JPS6392498A - Case for ic card - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an IC card case that protects the IC card from electrostatic interference and electromagnetic interference.

(Prior Art) Recently, cards incorporating small electronic circuits such as ICs have been developed.

Incidentally, ICs are susceptible to failures such as destruction and deterioration caused by static electricity. Moreover, the ISO standard that defines the standards for plastic cards requires the thickness of the card to be 0.
Since it is specified as 76m11, the electrostatic withstand voltage of the IC that can be built into the card is at most 200v to 1kV.
It's just a matter of degree.

On the other hand, the voltage of static electricity generated under the conditions in which plastic cards are used on a daily basis is as high as 10kV to 30kV, and IC cards have traditionally been subject to interference due to static electricity and noise from other electrical equipment. It was necessary to avoid electromagnetic interference due to

In order to avoid these problems, IC card cases were made from conductive synthetic resin plates and metal plates, but these plates were grounded to eliminate static electricity, so it was not possible to prevent static electricity. The effect was slow, and the metal plate was not suitable as it could cause sparks and destroy the IC circuit.Also, due to its hardness, it could not be used as a conventional bill holder or business card holder. It was difficult to carry.

(Problems to be Solved by the Invention) The present invention has excellent anti-static effects and electromagnetic shielding effects, and is easy to carry without the risk of sparking.
The purpose is to obtain a case for C cards.

(Means for Solving the Problems) The present invention is an IC card case in which at least the front side and the back side of the IC card are covered with an inner layer material processed by metal.

The base fabric constituting the inner layer material is suitably a woven fabric, a knitted fabric, a nonwoven fabric, a spunbond fabric, or the like. The fibers forming the fabric may be any synthetic fibers such as polyester, polyamide, polyacrylic, Promix, polypropylene, etc.

Furthermore, surface-porous synthetic fibers are preferred from the viewpoint of metal retention. The thickness of the fibers is not particularly limited, and is preferably a multifilament yarn of 10 to 1,000 deniers, and more preferably a thin multifilament yarn of 30 to 200 deniers in order to increase the amount of metal applied. Moreover, a single yarn denier of 0.01 to 30 denier is preferable. Moreover, in the case of a monofilament, 5 to 2000 deniers are preferable. Furthermore, when the fabric is a woven or knitted fabric, any woven or knitted structure may be used. Since the antistatic effect and the electromagnetic shielding effect are proportional to the amount of metal applied, the larger the basis weight is, the more preferable it is, and the more preferably the area weight is 30 to 500 g/WF.

If the fabric weight is 30g/♂ ungrooved, the amount of metal applied will be small, reducing the antistatic effect and electromagnetic shielding effect.If the fabric weight exceeds 500g/Tlll1l, the fabric will be too thick and the case will be fabricated. When used as a composite material by adhering it to an outer layer material, processing to form a composite material becomes difficult. The obtained base fabric is subjected to metal processing. Metal processing can be done by any method, such as electroless plating, copper sulfide application, sputtering, vapor deposition coating, or lamination, but these methods have a strong antistatic effect and electromagnetic shielding effect, and a uniform and homogeneous film can be obtained. In addition, electroless plating and copper sulfide application processing are preferable because direct metal processing is easily possible and an inner layer material with performance suitable for the purpose can be obtained by selecting processing conditions. There are no particular limitations on the plating bath for electroless metal plating, but
It is preferable to use nickel or copper due to economic considerations, and it is usually most preferable to use a nickel-hypophosphorous acid electroless plating bath, which has a fast plating rate. In the case of electroless plating, the process may be a commonly performed process. For example, the steps include scouring, etching, sensitization, activation, and plating. In addition, in the case of copper sulfide application processing, there is a method in which copper ions are impregnated and treated with hydrogen sulfide or an aqueous solution of a water-soluble sulfide to precipitate copper sulfide.

The metal-processed inner layer material prevents the metal from peeling off.
Resin coating or film lamination may be applied.

