JPS6393646U - - Google Patents
Info
- Publication number
- JPS6393646U JPS6393646U JP18936286U JP18936286U JPS6393646U JP S6393646 U JPS6393646 U JP S6393646U JP 18936286 U JP18936286 U JP 18936286U JP 18936286 U JP18936286 U JP 18936286U JP S6393646 U JPS6393646 U JP S6393646U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor pellet
- semiconductor
- molded
- covered
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Description
第１図は本考案に係る半導体装置の部分平面図
、第２図は従来の半導体装置の部分平面図である
。
１６…半導体ペレツト、１８，１８…端子、２
０…Ｃｕ配線、２２…外装樹脂材。
FIG. 1 is a partial plan view of a semiconductor device according to the present invention, and FIG. 2 is a partial plan view of a conventional semiconductor device. 16... Semiconductor pellet, 18, 18... Terminal, 2
0...Cu wiring, 22...Exterior resin material.
Claims (1)
モールド被覆したものにおいて、上記半導体ペレ
ツトの回路の一部を基板上に設けたことを特徴と
する半導体装置。 1. A semiconductor device in which a main part including a semiconductor pellet is molded and covered with an exterior resin, wherein a part of the circuit of the semiconductor pellet is provided on a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18936286U JPS6393646U (en) | 1986-12-08 | 1986-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18936286U JPS6393646U (en) | 1986-12-08 | 1986-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6393646U true JPS6393646U (en) | 1988-06-17 |
Family
ID=31141593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18936286U Pending JPS6393646U (en) | 1986-12-08 | 1986-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6393646U (en) |
-
1986
- 1986-12-08 JP JP18936286U patent/JPS6393646U/ja active Pending