・・リード線、4・・・電子部品、
10・・・・・・孔(ひようたん形)、20・・・孔(
四つ葉形)。
才/I¥1
/U
才2図
才3図 才4図FIG. 1 is a partial enlarged plan view of a board according to a first embodiment of the present invention, FIG. 2 is a partial front view showing a state in which electronic components are temporarily fixed to the board of the same embodiment, and FIG. 3 is a partial front view of a board of the same embodiment. FIG. 4 is an enlarged plan view of the hole 10, and FIG. 4 is an enlarged plan view of the hole 20 of the second embodiment.
The figure is an exploded view of only the main parts of a conventional electrical product (a
) is a case part, (b) is an electronic component with lead wire, (C) is
FIG. 3 is a perspective view showing a board, and FIG. 3(d) is a perspective view showing a case component. 1... Board, 3... Lead wire, 4... Electronic component,
10... Hole (gourd shape), 20... Hole (
quatrefoil). Age/I¥1/U Age 2 Figure Age 3 Figure Age 4
Claims (1)
に大きい円孔が2個でひようたん形に連続するように又
は4個で四つ葉形に連続するように所定の基板に穿設さ
れかつその孔の内周で相対向する突部間の距離を前記ひ
ようたん形の孔にあつては前記所定外径にまた前記四つ
葉形の孔にあつては前記所定外径の2倍に略等しくなる
ように拡大形成されているリード線保持孔付基板。(1) Two circular holes that are slightly larger than the cross-sectional dimension of the covered lead wire with a predetermined outer diameter are connected in a gourd shape, or four holes are connected in a quatrefoil shape on a predetermined board. The distance between the protrusions that are bored and facing each other on the inner periphery of the hole is set to the predetermined outer diameter in the case of the gourd-shaped hole, and the distance outside the predetermined diameter in the case of the quatrefoil-shaped hole. A board with a lead wire holding hole that is enlarged to be approximately twice the diameter.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61242765A JPH0646676B2 (en) | 1986-10-13 | 1986-10-13 | Substrate with lead wire holding hole |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61242765A JPH0646676B2 (en) | 1986-10-13 | 1986-10-13 | Substrate with lead wire holding hole |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6396992A true JPS6396992A (en) | 1988-04-27 |
JPH0646676B2 JPH0646676B2 (en) | 1994-06-15 |
Family
ID=17093941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61242765A Expired - Lifetime JPH0646676B2 (en) | 1986-10-13 | 1986-10-13 | Substrate with lead wire holding hole |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0646676B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005064082A (en) * | 2003-08-08 | 2005-03-10 | Funai Electric Co Ltd | Noise absorber |
JP2007318825A (en) * | 2006-05-23 | 2007-12-06 | Yazaki Corp | Electronic apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55149993U (en) * | 1979-04-16 | 1980-10-29 | ||
JPS5643027U (en) * | 1979-09-11 | 1981-04-20 | ||
JPS5744587U (en) * | 1980-08-27 | 1982-03-11 |
-
1986
- 1986-10-13 JP JP61242765A patent/JPH0646676B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55149993U (en) * | 1979-04-16 | 1980-10-29 | ||
JPS5643027U (en) * | 1979-09-11 | 1981-04-20 | ||
JPS5744587U (en) * | 1980-08-27 | 1982-03-11 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005064082A (en) * | 2003-08-08 | 2005-03-10 | Funai Electric Co Ltd | Noise absorber |
JP2007318825A (en) * | 2006-05-23 | 2007-12-06 | Yazaki Corp | Electronic apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPH0646676B2 (en) | 1994-06-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4449769A (en) | Substrate for mounting electric parts | |
JPS6396992A (en) | Board with hole for holding lead wire | |
US4741472A (en) | Method of soldering an integrated circuit and printed circuit board | |
JPS58188684U (en) | electronic display device | |
JPS63227096A (en) | Shielding device of flexible printed wiring | |
JPS60107896A (en) | Printed board unit | |
JPS5963489U (en) | Printed circuit board fixing device | |
JP2696305B2 (en) | Connector mounting device | |
JPS6045465U (en) | Printed circuit board connection structure | |
JPH0218525Y2 (en) | ||
JPS5847805U (en) | Optical fiber holding member | |
JPS59171393U (en) | Equipment for attaching parts to printed circuit boards | |
JPS58144854U (en) | small electronic components | |
JPS6013770U (en) | printed wiring board | |
JPH08306741A (en) | Film carrier for tab and its production | |
JPH09237701A (en) | Surface mount type electronic element | |
JPS6078172U (en) | Flexible board connection structure | |
JPS59119057U (en) | Flexible circuit board for electronic component mounting | |
JPH0611119U (en) | Optical pickup device | |
JPS58195467U (en) | Structure of printed circuit board | |
JPS60140785A (en) | Mounting structure for hybrid ic | |
JPS6313A (en) | Manufacture of taping part run | |
JPS60153542U (en) | semiconductor package | |
JPS5911450U (en) | Mounting board for integrated circuit elements | |
JPH02125489A (en) | Substrate for hybrid integrated circuit |