The inner layer material obtained as described above may be used alone to form a case, or may be laminated with an outer layer material to form a case as a composite material. The outer layer material is preferably leather, synthetic leather, fabric, paper, film, soft plastic sheet, urethane foam, etc. In the case of film or soft plastic sheet, antistatic properties are required to increase the antistatic effect and electromagnetic shielding effect. , conductivity may be imparted. The means for joining the inner layer material and the outer layer material may be any means such as adhesion, sewing, or fusion. When adhering, any adhesive may be used, and the entire surface may be bonded or a portion may be bonded. The composite material may be a two-layer composite of an inner layer material and an outer layer material, a two-layer composite material with an outer layer material placed on both sides of the inner layer material, or a multilayer composite material with two or more layers each of the inner layer material and the outer layer material. Composite materials, three-layer composite materials, or multi-layer composite materials may be partially mixed. The shape of the case 1 may be, for example, one in which an opening for inserting a magnetic card is provided on one of the peripheral edges as shown in FIG. 1, or a pass-through type as shown in FIG. Well, the shape can be any shape.

In short, if the IC card has a shape that is covered with an inner layer material,
It can be of any shape.

(Example) Example 1 Woven with microporous polyester multifilament yarn 50 denier 36 filaments arranged in the warp and polyester multifilament yarn 75 denier 72 filament arranged in the weft. A 471 satin fabric with a two-density warp of 317 pieces/inch and weft of 106 pieces/inch was obtained, and this fabric was used as a base fabric for the inner layer material.

The fabric at this time was 115 g/-F. After the base fabric was subjected to a normal scouring treatment, it was treated with a 20% by weight aqueous sodium hydroxide solution (liquid temperature 90°C) for 5 minutes, and after washing with water, it was treated with a 5% by weight stannous chloride-hydrochloric acid solution (liquid temperature). l!;
150°C) for 2 minutes, then immersed in an activation bath (bath temperature 50'C) of an aqueous solution containing 0.2% palladium chloride as 29°C for 2 minutes, followed by washing with water, The material was immersed in a nickel-hypophosphite electroless plating bath at 80° C. for 1 minute, washed with water, and dried to obtain an inner layer material.

Table 1 shows the results of evaluating the electromagnetic shielding effect of the inner layer material according to ASTM-1981 and the dual chamber method. Further, the inner layer material exhibited a specific resistance of 5×10 −′Ω·ba and had excellent electrical conductivity.

Table 1 Leather was laminated on one side of the obtained inner layer material, and the periphery was sewn to form a composite material. Using the composite material, a commuter pass type IC card case shown in FIG. 2 was created. The resulting IC card case has excellent antistatic properties and electromagnetic wave shielding effects, is easy to carry like a commuter pass holder, and has no risk of sparks.
It was a safe IC card case.

Example 2 A polyacrylonitrile fiber of 3 denier and a cut length of 89-i was subjected to the following treatment.

Scouring: Immersed in 2gIQ surfactant aqueous solution and heated to 70℃
Process for 20 minutes.

Copper ion impregnation, sulfurization treatment: Immerse in 6 g/Q cupric sulfate aqueous solution to impregnate copper ions into the fiber, add 3 g/Q sodium thiosulfate and 3 g/(! The temperature was gradually raised to 75° C. over a period of minutes, and then treated at this temperature for 60 minutes.

Soaping: 50~ in 3g/12 surfactant aqueous solution
After washing with hot water for 10 minutes at 60°C and further washing with water, it was centrifugally dehydrated and dried.

The obtained fibers were made into curd seaweed, laminated and needle punched to obtain a nonwoven fabric with a thickness of 1.2 mm and a basis weight of 200 g/♂, which was used as an inner layer material. The electromagnetic shielding effect of the inner layer material was evaluated in the same manner as in Example 1, and the results are shown in Table 2.

Table 2 Using the obtained inner layer material, a commuter pass type IC card case similar to that in Example 1 was made. The resulting IC card case has excellent anti-static properties and electromagnetic wave shielding effects, is easy to carry like a commuter pass holder, and has no risk of sparks or sparks, making it a safe IC card case.
It was a card case.

(Effects) The IC card case of the present invention has excellent anti-static effect and electromagnetic wave shielding effect, has no risk of sparking, and is easy to carry.

[Brief explanation of the drawing]

FIG. 1 and FIG. 2 each show an embodiment of the IC card case of the present invention. 1・・・・・・・・・ Case

Claims (4)

[Claims] (1) An IC card case characterized in that at least the front side and the back side of the IC card are covered with metal-processed inner layer material. (2) The IC card case according to claim 1, wherein the metal processing is electroless plating. (3) The IC card case according to claim 1, wherein the metal processing is copper sulfide application processing. (4) Claim 1 in which the base fabric of the inner layer material is fabric
2. The IC card case described in Section 2, Section 2, and Section 3.